WO2010032371A1 - バンドソー切断装置及びインゴットの切断方法 - Google Patents
バンドソー切断装置及びインゴットの切断方法 Download PDFInfo
- Publication number
- WO2010032371A1 WO2010032371A1 PCT/JP2009/003876 JP2009003876W WO2010032371A1 WO 2010032371 A1 WO2010032371 A1 WO 2010032371A1 JP 2009003876 W JP2009003876 W JP 2009003876W WO 2010032371 A1 WO2010032371 A1 WO 2010032371A1
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- WIPO (PCT)
- Prior art keywords
- blade
- ingot
- cutting
- driven
- band saw
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims abstract description 145
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000006061 abrasive grain Substances 0.000 claims abstract description 34
- 239000002826 coolant Substances 0.000 claims abstract description 16
- 238000006073 displacement reaction Methods 0.000 claims description 68
- 239000010953 base metal Substances 0.000 claims description 15
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000008859 change Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000003825 pressing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/127—Straight, i.e. flat, saw blades; strap saw blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D55/00—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts
- B23D55/06—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts of drives for strap saw blades; of wheel mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Definitions
- the present invention relates to an ingot cutting apparatus for cutting an ingot, particularly a silicon ingot pulled up by the Czochralski method (CZ method) or the like, and a cutting method using the same.
- CZ method Czochralski method
- a silicon ingot manufactured by the CZ method or the like has a cone-shaped end portion (top portion and tail portion) in a cylindrical body portion.
- these cone-shaped end portions are separated to form only a cylindrical body portion, and the body portion is cut into a plurality of blocks as necessary.
- processing for making the block into a wafer is performed.
- an inner peripheral blade slicer, an outer peripheral blade slicer, and the like have been often used. With the recent increase in wafer diameter, many band saws have been used.
- the band saw cutting apparatus 101 is provided with a cutting table 105 for supporting an ingot 104 during cutting. Then, the ingot 104 is placed horizontally on the cutting table 105 before cutting.
- the band saw cutting device 101 has an endless belt-like blade 102 composed of a blade abrasive portion formed by adhering diamond abrasive grains to an end portion of a thin blade base metal, which is stretched between pulleys 103 and 103 ′. Has been. Further, the placement position of the ingot 104 is adjusted so that the position where the ingot 104 is cut is matched with the blade 102.
- the blade 102 is driven to rotate by the rotation of the pulleys 103 and 103 ′, and the ingot 104 is cut by sending the blade 102 relatively downward from above.
- blades used in such a band saw cutting apparatus have been made thinner in order to improve the product yield by reducing the machining allowance when cutting an ingot.
- the cutting powder accumulates on the blade abrasive grains, and the abrasive grains are buried, or the abrasive grains are worn by the cutting, so that the cutting ability is lowered. If cutting is performed in such a state, the blade 102 is displaced due to an increase in cutting resistance, causing the blade 102 to run out and causing warping of the wafer to be cut, resulting in variations in cutting accuracy. There was a problem that.
- the increase / decrease in cutting resistance during cutting is detected from the increase / decrease in power consumption of the first motor, and the cutting by the second motor moves the blade in the cutting direction according to the increase / decrease in power consumption.
- a cutting method in which a wafer having a uniform thickness can be stably obtained by controlling the speed to decrease see Patent Document 1.
- the present invention was made in view of the above-described problems, a band saw cutting device that can stably maintain the quality of an ingot to be cut, increase the life of the blade, and improve productivity. And it aims at providing the cutting method of an ingot.
- an ingot is horizontally placed on a cutting table, and an endless belt-like blade composed of a blade abrasive grain part and a blade base metal is stretched between pulleys.
- An ingot cutting method for cutting the ingot by rotating the pulley to drive the blade in a circular motion, and discharging the blade from the upper side to the lower side while jetting coolant to the blade. Is rotated in one direction to cut the ingot, and after the cutting is completed, before the next cutting starts, the direction in which the blade is driven to rotate is changed to a direction opposite to the direction to cut the ingot.
- An ingot cutting method is provided.
- the blade is driven to rotate in one direction to cut the ingot, and after the cutting is completed, the direction in which the blade is driven to rotate before the start of the next cutting is changed to a direction opposite to the direction.
