JP6510374B2 - ワークの平面研削方法及び平面研削盤 - Google Patents
ワークの平面研削方法及び平面研削盤 Download PDFInfo
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- JP6510374B2 JP6510374B2 JP2015183134A JP2015183134A JP6510374B2 JP 6510374 B2 JP6510374 B2 JP 6510374B2 JP 2015183134 A JP2015183134 A JP 2015183134A JP 2015183134 A JP2015183134 A JP 2015183134A JP 6510374 B2 JP6510374 B2 JP 6510374B2
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- 238000000034 method Methods 0.000 title claims description 22
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
2 平面研削盤
3 回転テーブル
4 ワーク駆動手段
5 砥石軸
7 砥石送り手段
10 定寸制御手段
11 砥石切込戻し制御手段
12 寸法測定手段
13 研削負荷測定手段
14 速度設定手段
14A 速度制限実行手段
15 速度制御手段
16 テーブル選択手段
17 時間設定手段
Claims (7)
- 砥石によりワークを平面研削するに際し、
研削負荷を監視しながら、
研削負荷が上昇するに伴って砥石の切込速度を減速し、
研削負荷が砥石の切込時の最大の負荷閾値よりも高い負荷閾値を越えたときに、この高い負荷閾値に応じた所定の速度で砥石を切込時とは逆方向に相対的に移動させながら研削を継続する
ことを特徴とするワークの平面研削方法。 - 砥石によりワークを平面研削するに際し、
研削負荷を監視しながら、
研削負荷が上昇したときに砥石の切込速度を減速し、
研削負荷が低下したときに切込速度を増速し、
研削負荷が砥石の切込時の最大の負荷閾値よりも高い負荷閾値を越えたときに、この高い負荷閾値に応じた所定の速度で砥石を切込時とは逆方向に相対的に移動させながら研削を継続する
ことを特徴とするワークの平面研削方法。 - 研削負荷の複数の各負荷閾値に対応して、研削負荷が大になるほど砥石の切込速度が遅くなる各切込速度を設定しておき、
所定速度で研削を開始した後、研削負荷が所定の負荷閾値に上昇・低下するたびに砥石を対応する切込速度に減速・増速する
ことを特徴とする請求項1又は2に記載のワークの平面研削方法。 - 研削負荷が砥石の切込時の最大の負荷閾値よりも高い戻し負荷閾値を超えたときに、砥石をその戻し負荷閾値に応じた所定の戻し速度で戻しながら研削する
ことを特徴とする請求項1〜3の何れかに記載のワークの平面研削方法。 - スパークアウト前に砥石の切込と戻しとを繰り返すことを特徴とする請求項1〜4の何れかに記載のワークの平面研削方法。
- 研削負荷が速度制限実行用の負荷閾値を超えたときに、その後に研削負荷が所定の切込速度の負荷閾値に低下しても所定の切込速度よりも遅い制限切込速度で砥石を切込、制限切込速度以上に速くしないことを特徴とする請求項1〜5の何れかに記載のワークの平面研削方法。
- 砥石によりワークをインフィード研削する平面研削盤であって、
研削中の砥石の研削負荷を測定する研削負荷測定手段と、
複数の負荷閾値に対応して複数の砥石の切込速度が設定された速度設定手段と、
研削中の研削負荷と負荷閾値とを比較しながら研削負荷の上昇、低下に伴って砥石の切込速度が減速、増速するように各負荷閾値を基準として各負荷閾値に対応する切込速度で砥石を増減速させ、研削負荷が砥石の切込時の最大の負荷閾値よりも高い負荷閾値を越えたときに、研削を継続しながら前記高い負荷閾値に応じた所定の速度で砥石を切込時とは逆方向に相対的に移動させる速度制御手段とを備えた
ことを特徴とする平面研削盤。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015183134A JP6510374B2 (ja) | 2015-09-16 | 2015-09-16 | ワークの平面研削方法及び平面研削盤 |
US15/236,667 US20170072529A1 (en) | 2015-09-16 | 2016-08-15 | Surface grinding method for workpiece and surface grinder |
KR1020160115480A KR102573501B1 (ko) | 2015-09-16 | 2016-09-08 | 워크의 평면 연삭 방법 및 평면 연삭반 |
TW105129696A TWI703010B (zh) | 2015-09-16 | 2016-09-13 | 工件的平面磨削方法和平面磨床 |
CN201610824809.5A CN106881639B (zh) | 2015-09-16 | 2016-09-14 | 工件的平面磨削方法和平面磨床 |
Applications Claiming Priority (1)
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JP2015183134A JP6510374B2 (ja) | 2015-09-16 | 2015-09-16 | ワークの平面研削方法及び平面研削盤 |
Publications (2)
Publication Number | Publication Date |
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JP2017056516A JP2017056516A (ja) | 2017-03-23 |
JP6510374B2 true JP6510374B2 (ja) | 2019-05-08 |
Family
