JP6538337B2 - 樹脂組成物及びその製造方法 - Google Patents

樹脂組成物及びその製造方法 Download PDF

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Publication number
JP6538337B2
JP6538337B2 JP2014247526A JP2014247526A JP6538337B2 JP 6538337 B2 JP6538337 B2 JP 6538337B2 JP 2014247526 A JP2014247526 A JP 2014247526A JP 2014247526 A JP2014247526 A JP 2014247526A JP 6538337 B2 JP6538337 B2 JP 6538337B2
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boron nitride
hexagonal boron
nitride powder
maximum peak
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JP2014247526A
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Japanese (ja)
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JP2016108457A (ja
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陽一郎 坂口
陽一郎 坂口
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Showa Denko KK
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Showa Denko KK
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Priority to JP2014247526A priority Critical patent/JP6538337B2/ja
Priority to PCT/JP2015/005432 priority patent/WO2016092734A1/en
Priority to TW104137014A priority patent/TW201634547A/zh
Publication of JP2016108457A publication Critical patent/JP2016108457A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014247526A 2014-12-08 2014-12-08 樹脂組成物及びその製造方法 Active JP6538337B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014247526A JP6538337B2 (ja) 2014-12-08 2014-12-08 樹脂組成物及びその製造方法
PCT/JP2015/005432 WO2016092734A1 (en) 2014-12-08 2015-10-28 Resin composition and preparation process thereof
TW104137014A TW201634547A (zh) 2014-12-08 2015-11-10 樹脂組成物及其製備方法

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JP2014247526A JP6538337B2 (ja) 2014-12-08 2014-12-08 樹脂組成物及びその製造方法

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JP2016108457A JP2016108457A (ja) 2016-06-20
JP6538337B2 true JP6538337B2 (ja) 2019-07-03

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JP (1) JP6538337B2 (zh)
TW (1) TW201634547A (zh)
WO (1) WO2016092734A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6822836B2 (ja) 2016-12-28 2021-01-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP6414260B2 (ja) 2017-03-23 2018-10-31 三菱マテリアル株式会社 放熱回路基板
JP7104503B2 (ja) * 2017-10-13 2022-07-21 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
JP7069485B2 (ja) * 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
KR102705102B1 (ko) * 2018-02-26 2024-09-09 덴카 주식회사 절연 방열 시트
JP7257104B2 (ja) * 2018-03-01 2023-04-13 積水化学工業株式会社 積層体
US11198263B2 (en) * 2018-03-22 2021-12-14 Rogers Corporation Melt processable thermoplastic composite comprising a multimodal dielectric filler
JP7069967B2 (ja) * 2018-03-29 2022-05-18 Tdk株式会社 放熱基板
WO2019189182A1 (ja) * 2018-03-29 2019-10-03 Jnc株式会社 熱伝導性複合フィラーとこれを含む放熱性樹脂組成物、該放熱性樹脂組成物からなる放熱性グリース及び放熱部材
JP7476482B2 (ja) * 2019-04-01 2024-05-01 住友ベークライト株式会社 熱伝導性シート
CN111423699B (zh) * 2020-05-12 2022-11-11 河北工业大学 高填充量六方氮化硼/聚合物块状复合材料的制备方法
JPWO2022118873A1 (zh) 2020-12-04 2022-06-09
EP4257545A4 (en) * 2021-01-06 2024-06-26 Denka Company Limited AGGREGATED BORON NITRIDE PARTICLES, BORON NITRIDE POWDER, HEAT-CONDUCTING RESIN COMPOSITION AND HEAT DISSIPATION FILM
WO2022149553A1 (ja) * 2021-01-06 2022-07-14 デンカ株式会社 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート
WO2022264327A1 (ja) * 2021-06-16 2022-12-22 デンカ株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びに化粧料及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898009A (en) * 1996-03-19 1999-04-27 Advanced Ceramics Corporation High density agglomerated boron nitride particles
JP4889110B2 (ja) 2007-02-05 2012-03-07 日東電工株式会社 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
WO2009041300A1 (ja) * 2007-09-26 2009-04-02 Mitsubishi Electric Corporation 熱伝導性シート及びパワーモジュール
JP5208060B2 (ja) * 2009-06-26 2013-06-12 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール
US8921458B2 (en) * 2010-08-26 2014-12-30 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
CN103459149B (zh) 2011-03-28 2015-08-26 日立化成株式会社 多层树脂片、树脂片叠层体、多层树脂片固化物及其制造方法、带有金属箔的多层树脂片、以及半导体装置
EP3269682B1 (en) * 2011-11-29 2020-01-01 Mitsubishi Chemical Corporation Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
CN105308125B (zh) * 2013-06-14 2017-12-19 三菱电机株式会社 热固性树脂组合物、导热性片材的制造方法及电源模块

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TW201634547A (zh) 2016-10-01
WO2016092734A1 (en) 2016-06-16
JP2016108457A (ja) 2016-06-20

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