- the ingot By cutting the ingot, it is possible to change the direction of the blade tip deflection before and after the change in the direction of the circumferential driving of the blade, and to suppress the displacement amount of the blade tip deflection.
- the cutting precision of an ingot can be maintained stably and the lifetime of a blade can be improved. Further, the frequency of dressing can be reduced, and productivity can be improved.
- the timing for changing the direction in which the blade is driven to rotate is determined by measuring the displacement amount of the blade during the cutting of the ingot and measuring the displacement amount.
- the timing for changing the direction in which the blade is driven is measured by measuring the amount of displacement of the blade while the ingot is being cut, and the amount of displacement of the blade increases if determined by the measured amount of displacement. Therefore, it is possible to suppress the cutting failure generated by the above, and more reliably maintain the quality of the ingot stably. Furthermore, the amount of displacement of the blade tip runout can be reduced more effectively, and the blade life and productivity can be improved more reliably.
- a blade having a base metal thickness of 0.1 to 0.5 mm it is preferable to use a blade having a base metal thickness of 0.1 to 0.5 mm.
- a blade having a base metal thickness of 0.1 to 0.5 mm it is possible to improve the product yield by using the thinned blade, and the blade can be driven orbited according to the present invention. It is possible to more effectively exhibit the effect of changing the blade edge deflection direction before and after the change of direction to keep the blade edge deflection displacement amount low.
- the ingot is horizontally placed on the cutting table, and an endless belt-like blade composed of a blade abrasive grain portion and a blade base metal is stretched between pulleys.
- a band saw cutting device that cuts the ingot by relatively sending the blade driven around by the rotation of the pulley from the upper side to the lower side, the pulley having its shaft
- a band saw cutting device which is configured to be rotatable in both directions around the blade and which can cut the ingot by changing the direction in which the blade rotates.
- the pulley is configured to be rotatable in both directions around its axis, and can change the direction in which the blade is driven and cut the ingot. It is possible to change the blade tip deflection direction before and after the change to suppress the blade tip deflection displacement amount low. Thereby, it becomes an apparatus which can maintain the cutting precision of an ingot stably and can improve the lifetime of a blade. In addition, the frequency of dressing can be reduced, and the apparatus can improve productivity.
- it further includes a displacement sensor for measuring the displacement amount of the blade, and changes the direction in which the blade is driven by the displacement amount of the blade during cutting of the ingot measured by the displacement sensor. It is preferable.
- the blade further includes a displacement sensor for measuring the displacement amount of the blade, and changes the direction in which the blade is driven by the displacement amount of the blade during cutting of the ingot measured by the displacement sensor. If it exists, it becomes a device which can suppress the cutting defect which arises when the displacement amount of a blade becomes large, and can maintain the quality of an ingot stably more reliably. Furthermore, the amount of displacement of the blade tip deflection can be suppressed more effectively, and the device can be more reliably improved in blade life and productivity.
- the blade preferably has a base metal thickness of 0.1 to 0.5 mm.
- the base metal has a base metal thickness of 0.1 to 0.5 mm, it is possible to improve the product yield by using the thinned blade, and in the direction of the circumferential driving of the blade according to the present invention.
- the apparatus can more reliably exhibit the effect of changing the blade tip deflection direction before and after the change to keep the blade tip deflection displacement low.
- the pulley on which the blade is stretched is configured to be rotatable in both directions around its axis, and the blade is driven in one direction to cut the ingot. Since the ingot is cut by changing the direction in which the blade is driven before the start of cutting, the direction of blade rotation of the blade is changed before and after the change in the direction of rotation of the blade. The amount of displacement of the blade runout can be kept low. Thereby, the cutting precision of an ingot can be maintained stably and the lifetime of a blade can be improved. Further, the frequency of dressing can be reduced, and productivity can be improved.
- the present invention is not limited to this.
- cutting powder accumulates on the blade abrasive grains, etc., and the abrasive grains are buried or the abrasive grains are worn, resulting in a decrease in cutting ability. Resulting in. For this reason, dressing and tooling are regularly performed on the blade. Conventionally, these are performed by pressing the dressing member against the blade while the operator adjusts the pressing force and angle based on experience.
