JP6527640B2 - キャリア超薄型基板 - Google Patents
キャリア超薄型基板 Download PDFInfo
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- JP6527640B2 JP6527640B2 JP2018521658A JP2018521658A JP6527640B2 JP 6527640 B2 JP6527640 B2 JP 6527640B2 JP 2018521658 A JP2018521658 A JP 2018521658A JP 2018521658 A JP2018521658 A JP 2018521658A JP 6527640 B2 JP6527640 B2 JP 6527640B2
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Description
次に、キャリア基板401及び犠牲層413の上方に、及び両表面エリア202、204の直接上に、キャップ層414が形成され得る。一実施形態において、キャップ層414が積層される。
キャリア基板401は、プリプレグ、ガラス、金属(例えばステンレス鋼)などを含む様々な材料であり得る。一実施形態において、キャリア基板401は、金属キャリアであり、任意選択的に固着防止表面コーティングを有し得る。一実施形態において、キャリア基板401の周辺部エリアは、第1表面エリア402に対しジェットブラスト、レーザエッチング、又は化学エッチングなどの好適なプロセスを用いて、粗面化される。次に、真空積層などの好適な技術を用いて、キャリア基板401の表面エリア402、404の上方に、キャップ層414が形成される。
Claims (19)
- キャリア基板上に剥離層を形成することであって、前記剥離層は前記キャリア基板上に第1表面エリア及び第2表面エリアを含み、前記第1表面エリアは前記第2表面エリアを囲み、前記第1表面エリアは前記第2表面エリアよりも前記キャリア基板に対する接着性が高い、ことと、
前記剥離層上に、前記剥離層の前記第1表面エリア及び前記第2表面エリアにわたるビルドアップ構造体を形成することであって、前記ビルドアップ構造体は、厚さ100μm未満であり、前記ビルドアップ構造体の底面は、接地ルーティングを含む、ことと、
前記ビルドアップ構造体に対し支持基板を、前記キャリア基板の反対側に取り付けることと、
前記ビルドアップ構造体、前記剥離層の前記第2表面エリア、及び前記キャリア基板を通して切断することと、
前記キャリア基板を前記ビルドアップ構造体から取り外すことと、
を含む、コアレス基板を形成する方法。 - 前記剥離層を少なくとも部分的に除去した後に、前記支持基板及び前記ビルドアップ構造体を複数のパネルに切り分けることを更に含む、請求項1に記載の方法。
- 前記剥離層を形成することは、
前記キャリア基板上に金属箔を配置することと、
前記キャリア基板上の前記金属箔の上方及び側方周りにキャップ層を積層することと、
を含む、請求項1に記載の方法。 - 前記剥離層の前記第2表面エリアを通して切断することは、前記金属箔を通して切断することを含む、請求項3に記載の方法。
- 前記剥離層を形成することは、
キャリアコアの側縁周りの金属層の一部を除去することと、
前記キャリアコア上の前記金属層の上方及び側方周りにキャップ層を形成することと、
を含み、前記剥離層の前記第2表面エリアを通して切断することは、前記金属層を通して切断することを含む、請求項1に記載の方法。 - 前記剥離層を形成することは、
前記キャリア基板の一部エリアを粗面化することと、
前記キャリア基板の前記粗面化エリア及び前記キャリア基板の非粗面化エリアの上方にキャップ層を形成することと、
を含み、
前記剥離層の前記第2表面エリアを通して切断することは、前記キャリア基板の前記非粗面化エリアの上方の前記キャップ層を通して切断することを含む、請求項1に記載の方法。 - 前記剥離層を形成することは、短絡層を形成することを含み、
