JP2019091856A - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JP2019091856A JP2019091856A JP2017221126A JP2017221126A JP2019091856A JP 2019091856 A JP2019091856 A JP 2019091856A JP 2017221126 A JP2017221126 A JP 2017221126A JP 2017221126 A JP2017221126 A JP 2017221126A JP 2019091856 A JP2019091856 A JP 2019091856A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
(2)本発明に係る別の一つの態様は、正面に開口を有し、内側に基板を支持する支持部と、支持部よりも背面壁側に位置する基板受け部とが形成された容器本体と、前記基板を押さえる基板押さえ部が形成された押さえ部材を有する蓋体と、を備える基板収納容器であって、前記基板収納容器は、前記蓋体を前記容器本体に取り付けたときには、前記基板押さえ部と、前記基板受け部とによって前記基板を前記支持部から持ち上げて支持し、前記蓋体を前記容器本体から取り外したときには、前記基板を前記支持部によって支持するものであり、前記基板受け部及び前記基板押さえ部は、前記基板との接触部に作用する前後方向の押圧力に対して、前記接触部における法線方向の反力成分が、前記接触部における接線方向の反力成分よりも大きくなる位置に存在するものである。ただし、蓋体と容器本体の背面壁とを結ぶ方向を前後方向とする。
(3)上記(1)又は(2)の態様において、前記基板押さえ部は、前記蓋体を正面に見て、前記容器本体の中心から左右方向に0°以上30°以下の範囲に存在してもよい。
(4)上記(1)から(3)までのいずれか一つの態様において、前記基板受け部は、前記背面壁を正面に見て、前記容器本体の中心から左右方向に20°以上30°以下の範囲に存在してもよい。
(5)上記(1)から(4)までのいずれか一つの態様において、前記基板は、直径が300mmであってもよい。
まず、基板収納容器1について説明する。図1は、基板収納容器1を示す分解概略斜視図である。図2Aは、蓋体20を取り付けたときの基板収納容器1を示す(a)正面図、(b)平面図、(c)A−A断面図であり、図2Bは、蓋体20を取り付けたときの基板収納容器1を示す(d)B−B断面図、(e)G部の拡大断面図、(f)H部の拡大断面図、(g)I部の拡大断面図である。なお、図1において、基板Wの面を水平方向に収納した基板収納容器1を蓋体20側から見たときの、左右方向をX軸方向、上下方向をZ軸方向、蓋体20と背面壁10bとを結ぶ前後方向をY軸方向とする。以降の図においても、必要に応じてX軸、Y軸、Z軸を示す。
図4において、基板受け部13と基板押さえ部210とが、相対向する位置に配設されている。
図5は、第2実施形態の基板収納容器1Aにおける基板Wの支持状態を示す水平断面図である。
第2実施形態の基板収納容器1Aでは、蓋体20A、押さえ部材21A、基板押さえ部210A及びアーム220Aの形状が第1実施形態とは異なっており、その他の部分は、第1実施形態と同様である。
上記各実施形態では、基板受け部13及び基板押さえ部210,210Aの位置を、具体的な寸法及び角度で定義したが、基板Wに作用する押圧力(又は反力)で定義することもできる。例えば、蓋体20を容器本体10に取り付けたときに発生する、基板Wを押す押圧力がY軸方向に沿う方向に作用すると仮定したときに、基板受け部13(の基板Wとの接触部)における基板Wを押し返す法線方向の反力成分CDが、接触部の接線方向の反力成分よりも大きく、より好ましくは押圧力の0.43倍以上(左右2か所で受ける場合)となる位置に基板受け部13が存在するとよい。また、基板押さえ部210,210Aについても、基板受け部13と同様である。このように、基板受け部13における基板Wを押し返す法線方向の反力成分CDが、接線方向の反力成分よりも大きいと、基板Wのお押圧力が加わったとしても、基板Wが回転するようなことが起こらない。
10 容器本体、10a 開口枠、10b 背面壁、右側壁 10c、左側壁 10d、天面壁 10e、底面壁10f、11 開口、12 支持部、13 基板受け部
20,20A 蓋体、21,21A 押さえ部材、210,210A 基板押さえ部
W 基板
CD 基板を押し返す法線方向の反力成分
Claims (5)
- 正面に開口を有し、内側に基板を支持する支持部と、支持部よりも背面壁側に位置する基板受け部とが形成された容器本体と、
前記基板を押さえる基板押さえ部が形成された押さえ部材を有する蓋体と、を備える基板収納容器であって、
前記基板収納容器は、前記蓋体を前記容器本体に取り付けたときには、前記基板押さえ部と、前記基板受け部とによって前記基板を前記支持部から持ち上げて支持し、前記蓋体を前記容器本体から取り外したときには、前記基板を前記支持部によって支持するものであり、
