JP6498379B2 - 振動素子、振動子、発振器、電子機器および移動体 - Google Patents

振動素子、振動子、発振器、電子機器および移動体 Download PDF

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Publication number
JP6498379B2
JP6498379B2 JP2013075013A JP2013075013A JP6498379B2 JP 6498379 B2 JP6498379 B2 JP 6498379B2 JP 2013075013 A JP2013075013 A JP 2013075013A JP 2013075013 A JP2013075013 A JP 2013075013A JP 6498379 B2 JP6498379 B2 JP 6498379B2
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Prior art keywords
axis
vibration
vibration element
outer edge
region
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JP2013075013A
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English (en)
Japanese (ja)
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JP2014200025A5 (enExample
JP2014200025A (ja
Inventor
菊島　正幸
正幸 菊島
田中　雅子
雅子 田中
直久 小幡
直久 小幡
海野　幸浩
幸浩 海野
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Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Priority to JP2013075013A priority Critical patent/JP6498379B2/ja
Priority to CN201410104441.6A priority patent/CN104079254B/zh
Priority to US14/227,332 priority patent/US9337801B2/en
Publication of JP2014200025A publication Critical patent/JP2014200025A/ja
Publication of JP2014200025A5 publication Critical patent/JP2014200025A5/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/202—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
    • H10N30/2023—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement having polygonal or rectangular shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2013075013A 2013-03-29 2013-03-29 振動素子、振動子、発振器、電子機器および移動体 Active JP6498379B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013075013A JP6498379B2 (ja) 2013-03-29 2013-03-29 振動素子、振動子、発振器、電子機器および移動体
CN201410104441.6A CN104079254B (zh) 2013-03-29 2014-03-20 振动元件、振子、振荡器、电子设备以及移动体
US14/227,332 US9337801B2 (en) 2013-03-29 2014-03-27 Vibration element, vibrator, oscillator, electronic apparatus, and moving object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013075013A JP6498379B2 (ja) 2013-03-29 2013-03-29 振動素子、振動子、発振器、電子機器および移動体

Publications (3)

Publication Number Publication Date
JP2014200025A JP2014200025A (ja) 2014-10-23
JP2014200025A5 JP2014200025A5 (enExample) 2016-05-19
JP6498379B2 true JP6498379B2 (ja) 2019-04-10

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JP2013075013A Active JP6498379B2 (ja) 2013-03-29 2013-03-29 振動素子、振動子、発振器、電子機器および移動体

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Country Link
US (1) US9337801B2 (enExample)
JP (1) JP6498379B2 (enExample)
CN (1) CN104079254B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6435606B2 (ja) * 2013-03-29 2018-12-12 セイコーエプソン株式会社 振動素子、振動子、発振器、電子機器および移動体
US10840882B2 (en) * 2018-04-24 2020-11-17 Nihon Dempa Kogyo Co., Ltd. Crystal unit and manufacturing method thereof
WO2025094647A1 (ja) * 2023-10-31 2025-05-08 京セラ株式会社 圧電デバイス

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0435108A (ja) * 1990-05-25 1992-02-05 Toyo Commun Equip Co Ltd 超薄板多重モード水晶フィルタ素子
JP2001144578A (ja) 1999-11-15 2001-05-25 Tokyo Denpa Co Ltd 圧電振動子
JP2002033640A (ja) 2000-07-17 2002-01-31 Toyo Commun Equip Co Ltd 圧電デバイス
JP4524916B2 (ja) * 2000-12-27 2010-08-18 エプソントヨコム株式会社 高周波圧電デバイス
JP3952811B2 (ja) 2002-03-11 2007-08-01 セイコーエプソン株式会社 圧電振動片、圧電振動片の製造方法および圧電デバイス
US7098574B2 (en) 2002-11-08 2006-08-29 Toyo Communication Equipment Co., Ltd. Piezoelectric resonator and method for manufacturing the same
JP2004165743A (ja) 2002-11-08 2004-06-10 Toyo Commun Equip Co Ltd 圧電基板、圧電振動素子、圧電振動子、圧電発振器、圧電基板ウェハ、圧電基板ウェハの構造、及び製造方法
JP2006203700A (ja) 2005-01-21 2006-08-03 Epson Toyocom Corp 圧電基板の製造方法、圧電振動素子、圧電振動子、及び圧電発振器
JP4305542B2 (ja) * 2006-08-09 2009-07-29 エプソントヨコム株式会社 Ａｔカット水晶振動片及びその製造方法
JP4600692B2 (ja) 2007-12-28 2010-12-15 エプソントヨコム株式会社 水晶振動片、水晶デバイス、および水晶振動片の製造方法
JP5304163B2 (ja) * 2008-03-13 2013-10-02 セイコーエプソン株式会社 振動片および振動デバイス
US8963402B2 (en) * 2010-11-30 2015-02-24 Seiko Epson Corporation Piezoelectric vibrator element, piezoelectric module, and electronic device
JP5796355B2 (ja) * 2011-06-03 2015-10-21 セイコーエプソン株式会社 圧電振動素子、圧電振動子、電子デバイス、及び電子機器
TW201251157A (en) * 2011-06-03 2012-12-16 Seiko Epson Corp Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric vibrator, electronic device, and electronic apparatus
JP5824958B2 (ja) 2011-08-18 2015-12-02 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、及び電子機器
CN102957394B (zh) * 2011-08-18 2016-12-21 精工爱普生株式会社 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法
JP5824967B2 (ja) 2011-08-24 2015-12-02 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、及び電子機器
JP2013042440A (ja) 2011-08-19 2013-02-28 Seiko Epson Corp 圧電振動素子、圧電振動子、電子デバイス、及び電子機器
US8970316B2 (en) 2011-08-19 2015-03-03 Seiko Epson Corporation Resonating element, resonator, electronic device, electronic apparatus, and mobile object
JP6051885B2 (ja) 2013-01-18 2016-12-27 セイコーエプソン株式会社 振動素子、振動子、発振器、電子機器および移動体
JP6390104B2 (ja) * 2013-03-05 2018-09-19 セイコーエプソン株式会社 振動素子、振動子、発振器、電子機器および移動体
JP6435606B2 (ja) * 2013-03-29 2018-12-12 セイコーエプソン株式会社 振動素子、振動子、発振器、電子機器および移動体

Also Published As

Publication number Publication date
CN104079254B (zh) 2018-07-20
US9337801B2 (en) 2016-05-10
US20140292436A1 (en) 2014-10-02
JP2014200025A (ja) 2014-10-23
CN104079254A (zh) 2014-10-01

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