前記ビルドアップ構造体に前記支持基板を取り付けることは、前記短絡層と共に電気的に短絡される複数のBGAボンドパッドを含む前記ビルドアップ構造体のBGA側に、前記支持基板を取り付けることを含む、請求項1に記載の方法。 - 前記剥離層を少なくとも部分的に除去することは、複数の表面実装ボンドパッドを露出するように、前記短絡層を除去することを含む、請求項7に記載の方法。
- 短絡層を前記剥離層上に形成することを更に含み、
前記剥離層上に前記ビルドアップ構造体を形成することは、前記短絡層上に前記ビルドアップ構造体を形成することを含み、
前記ビルドアップ構造体に前記支持基板を取り付けることは、前記短絡層と共に電気的に短絡される複数のボンドパッドを含む前記ビルドアップ構造体のBGA側に、前記支持基板を取り付けることを含む、請求項1に記載の方法。 - 前記剥離層を少なくとも部分的に除去した後に、複数の表面実装ボンドパッドを露出するように前記短絡層を除去することを更に含む、請求項9に記載の方法。
- 短絡層をキャリア基板上に形成することと、
ビルドアップ構造体を前記短絡層上に形成することであって、前記ビルドアップ構造体は、前記ビルドアップ構造体の背面側の前記短絡層を通して互いに短絡される複数のコンタクトパッドを前記ビルドアップ構造体の前面側に含み、前記ビルドアップ構造体は、厚さ100μm未満であり、前記ビルドアップ構造体の底面は、接地ルーティングを含む、ことと、
支持基板を前記ビルドアップ構造体の前記前面側に取り付けることと、
前記キャリア基板を取り外すことと、
前記短絡層を除去することと、
前記ビルドアップ構造体の前記背面側で第2の複数のコンタクトパッドを露出することと、
を含む、コアレス基板を形成する方法。 - 前記第2の複数のコンタクトパッドを露出した後に、前記支持基板及び前記ビルドアップ構造体を複数の基板ストリップに切り分けることを更に含む、請求項11に記載の方法。
- 前記短絡層を形成することは、
前記キャリア基板上に金属箔を配置することと、
前記キャリア基板上の前記金属箔の上方及び側方周りにキャップ層を積層することと、
を含む、請求項11に記載の方法。 - 前記キャリア基板を取り外す前に、前記金属箔、前記キャップ層、前記ビルドアップ構造体、及び前記支持基板を通して切断することを更に含む、請求項13に記載の方法。
- 前記短絡層を形成することは、
前記キャリア基板上にキャップ層を形成することと、
前記キャップ層上にシード層を形成することと、
を含む、請求項11に記載の方法。 - 前記キャリア基板を取り外す前に、前記キャップ層、前記シード層、前記ビルドアップ構造体、及び前記支持基板を通して切断することを更に含む、請求項15に記載の方法。
- 前記支持基板を前記ビルドアップ構造体の前記前面側に取り付ける前に、電気的開口を検出するために前記複数のコンタクトパッドに対し試験を行うことと、
前記ビルドアップ構造体の前記背面側で前記第2の複数のコンタクトパッドを露出した後に、電気的短絡を検出するために前記第2の複数のコンタクトパッドに対し試験を行うことと、
を更に含む、請求項12に記載の方法。 - 矩形側面を含む支持基板と、
前記支持基板上の接着剤層と、
前記接着剤層に取り付けられたビルドアップ構造体であって、前記ビルドアップ構造体は、複数のBGAコンタクトパッドを含む底面と、複数の表面実装コンタクトパッドを含む上面とを含む、ビルドアップ構造体と、
を備え、
前記ビルドアップ構造体は、厚さ100μm未満であり、前記ビルドアップ構造体の前記底面は、接地ルーティングを含む、基板ストリップ。 - 前記ビルドアップ構造体は、型成形群内に配列されているパッケージルーティングのアレイ及び接地ルーティングのアレイを含み、各パッケージルーティングは、前記パッケージルーティングの外周に接地ルーティングを含み、各々の型成形群は、複数のパッケージルーティング及び複数の接地ルーティングを含む、請求項18に記載の基板ストリップ。
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