前記基板受け部及び前記基板押さえ部は、前記蓋体を正面に見て、前記容器本体の中心を通る上下方向の中心線から左右方向に0mm以上80mm以下の範囲に存在する
ことを特徴とする基板収納容器。
ただし、基板が基板収納容器に収納された状態での基板の中心に相当する位置を容器本体の中心とする。 - 正面に開口を有し、内側に基板を支持する支持部と、支持部よりも背面壁側に位置する基板受け部とが形成された容器本体と、
前記基板を押さえる基板押さえ部が形成された押さえ部材を有する蓋体と、を備える基板収納容器であって、
前記基板収納容器は、前記蓋体を前記容器本体に取り付けたときには、前記基板押さえ部と、前記基板受け部とによって前記基板を前記支持部から持ち上げて支持し、前記蓋体を前記容器本体から取り外したときには、前記基板を前記支持部によって支持するものであり、
前記基板受け部及び前記基板押さえ部は、前記基板との接触部に作用する前後方向の押圧力に対して、前記接触部における法線方向の反力成分が、前記接触部における接線方向の反力成分よりも大きくなる位置に存在する
ことを特徴とする基板収納容器。
ただし、蓋体と容器本体の背面壁とを結ぶ方向を前後方向とする。 - 前記基板押さえ部は、前記蓋体を正面に見て、前記容器本体の中心から左右方向に0°以上30°以下の範囲に存在する
ことを特徴とする請求項1又は2に記載の基板収納容器。 - 前記基板受け部は、前記背面壁を正面に見て、前記容器本体の中心から左右方向に20°以上30°以下の範囲に存在する
ことを特徴とする請求項1から3までのいずれか1項に記載の基板収納容器。 - 前記基板は、直径が300mmである
ことを特徴とする請求項1から4までのいずれか1項に記載の基板収納容器。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017221126A JP6992240B2 (ja) | 2017-11-16 | 2017-11-16 | 基板収納容器 |
US16/763,990 US11735449B2 (en) | 2017-11-16 | 2018-10-01 | Substrate storage container |
CN201880066595.7A CN111213228A (zh) | 2017-11-16 | 2018-10-01 | 基板收纳容器 |
KR1020207016760A KR102635149B1 (ko) | 2017-11-16 | 2018-10-01 | 기판 수납 용기 |
DE112018005884.0T DE112018005884T5 (de) | 2017-11-16 | 2018-10-01 | Substrataufbewahrungsbehälter |
PCT/JP2018/036714 WO2019097862A1 (ja) | 2017-11-16 | 2018-10-01 | 基板収納容器 |
SG11202004010WA SG11202004010WA (en) | 2017-11-16 | 2018-10-01 | Substrate storage container |
TW107138946A TWI783076B (zh) | 2017-11-16 | 2018-11-02 | 基板收納容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017221126A JP6992240B2 (ja) | 2017-11-16 | 2017-11-16 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019091856A true JP2019091856A (ja) | 2019-06-13 |
JP6992240B2 JP6992240B2 (ja) | 2022-01-13 |
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ID=66538667
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Application Number | Title | Priority Date | Filing Date |
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JP2017221126A Active JP6992240B2 (ja) | 2017-11-16 | 2017-11-16 | 基板収納容器 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11735449B2 (ja) |
JP (1) | JP6992240B2 (ja) |
KR (1) | KR102635149B1 (ja) |
CN (1) | CN111213228A (ja) |
DE (1) | DE112018005884T5 (ja) |
SG (1) | SG11202004010WA (ja) |
TW (1) | TWI783076B (ja) |
WO (1) | WO2019097862A1 (ja) |
Citations (7)
