JP6505951B2 - 埋込みパッケージオンパッケージ（ＰｏＰ）デバイスを備える集積デバイス - Google Patents

埋込みパッケージオンパッケージ（ＰｏＰ）デバイスを備える集積デバイス Download PDF

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JP6505951B2
JP6505951B2 JP2018516126A JP2018516126A JP6505951B2 JP 6505951 B2 JP6505951 B2 JP 6505951B2 JP 2018516126 A JP2018516126 A JP 2018516126A JP 2018516126 A JP2018516126 A JP 2018516126A JP 6505951 B2 JP6505951 B2 JP 6505951B2
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package
encapsulation layer
pop
die
integrated device
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JP2018535541A5 (enExample
JP2018535541A (ja
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ラジニーシ・クマール
チン−クァン・キム
ミリンド・シャー
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クアルコム，インコーポレイテッド
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
    • H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
    • H10W42/20—
    • H10W42/273—
    • H10W42/276—
    • H10W44/20—
    • H10W70/09—
    • H10W72/00—
    • H10W74/121—
    • H10W90/00—
    • H10W70/60—
    • H10W70/655—
    • H10W72/0198—
    • H10W72/072—
    • H10W72/073—
    • H10W72/241—
    • H10W72/252—
    • H10W72/9413—
    • H10W74/00—
    • H10W74/019—
    • H10W74/10—
    • H10W74/142—
    • H10W74/15—
    • H10W90/291—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Transceivers (AREA)
JP2018516126A 2015-10-02 2016-09-27 埋込みパッケージオンパッケージ（ＰｏＰ）デバイスを備える集積デバイス Expired - Fee Related JP6505951B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562236766P 2015-10-02 2015-10-02
US62/236,766 2015-10-02
US15/097,719 US10163871B2 (en) 2015-10-02 2016-04-13 Integrated device comprising embedded package on package (PoP) device
US15/097,719 2016-04-13
PCT/US2016/054021 WO2017058825A1 (en) 2015-10-02 2016-09-27 INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

Publications (3)

Publication Number Publication Date
JP2018535541A JP2018535541A (ja) 2018-11-29
JP2018535541A5 JP2018535541A5 (enExample) 2019-03-22
JP6505951B2 true JP6505951B2 (ja) 2019-04-24

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JP2018516126A Expired - Fee Related JP6505951B2 (ja) 2015-10-02 2016-09-27 埋込みパッケージオンパッケージ（ＰｏＰ）デバイスを備える集積デバイス

Country Status (9)

Country Link
US (2) US10163871B2 (enExample)
EP (1) EP3357088B1 (enExample)
JP (1) JP6505951B2 (enExample)
KR (1) KR102055337B1 (enExample)
CN (1) CN108140637B (enExample)
BR (1) BR112018006664B1 (enExample)
CA (1) CA2998190A1 (enExample)
TW (1) TWI661532B (enExample)
WO (1) WO2017058825A1 (enExample)

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Also Published As

Publication number Publication date
US10510733B2 (en) 2019-12-17
WO2017058825A1 (en) 2017-04-06
US10163871B2 (en) 2018-12-25
US20190081027A1 (en) 2019-03-14
CA2998190A1 (en) 2017-04-06
JP2018535541A (ja) 2018-11-29
EP3357088C0 (en) 2025-07-09
CN108140637B (zh) 2021-08-17
CN108140637A (zh) 2018-06-08
US20170098634A1 (en) 2017-04-06
TW201714276A (zh) 2017-04-16
EP3357088A1 (en) 2018-08-08
KR102055337B1 (ko) 2019-12-12
KR20180064401A (ko) 2018-06-14
BR112018006664A2 (en) 2018-10-09
TWI661532B (zh) 2019-06-01
EP3357088B1 (en) 2025-07-09
BR112018006664B1 (pt) 2022-08-16

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