- the present inventor has intensively studied to solve such problems.
- the blade tip deflection can be reduced and cut with high precision.
- the blade tip runout becomes large, and it may be difficult to restore the balance in the sharpening direction of the abrasive grains with conventional dressing and tooling. I found out.
- the present inventor has conducted intensive studies, and in the cutting of the ingot, the blade that has been conventionally driven only in one direction is rotated by reversing the direction of the blade's circular drive so that the abrasive grains of the blade and the ingot It was conceived that the balance of the sharpening direction of the abrasive grains can be restored by changing the direction of hitting. And the direction of the vibration generated at the blade edge is reversed before and after the reversal of the rotational drive direction of the blade, so that the blade edge vibration can be corrected and the displacement of the blade edge vibration can be kept low.
- the present invention has been completed.
- FIG. 1A is a schematic view showing an example of a band saw cutting device according to the present invention.
- FIG. 1B is a schematic top view thereof.
- a band saw cutting apparatus 1 according to the present invention includes a cutting table 5 for placing an ingot 4 at the time of cutting, a blade 2 for cutting the ingot 4, and a blade 2. Pulleys 3, 3 ′, etc. for tensioning and driving around are provided.
- the blade 2 has an endless belt shape, and as shown in FIG. 2, is constituted by a blade abrasive grain portion 6 in which diamond abrasive grains are glued to the end of a thin blade base 7.
- the particle size of the blade abrasive grain portion 6 is not particularly limited, but may be, for example, 120-220.
- the shape of the abrasive grains can be semicircular or rectangular. If the abrasive grains have such a bilaterally symmetric shape, the change in the rotational driving direction of the blade 2 can be prevented from affecting the cut surface of the ingot 4.
- the pulleys 3 and 3 ' are configured to be rotatable in both directions around the axis thereof.
- the blade 2 is stretched between the pulleys 3 and 3 ', and the blade 2 can be driven to rotate by rotating the pulleys 3 and 3'.
- the pulleys 3 and 3 ' can rotate in both directions around their axes, the direction in which the blade 2 is driven to rotate can be changed.
- either one of the two pulleys 3 and 3 ′ that can be rotationally driven may be one-axis driving, or both may be two-axis driving.
- the tension for lifting the blade 2 between the pulleys 3 and 3 ′ can be 1 t or more.
- the tension tension between the pulleys 3 and 3 ′ is 1 t or more, even in the case of uniaxial driving, the blade 2 is shaken during rotation regardless of the direction of the circumferential driving of the blade 2. Can be prevented.
- the pair of static pressure pads 9 are arranged facing each other at a predetermined interval so as to pass the blade 2.
- the coolant jet port 8 which ejects the coolant supplied in order to remove clogging of the blade abrasive grain part 6 and processing heat with respect to the blade 2.
- the coolant jets 8 can be arranged before and after the ingot 4 in the traveling direction of the blade 2. And it can suppress that a coolant disperses by ejecting a coolant from the coolant outlet 8 arrange
- the coolant jet 8 may be provided in the nozzle, or as shown in FIG. 1B, the coolant jet 8 is provided on the surface of the static pressure pad 9 on the blade 2 side. You can also. In this way, the coolant jet 8 is disposed on the surface of the static pressure pad 9 on the blade 2 side, so that the coolant is jetted from the coolant jet 8 toward the blade 2 during cutting of the ingot 4. The vibration of the blade 2 can be suppressed while removing clogging of the abrasive grains 6 and processing heat.
- the band saw cutting device 1 configured as described above includes a blade abrasive grain portion 6 and an ingot 4 which are sent by rotating a blade 2 driven around by rotation of pulleys 3 and 3 ′ from the upper side to the lower side. , The ingot 4 is cut, and after the completion of the cutting, the rotation direction of the pulleys 3 and 3 ′ is reversed before the next cutting is started to change the direction in which the blade 2 is driven around, Similarly, the ingot 4 can be cut.
