JP6516995B2 - 発光素子、それを含む発光素子パッケージ及びパッケージを含む照明装置 - Google Patents
発光素子、それを含む発光素子パッケージ及びパッケージを含む照明装置 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/00—Globes; Bowls; Cover glasses
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
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- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21Y2115/10—Light-emitting diodes [LED]
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2924/11—Device type
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/12042—LASER
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- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
Description
Claims (20)
- 多角形の平面形状を有する発光素子であって、
基板と、
前記基板の下に配置され、第1導電型半導体層、活性層及び第2導電型半導体層を含む発光構造物と、
サブマウントと、
前記サブマウント上に互いに電気的に離隔して配置された第1及び第2金属パッドと、
前記第1導電型半導体層と前記第1金属パッドとの間に配置された複数個の第1バンプと、
前記第2導電型半導体層と前記第2金属パッドとの間に配置された複数個の第2バンプとを含み、
前記第1導電型半導体層、前記活性層及び前記複数個の第1バンプが配置された複数のアクティブ領域は、互いに離隔した平面形状を有し、
前記複数のアクティブ領域が互いに離隔した距離は、60μm〜300μmであり、
前記複数個の第1バンプは、前記複数個の第2バンプよりも前記発光素子の角に近接する第1バンプを複数含み、
前記複数個の第2バンプのそれぞれは、前記複数個の第1バンプのいずれか2つと隣接し、且つ、それらの間に配置され、
前記複数個の第2バンプのいずれか1つ及びこれに隣接する前記複数個の第1バンプのいずれか2つは、直線的に配列され、
前記複数個の第1バンプの個数は、前記複数個の第2バンプの個数以下である、発光素子。 - 前記複数のアクティブ領域は、前記発光素子のエッジから10μm〜100μmの距離だけ離隔した、請求項1に記載の発光素子。
- 前記複数のアクティブ領域が前記発光素子のエッジから離隔した距離は、互いに同一である、請求項1又は2に記載の発光素子。
- 前記複数のアクティブ領域が前記発光素子のエッジから離隔した距離は、互いに異なる、請求項1又は2に記載の発光素子。
- 前記複数個の第2バンプのそれぞれは、前記複数のアクティブ領域の間に配置された平面形状を有する、請求項1ないし4のいずれか1項に記載の発光素子。
- 前記複数個の第2バンプは、十字状に配置された平面形状を有する、請求項5に記載の発光素子。
- 前記複数個の第2バンプは、三角形状に配置された平面形状を有する、請求項5に記載の発光素子。
- 前記複数個の第1バンプのそれぞれは、円形の平面形状を有する、請求項1ないし7のいずれか1項に記載の発光素子。
- 前記複数個の第2バンプのそれぞれは、円形の平面形状を有する、請求項1ないし8のいずれか1項に記載の発光素子。
- 前記複数個の第2バンプのいずれかと前記第2導電型半導体層との間に配置された反射層をさらに含む、請求項1ないし9のいずれか1項に記載の発光素子。
- 前記複数のアクティブ領域のそれぞれを取り囲む環状の平面形状を有する反射層をさらに含む、請求項1ないし9のいずれか1項に記載の発光素子。
- 前記複数のアクティブ領域は、互いに等間隔に離隔して配置された平面形状を有する、請求項1ないし11のいずれか1項に記載の発光素子。
- 前記複数のアクティブ領域は、互いに異なる間隔で離隔して配置された平面形状を有する、請求項1ないし11のいずれか1項に記載の発光素子。
- 前記複数のアクティブ領域は、前記発光素子の周縁に配置された平面形状を有する、請求項1ないし13のいずれか1項に記載の発光素子。
- 前記活性層は、210nm〜280nmの波長帯域の光を放出する、請求項1ないし14のいずれか1項に記載の発光素子。
- 前記複数個の第1バンプの個数と前記複数個の第2バンプの個数とは同一である、請求項15に記載の発光素子。
- 前記複数個の第1バンプの個数と前記複数個の第2バンプの個数とは互いに異なる、請求項15に記載の発光素子。
- 前記複数個の第1バンプのそれぞれの第1高さは、前記複数個の第2バンプのそれぞれの第2高さよりも小さい、請求項1ないし17のいずれか1項に記載の発光素子。
- ヘッダーと、
前記ヘッダー上に配置されてキャビティを形成する側壁部と、
前記ヘッダー上で前記キャビティ内に配置された請求項1ないし18のいずれか1項に記載の前記発光素子の前記第1及び第2金属パッドと電気的にそれぞれ接続される第1及び第2ワイヤと、
前記第1及び第2ワイヤを介して前記第1及び第2金属パッドとそれぞれ電気的に接続される第1及び第2リード線と、
前記キャビティに充填されて前記発光素子を包囲するように配置されたモールディング部材とを含む、発光素子パッケージ。 - 請求項19に記載の発光素子パッケージと、
前記発光素子パッケージから提供される光を拡散、散乱または励起させるカバーとを含む、照明装置。
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KR1020130119754A KR102099439B1 (ko) | 2013-10-08 | 2013-10-08 | 발광 소자 및 이를 포함하는 발광 소자 패키지 |
KR10-2013-0119754 | 2013-10-08 |
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JP2015076617A JP2015076617A (ja) | 2015-04-20 |
JP2015076617A5 JP2015076617A5 (ja) | 2017-11-16 |
JP6516995B2 true JP6516995B2 (ja) | 2019-05-22 |
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US (1) | US9627596B2 (ja) |
EP (1) | EP2860778B1 (ja) |
JP (1) | JP6516995B2 (ja) |
KR (1) | KR102099439B1 (ja) |
CN (1) | CN104518063B (ja) |
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JP6156402B2 (ja) | 2015-02-13 | 2017-07-05 | 日亜化学工業株式会社 | 発光装置 |
DE102015112438A1 (de) | 2015-07-29 | 2017-02-02 | SMR Patents S.à.r.l. | Beleuchtungsvorrichtung zur optimierten Lichtverteilung |
JP6696298B2 (ja) * | 2015-07-30 | 2020-05-20 | 日亜化学工業株式会社 | 発光素子及びそれを用いた発光装置 |
US9786812B2 (en) * | 2015-07-30 | 2017-10-10 | Nichia Corporation | Light emitting element and light emitting device |
JP6555043B2 (ja) * | 2015-09-18 | 2019-08-07 | 日亜化学工業株式会社 | 発光素子及び発光装置 |
WO2018038105A1 (ja) * | 2016-08-26 | 2018-03-01 | スタンレー電気株式会社 | Iii族窒化物半導体発光素子 |
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US9627596B2 (en) | 2017-04-18 |
US20150098224A1 (en) | 2015-04-09 |
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