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JP2011060994A (ja) * | 2009-09-10 | 2011-03-24 | Shin Etsu Polymer Co Ltd | 基板収納容器及び基板の取り扱い方法 |
WO2011052998A2 (ko) * | 2009-10-28 | 2011-05-05 | Park Jong Ik | 기판 수납 용기 |
WO2011132257A1 (ja) * | 2010-04-20 | 2011-10-27 | ミライアル株式会社 | 基板収納容器 |
WO2011148450A1 (ja) * | 2010-05-24 | 2011-12-01 | ミライアル株式会社 | 基板収納容器 |
JP2011253960A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
WO2014080454A1 (ja) * | 2012-11-20 | 2014-05-30 | ミライアル株式会社 | 基板収納容器 |
JP2017527997A (ja) * | 2014-08-28 | 2017-09-21 | インテグリス・インコーポレーテッド | 基板容器 |
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-
2017
- 2017-11-16 JP JP2017221126A patent/JP6992240B2/ja active Active
-
2018
- 2018-10-01 DE DE112018005884.0T patent/DE112018005884T5/de not_active Withdrawn
- 2018-10-01 SG SG11202004010WA patent/SG11202004010WA/en unknown
- 2018-10-01 WO PCT/JP2018/036714 patent/WO2019097862A1/ja active Application Filing
- 2018-10-01 KR KR1020207016760A patent/KR102635149B1/ko active IP Right Grant
- 2018-10-01 US US16/763,990 patent/US11735449B2/en active Active
- 2018-10-01 CN CN201880066595.7A patent/CN111213228A/zh active Pending
- 2018-11-02 TW TW107138946A patent/TWI783076B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011060994A (ja) * | 2009-09-10 | 2011-03-24 | Shin Etsu Polymer Co Ltd | 基板収納容器及び基板の取り扱い方法 |
WO2011052998A2 (ko) * | 2009-10-28 | 2011-05-05 | Park Jong Ik | 기판 수납 용기 |
WO2011132257A1 (ja) * | 2010-04-20 | 2011-10-27 | ミライアル株式会社 | 基板収納容器 |
WO2011148450A1 (ja) * | 2010-05-24 | 2011-12-01 | ミライアル株式会社 | 基板収納容器 |
JP2011253960A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
WO2014080454A1 (ja) * | 2012-11-20 | 2014-05-30 | ミライアル株式会社 | 基板収納容器 |
JP2017527997A (ja) * | 2014-08-28 | 2017-09-21 | インテグリス・インコーポレーテッド | 基板容器 |
Also Published As
Publication number | Publication date |
---|---|
KR20200085328A (ko) | 2020-07-14 |
TW201923946A (zh) | 2019-06-16 |
WO2019097862A1 (ja) | 2019-05-23 |
US11735449B2 (en) | 2023-08-22 |
KR102635149B1 (ko) | 2024-02-13 |
SG11202004010WA (en) | 2020-05-28 |
DE112018005884T5 (de) | 2020-07-23 |
TWI783076B (zh) | 2022-11-11 |
JP6992240B2 (ja) | 2022-01-13 |
US20200286761A1 (en) | 2020-09-10 |
CN111213228A (zh) | 2020-05-29 |
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