- FIGS. 3 (A) and 3 (B) are enlarged views of the vicinity of the abrasive grains surrounded by the circle shown in FIG. 2, and the blade abrasive grains 6 and the ingot 4 with respect to the direction of the circumferential drive of the blade 2 during the cutting of the ingot 4. It is the schematic explanatory drawing which showed the direction which hits. As shown in FIGS. 3 (A) and 3 (B), the direction in which the blade abrasive grain portion 6 and the ingot 4 strike changes with respect to the circumferential drive direction of the blade 2.
- the blade 2 is driven in one direction to cut the ingot 4 and the cutting progresses or the block cutting is repeatedly performed, so that the abrasive grains 6 are worn.
- the cutting powder is accumulated and the cutting resistance is increased, and the blade 2 runs out in either direction.
- the blade abrasive grains are cut by changing the direction in which the blade 2 is driven to rotate, for example, from the direction shown in FIG. 3 (A) to the direction shown in FIG. 3 (B) and cutting the ingot 4.
- the direction of contact between the portion 6 and the ingot 4 is changed, and the direction of blade edge deflection of the blade 2 when cutting in FIG. 3B is opposite to that when cutting in FIG. That is, it is possible to suppress an increase in the displacement amount of the blade tip deflection of the blade 2, and as a result, it is possible to stabilize the displacement amount of the blade tip deflection of the blade 2 to be low.
- the cutting accuracy of the ingot 4 can be stably maintained, and the life of the blade 2 can be improved.
- the abrasive grains that have become poorly cut due to wear of the blade abrasive grains 6 are removed by self-cleaning action, the cutting ability is recovered, and the blade edge runout of the blade 2 is suppressed by the present invention as described above. Can be reduced, and productivity can be improved.
- a displacement sensor 10 for measuring the displacement amount of the blade 2 can be provided.
- the displacement amount of the blade 2 during cutting of the ingot 4 is measured by the displacement sensor 10, and the direction in which the blade 2 is driven to rotate can be changed according to the measured displacement amount.
- the direction in which the blade 2 is driven to rotate can be changed after the completion of the cutting and before the start of the next cutting.
- it can also be automated by providing a control device in which such control is programmed in advance and a servo motor on the pulley shaft.
- blade 2 becomes large can be suppressed, and the quality of the ingot 4 can be maintained stably more reliably. Further, the displacement amount of the blade tip deflection of the blade 2 can be suppressed more effectively, and the effect of improving the life and productivity of the blade 2 can be more reliably achieved.
- the predetermined value of the displacement amount of the blade 2 when changing the direction of the circumferential drive of the blade 2 can be set to 100 ⁇ m, for example.
- the blade 2 preferably has a base metal thickness of 0.1 to 0.5 mm.
- the blade 2 has a base metal thickness of 0.1 to 0.5 mm, it is possible to improve the product yield by using the thinned blade 2 and to reduce the blade edge due to the thinning.
- the displacement amount of the blade tip runout of the blade 2 can be kept low by changing the direction of the blade tip runout before and after the change of the direction of the circumferential drive of the blade 2 according to the present invention. Therefore, the present invention can be used more suitably in a blade having a thin blade thickness.
- the ingot cutting method according to the present invention will be described.
- the case where the band saw cutting device according to the present invention as shown in FIGS. 1A and 1B is used will be described.
- the ingot 4 to be cut is placed horizontally on the cutting table 5.
- the placement position of the ingot 4 is adjusted so that the cutting position of the ingot 4 matches the position of the blade 2.
- the pulleys 3 and 3 ' are rotated to drive the blades 2 in one direction, and the blades 2 are sent relatively downward from above to cut the ingot 4.
- the blade 2 may be sent from the top to the bottom, or the ingot 4 may be sent from the bottom to the top. Then, the ingot is cut by reversing the direction in which the blade is driven to rotate at an arbitrary time.
- the timing for changing the direction in which the blade 2 is driven to rotate is preferably determined by measuring the amount of displacement of the blade 2 during cutting of the ingot 4 and measuring the amount of displacement. For example, when the measured displacement amount of the blade 2 becomes a predetermined value or more, the direction in which the blade 2 is driven to rotate can be changed after the completion of the cutting and before the start of the next cutting. And then.
- the process can be automated by programming such control in advance.
- the timing of changing the direction in which the blade 2 is driven to rotate is determined by measuring the amount of displacement of the blade 2 during cutting of the ingot 4 and determining the amount of displacement by measuring the amount of displacement.