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JP2015183134A Active JP6510374B2 (ja) | 2015-09-16 | 2015-09-16 | ワークの平面研削方法及び平面研削盤 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20170072529A1 (ja) |
JP (1) | JP6510374B2 (ja) |
KR (1) | KR102573501B1 (ja) |
CN (1) | CN106881639B (ja) |
TW (1) | TWI703010B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020025989A (ja) * | 2018-08-09 | 2020-02-20 | 株式会社ディスコ | 研削装置 |
JP6871210B2 (ja) * | 2018-09-07 | 2021-05-12 | ファナック株式会社 | 数値制御装置 |
CN112157585B (zh) * | 2020-08-24 | 2022-05-03 | 河南捷利达超硬制品有限公司 | 磨削控制方法 |
US20240082984A1 (en) * | 2020-12-25 | 2024-03-14 | Xebec Technology Co., Ltd. | Method of controlling polishing tool holder, polishing tool holder, and polishing device |
CN114985844A (zh) * | 2022-06-28 | 2022-09-02 | 湖南中大创远数控装备有限公司 | 一种螺旋锥齿轮的磨削加工方法 |
CN117415730B (zh) * | 2023-12-19 | 2024-03-12 | 江苏京创先进电子科技有限公司 | 减薄控制方法、系统、减薄设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6056821A (ja) * | 1983-09-09 | 1985-04-02 | Honda Motor Co Ltd | 歯車研削機 |
JPS63150158A (ja) * | 1986-12-10 | 1988-06-22 | Sumitomo Electric Ind Ltd | 端面研削盤切込み装置 |
US5044125A (en) * | 1988-09-02 | 1991-09-03 | Cincinnati Milacron-Heald Corp. | Method and apparatus for controlling grinding processes |
KR0167021B1 (ko) * | 1993-03-15 | 1999-02-01 | 카타다 테쯔야 | 자동연삭장치 |
US5827111A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
JP2002028860A (ja) * | 2000-07-17 | 2002-01-29 | Sumitomo Heavy Ind Ltd | 研削盤 |
JP2005279882A (ja) * | 2004-03-30 | 2005-10-13 | Seiko Instruments Inc | 研削加工装置 |
JP4576503B2 (ja) * | 2004-07-30 | 2010-11-10 | 株式会社不二越 | 平面研削方法 |
JP4447440B2 (ja) * | 2004-12-02 | 2010-04-07 | 新日本製鐵株式会社 | ワークロールのオンライン研削方法 |
JP5301823B2 (ja) * | 2007-12-06 | 2013-09-25 | 株式会社ニデック | 眼鏡レンズ周縁加工装置 |
US9033762B2 (en) * | 2009-07-22 | 2015-05-19 | Jtekt Corporation | Method and device for preventing slip of work piece |
JP5886680B2 (ja) * | 2012-04-26 | 2016-03-16 | 株式会社ディスコ | 研削方法及び研削装置 |
-
2015
- 2015-09-16 JP JP2015183134A patent/JP6510374B2/ja active Active
-
2016
- 2016-08-15 US US15/236,667 patent/US20170072529A1/en not_active Abandoned
- 2016-09-08 KR KR1020160115480A patent/KR102573501B1/ko active IP Right Grant
- 2016-09-13 TW TW105129696A patent/TWI703010B/zh active
- 2016-09-14 CN CN201610824809.5A patent/CN106881639B/zh active Active
Also Published As
Publication number | Publication date |
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KR20170033233A (ko) | 2017-03-24 |
JP2017056516A (ja) | 2017-03-23 |
KR102573501B1 (ko) | 2023-08-31 |
CN106881639A (zh) | 2017-06-23 |
US20170072529A1 (en) | 2017-03-16 |
TWI703010B (zh) | 2020-09-01 |
CN106881639B (zh) | 2021-03-30 |
TW201718179A (zh) | 2017-06-01 |
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