JP6487704B2 - 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 - Google Patents

処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 Download PDF

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Publication number
JP6487704B2
JP6487704B2 JP2015025259A JP2015025259A JP6487704B2 JP 6487704 B2 JP6487704 B2 JP 6487704B2 JP 2015025259 A JP2015025259 A JP 2015025259A JP 2015025259 A JP2015025259 A JP 2015025259A JP 6487704 B2 JP6487704 B2 JP 6487704B2
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Prior art keywords
copper foil
copper
layer
treated
clad laminate
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Japanese (ja)
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JP2016149438A5 (https=
JP2016149438A (ja
Inventor
岡本　健
健 岡本
真鍋　久徳
久徳 真鍋
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Fukuda Metal Foil and Powder Co Ltd
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Fukuda Metal Foil and Powder Co Ltd
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Priority to JP2015025259A priority Critical patent/JP6487704B2/ja
Priority to KR1020150054287A priority patent/KR102097843B1/ko
Priority to CN201510283536.3A priority patent/CN106211567B/zh
Priority to TW104118618A priority patent/TWI666977B/zh
Publication of JP2016149438A publication Critical patent/JP2016149438A/ja
Publication of JP2016149438A5 publication Critical patent/JP2016149438A5/ja
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2015025259A 2015-02-12 2015-02-12 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 Active JP6487704B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015025259A JP6487704B2 (ja) 2015-02-12 2015-02-12 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
KR1020150054287A KR102097843B1 (ko) 2015-02-12 2015-04-17 처리 동박 및 그 처리 동박을 사용한 구리 피복 적층판 그리고 프린트 배선판
CN201510283536.3A CN106211567B (zh) 2015-02-12 2015-05-28 处理铜箔、使用该处理铜箔的覆铜层叠板及印刷布线板
TW104118618A TWI666977B (zh) 2015-02-12 2015-06-09 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015025259A JP6487704B2 (ja) 2015-02-12 2015-02-12 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板

Publications (3)

Publication Number Publication Date
JP2016149438A JP2016149438A (ja) 2016-08-18
JP2016149438A5 JP2016149438A5 (https=) 2017-07-06
JP6487704B2 true JP6487704B2 (ja) 2019-03-20

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JP2015025259A Active JP6487704B2 (ja) 2015-02-12 2015-02-12 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板

Country Status (4)

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JP (1) JP6487704B2 (https=)
KR (1) KR102097843B1 (https=)
CN (1) CN106211567B (https=)
TW (1) TWI666977B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6687409B2 (ja) * 2016-02-09 2020-04-22 福田金属箔粉工業株式会社 高彩度処理銅箔及び該処理銅箔を用いた銅張積層板並びに該処理銅箔の製造方法
JP6471140B2 (ja) * 2016-11-30 2019-02-13 福田金属箔粉工業株式会社 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2019111914A1 (ja) * 2017-12-05 2019-06-13 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
CN108289370A (zh) * 2018-01-25 2018-07-17 江西景旺精密电路有限公司 一种pcb抗氧化表面处理工艺
CN113795377A (zh) * 2019-05-15 2021-12-14 松下知识产权经营株式会社 覆铜箔层压板、带树脂的铜箔以及使用它们的电路板
JP2021095596A (ja) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
KR102931323B1 (ko) * 2020-03-24 2026-02-26 나믹스 가부시끼가이샤 복합 구리 배선 및 레지스트층을 갖는 적층체
CN114828447B (zh) * 2021-01-28 2024-08-16 鹏鼎控股(深圳)股份有限公司 线路板及其制作方法
KR102495997B1 (ko) 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
CN114919254A (zh) * 2022-05-27 2022-08-19 广州方邦电子股份有限公司 金属箔、挠性覆金属板、半导体、负极材料和电池
KR102835657B1 (ko) * 2022-11-28 2025-07-17 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 표면 처리 구리박 및 그 표면 처리 구리박을 사용한 구리 피복 적층판 그리고 프린트 배선판

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511408B (en) * 2000-09-18 2002-11-21 Nippon Denkai Kk Method of producing copper foil for fine wiring
KR100602896B1 (ko) 2002-06-04 2006-07-19 미쓰이 긴조꾸 고교 가부시키가이샤 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
JP4681936B2 (ja) * 2005-05-20 2011-05-11 福田金属箔粉工業株式会社 プラズマディスプレイ電磁波シールドフィルター用銅箔
TW200934330A (en) * 2007-11-26 2009-08-01 Furukawa Electric Co Ltd Surface treated copper foil and method for surface treating the same, and stack circuit board
JP5634103B2 (ja) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5871426B2 (ja) 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
JP5855259B2 (ja) 2012-09-10 2016-02-09 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
JP5362924B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
CN105008593B (zh) 2013-02-28 2018-08-24 三井金属矿业株式会社 黑化表面处理铜箔、黑化表面处理铜箔的制造方法、覆铜层压板及柔性印刷线路板
JP2014224313A (ja) 2013-04-26 2014-12-04 Jx日鉱日石金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
TW201630483A (zh) 2016-08-16
CN106211567B (zh) 2019-10-18
CN106211567A (zh) 2016-12-07
KR20160099439A (ko) 2016-08-22
JP2016149438A (ja) 2016-08-18
KR102097843B1 (ko) 2020-04-06
TWI666977B (zh) 2019-07-21

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