- the cutting failure which arises by this can be suppressed, and the quality of the ingot 4 can be maintained stably more reliably.
- the displacement amount of the blade tip deflection of the blade 2 can be suppressed more effectively, and the effect of improving the life and productivity of the blade 2 can be more reliably achieved.
- the predetermined value of the displacement amount of the blade 2 when the direction of the circumferential drive of the blade 2 is changed can be set to 100 ⁇ m, for example. It should be noted that the timing for changing the circumferential drive direction of the blade 2 is not limited to the case where it is determined by the displacement amount of the blade 2 described above. You may make it change using the frequency
- a blade 2 having a base metal thickness of 0.1 to 0.5 mm it is preferable to use a blade 2 having a base metal thickness of 0.1 to 0.5 mm.
- the blade 2 having a reduced thickness has the effect of improving the product yield, while the blade thickness is reduced due to the reduction in thickness. Even if it is easy, by the present invention, the direction of the blade runout of the blade 2 changes before and after the change of the direction of the circumferential drive of the blade 2, thereby further reducing the displacement amount of the blade runout of the blade 2. It can be played reliably.
- the ingot block cutting method is repeatedly performed by the ingot cutting method according to the present invention, and the displacement of the blade is measured by an eddy current sensor, and the measured displacement
- the cutting is repeated by changing the direction in which the blade is driven before the next cutting, and then the number of cutting until the amount of displacement of the blade reaches 100 ⁇ m or more was evaluated. .
- these were repeated and the time when the amount of displacement of the blade reached 200 ⁇ m was regarded as the life of the blade, and the number of cuttings at that time was evaluated.
- the thickness of the base metal of the blade used was 0.3 mm, and a single-axis drive configuration in which one pulley was driven to rotate was adopted.
- blade on the pulley was 1.4t. As a result, it was found that the number of times of cutting until the amount of displacement of the blade reached 100 ⁇ m or more was about 100 times on average, which was improved compared to the average of 20 times in the comparative example described later.
- the band saw cutting device and cutting method of the present invention can suppress the amount of displacement of the blade tip runout, reduce the frequency of dressing, and improve productivity. did it. Further, after the amount of displacement of the blade reached 100 ⁇ m or more, the amount of displacement of the blade after cutting the ingot by changing the direction in which the blade was driven to rotate was 10 ⁇ m, and the direction of displacement was negative.
- FIG. 4 is a diagram showing changes in the amount of displacement of the blade at this time. As shown in FIG. 4, since the amount of displacement when the number of times of cutting is 116th is 100 ⁇ m or more, the direction in which the blade is driven is changed (point A in FIG. 4), and the displacement of the blade in the subsequent cutting is negative. It was found that the displacement was in the opposite direction, that is, the direction opposite to that, and the amount of displacement was kept as low as 10 ⁇ m.
- FIG. 5 shows the results of blade life. As shown in FIG. 5, it can be seen that the number of cuts is larger than the result of a comparative example described later. And it turned out that the average value of the frequency
- the ingot was cut under the same conditions as in Example 1, and the same evaluation as in the example was performed.
- the number of cuttings until the amount of displacement of the blade reached 100 ⁇ m or more was 20 on average, which was worse than the results of the examples.
- FIG. 5 shows the results of blade life. As shown in FIG. 5, it was found that the number of times of cutting was small and the life of the blade was short compared to the results of the example.
- the present invention is not limited to the above embodiment.
- the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
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Abstract
Description
このようなコーン状の端部の切断加工や胴体部を複数のブロックに切断加工する場合には、内周刃スライサー、外周刃スライサーなどが多く用いられてきた。近年のウェーハの大口径化に伴ってバンドソーも多く使用されるようになってきた。
図6に示すように、バンドソー切断装置101には切断時にインゴット104を支持するための切断テーブル105が設置されている。そして、切断前において、インゴット104を切断テーブル105上に水平に載置する。
また、インゴット104を切断する位置をブレード102に合わせるようにインゴット104の載置位置を調整する。
近年、このようなバンドソー切断装置に用いられるブレードは、インゴットの切断時における取り代を少なくすることによって製品歩留りを向上させるため、薄型化されたものが使用されるようになってきている。
また、このように作業者によりドレッシングやツーリングを行うことにより工程時間が増加してしまい生産性が低下してしまうという問題もあった。
このように、前記ブレードとして台金厚が0.1~0.5mmのものを用いれば、薄型化されたブレードを用いて製品歩留りを向上する効果を奏しつつ、本発明によりブレードの周回駆動の方向の変更前後でブレードの刃先振れの向きを変えてブレードの刃先振れの変位量を低く抑えることができる効果をより効果的に奏することができる。
このように、前記ブレードは台金厚が0.1~0.5mmであれば、薄型化されたブレードを用いて製品歩留りを向上する効果を奏しつつ、本発明によりブレードの周回駆動の方向の変更前後でブレードの刃先振れの向きを変えてブレードの刃先振れの変位量を低く抑えることができる効果をより確実に奏することができる装置となる。
従来、バンドソー切断装置によるインゴットの切断において、その切断を重ねていくとブレード砥粒部に切断粉末が堆積するなどして砥粒が埋もれたり、砥粒が摩耗したりしてその切断能力が低下してしまう。このため、ブレードに対して定期的にドレッシングやツーリングを行っていた。従来、これらは作業者が経験に基づいて押し当て力と角度を調整しながらドレッシング部材をブレードに押し当てることによって行われていた。
図1(A)(B)に示すように、本発明に係るバンドソー切断装置1は、切断時にインゴット4を載置するための切断テーブル5、インゴット4を切断するためのブレード2、ブレード2を張設して周回駆動させるためのプーリー3、3’等を具備している。
ここで、ブレード砥粒部6の粒度は、特に限定されることはないが、例えば120番~220番とすることができる。また、砥粒の形状は、半円状か長方形とすることができる。砥粒がこのような左右対称形状であれば、ブレード2の周回駆動方向の変更がインゴット4の切断面に影響を与えないものとすることができる。
またここで、特に限定されることはないが、ブレード2をプーリー3、3’間で張り上げる張力を1t以上とすることができる。このようにプーリー3、3’間での張り上げ張力を1t以上とすれば、1軸駆動の場合であっても、ブレード2の周回駆動の方向に関わらず回転中にブレード2にブレが発生するのを防ぐことができる。
また、ブレード2に対してブレード砥粒部6の目詰まりや加工熱を除去するために供給するクーラントを噴出するクーラント噴出口8を有している。
例えば、測定したブレード2の変位量が所定の値以上となった場合、その切断の完了後、次回の切断の開始前にブレード2の周回駆動する方向を変更するようにすることができる。
そして、このような制御を予めプログラミング化した制御装置と、プーリー軸にサーボモータを設けて自動化するものとすることもできる。
ここで、ブレード2の周回駆動の方向を変更するときのブレード2の変位量の所定値を、例えば100μmとすることができる。
このように、ブレード2は台金厚が0.1~0.5mmであれば、薄型化されたブレード2を用いて製品歩留りを向上する効果を奏しつつ、薄型化されたことでより刃先振れが生じ易くなる点については、本発明によりブレード2の周回駆動の方向の変更前後でブレード2の刃先振れの向きを変えてブレード2の刃先振れの変位量を低く抑えることができる。従って、本発明は刃厚が薄いブレードにおいて、より好適に用いることができる。
ここでは、図1(A)(B)に示すような本発明に係るバンドソー切断装置を用いた場合について説明する。
まず、切断するインゴット4を切断テーブル5に水平に載置する。そして、インゴット4の切断する位置をブレード2の位置に合わせるようにインゴット4の載置位置を調整する。
そして、任意の時点でブレードを周回駆動する方向を逆転させてインゴットを切断する。
例えば、測定したブレード2の変位量が所定の値以上となった場合、その切断の完了後、次回の切断の開始前にブレード2の周回駆動する方向を変更するようにすることができる。
そして。このような制御を予めプログラミングしておくことにより工程を自動化することもできる。
このように、ブレード2として台金厚が0.1~0.5mmのものを用いれば、薄型化されたブレード2を用いて製品歩留りを向上する効果を奏しつつ、薄型化により刃先振れが生じ易いものであっても、本発明によりブレード2の周回駆動の方向の変更前後でブレード2の刃先振れの向きが変わることにより、ブレード2の刃先振れの変位量を低く抑えることができる効果をより確実に奏することができる。
図1に示すような、本発明に係るバンドソー切断装置を用い、本発明に係るインゴットの切断方法によってインゴットのブロック切断を繰返し行い、ブレードの変位量を渦電流センサーで測定し、その測定した変位量が100μm以上になった際の切断完了後、次の切断前にブレードを周回駆動させる方向を変更して切断を繰返し、次にブレードの変位量が100μm以上になるまでの切断回数を評価した。また、これらを繰返し行い、ブレードの変位量が200μmとなった時点をブレードの寿命として、その時の切断回数を評価した。
その結果、ブレードの変位量が100μm以上になるまでの切断回数は平均約100回であり、後述する比較例の平均20回と比べ改善されていることが分かった。
また、ブレードの変位量が100μm以上となった後にブレードを周回駆動させる方向を変更してインゴットを切断した後のブレードの変位量は10μmであり、変位の方向はマイナス方向であった。
図6に示すような従来のブレードを一方向にだけ周回駆動させるバンドソー切断装置を用い、ブレードの変位量が100μm以上となったときに作業者によりブレードのドレッシング及びツーリングを行った以外、実施例と同様な条件でインゴットを切断し、実施例と同様な評価を行った。
その結果、ブレードの変位量が100μm以上になるまでの切断回数は平均20回であり、実施例の結果と比較して悪化していることが分かった。
また、図5にブレードの寿命の結果を示す。図5に示すように、実施例の結果と比較して切断回数が少なくブレードの寿命が短いことが分かった。
Claims (6)
- 切断テーブルにインゴットを水平に載置し、ブレード砥粒部とブレード台金で構成されるエンドレスベルト状のブレードをプーリー間に張設し、前記プーリーを回転させて前記ブレードを周回駆動し、前記ブレードに対しクーラントを噴出しながら前記ブレードを相対的に上方から下方に送り出すことによって前記インゴットを切断するインゴットの切断方法であって、前記ブレードを一方向に周回駆動させて前記インゴットを切断し、該切断の完了後、次回の切断の開始前に前記ブレードを周回駆動する方向を前記方向とは逆方向に変更して前記インゴットを切断することを特徴とするインゴットの切断方法。
- 前記ブレードを周回駆動する方向を変更するタイミングは、前記インゴットの切断中に前記ブレードの変位量を測定し、該測定した変位量によって決定することを特徴とする請求項1に記載のインゴットの切断方法。
- 前記ブレードとして台金厚が0.1~0.5mmのものを用いることを特徴とする請求項1または請求項2に記載のインゴットの切断方法。
- 切断テーブルにインゴットが水平に載置され、ブレード砥粒部とブレード台金で構成されるエンドレスベルト状のブレードがプーリー間に張設され、前記ブレードに対してクーラントを噴出するクーラント噴出し口を有し、前記プーリーの回転により周回駆動される前記ブレードを相対的に上方から下方に送り出すことによって前記インゴットを切断するバンドソー切断装置であって、前記プーリーはその軸周りに両方向に回転可能に構成され、前記ブレードの周回駆動する方向を変更して前記インゴットを切断することができるものであることを特徴とするバンドソー切断装置。
- さらに、前記ブレードの変位量を測定する変位センサーを有し、前記変位センサーによって測定した前記インゴットの切断中の前記ブレードの変位量によって前記ブレードの周回駆動する方向を変更するものであることを特徴とする請求項4に記載のバンドソー切断装置。
- 前記ブレードは台金厚が0.1~0.5mmであることを特徴とする請求項4または請求項5に記載のバンドソー切断装置。
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DE102013219764B4 (de) * | 2013-09-30 | 2023-07-13 | Robert Bosch Gmbh | Werkzeugmaschine |
JP6402709B2 (ja) * | 2015-12-25 | 2018-10-10 | 信越半導体株式会社 | バンドソー切断装置及びシリコン結晶の切断方法 |
CN112838045A (zh) * | 2020-12-31 | 2021-05-25 | 六安优云通信技术有限公司 | 一种芯片制备用硅晶片加工装置及加工工艺 |
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