JP6443850B2 - ナノインプリント用組成物、部材の製造方法及びデバイスの製造方法 - Google Patents
ナノインプリント用組成物、部材の製造方法及びデバイスの製造方法 Download PDFInfo
- Publication number
- JP6443850B2 JP6443850B2 JP2014118092A JP2014118092A JP6443850B2 JP 6443850 B2 JP6443850 B2 JP 6443850B2 JP 2014118092 A JP2014118092 A JP 2014118092A JP 2014118092 A JP2014118092 A JP 2014118092A JP 6443850 B2 JP6443850 B2 JP 6443850B2
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- alkyl group
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- compound
- cyclic
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- 239000000203 mixture Substances 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 125000002947 alkylene group Chemical group 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 125000004122 cyclic group Chemical group 0.000 claims description 11
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- -1 acryloyloxy group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 description 24
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 239000010453 quartz Substances 0.000 description 10
- 125000001424 substituent group Chemical group 0.000 description 10
- 125000004430 oxygen atom Chemical group O* 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361832086P | 2013-06-06 | 2013-06-06 | |
| US61/832,086 | 2013-06-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015038188A JP2015038188A (ja) | 2015-02-26 |
| JP2015038188A5 JP2015038188A5 (enExample) | 2017-07-06 |
| JP6443850B2 true JP6443850B2 (ja) | 2018-12-26 |
Family
ID=52004713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014118092A Active JP6443850B2 (ja) | 2013-06-06 | 2014-06-06 | ナノインプリント用組成物、部材の製造方法及びデバイスの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9240565B2 (enExample) |
| JP (1) | JP6443850B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016529330A (ja) | 2013-06-27 | 2016-09-23 | 東洋合成工業株式会社 | 化学種の発生を向上させるための試剤 |
| JP6537118B2 (ja) | 2013-08-07 | 2019-07-03 | 東洋合成工業株式会社 | 化学増幅フォトレジスト組成物及び装置の製造方法 |
| JP2015098471A (ja) | 2013-11-18 | 2015-05-28 | 東洋合成工業株式会社 | 化学種発生向上試剤 |
| JP6504653B2 (ja) * | 2014-03-31 | 2019-04-24 | 東洋合成工業株式会社 | 組成物及び部品の製造方法 |
| JP6797529B2 (ja) | 2015-01-21 | 2020-12-09 | 東洋合成工業株式会社 | 光学部材の製造方法及びそれに用いられる組成物 |
| JP6774826B2 (ja) | 2015-09-11 | 2020-10-28 | 東洋合成工業株式会社 | 部品の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2601254B2 (ja) * | 1995-03-23 | 1997-04-16 | 株式会社クラレ | 歯科用接着性組成物 |
| JP3941262B2 (ja) * | 1998-10-06 | 2007-07-04 | 株式会社日立製作所 | 熱硬化性樹脂材料およびその製造方法 |
| JP2002012796A (ja) * | 2000-06-27 | 2002-01-15 | Toagosei Co Ltd | 被覆用樹脂組成物及びこれを被覆して成るフォトマスク |
| JP4217886B2 (ja) * | 2003-06-25 | 2009-02-04 | Jsr株式会社 | 感放射線性屈折率変化性組成物、パターン形成法および光学材料 |
| JP5607287B2 (ja) * | 2007-05-16 | 2014-10-15 | アッディソン クレアル ワベ, エルエルシー | 情報層の光複製用感光性樹脂 |
| JPWO2011087008A1 (ja) * | 2010-01-14 | 2013-05-20 | 三菱レイヨン株式会社 | 硬化性樹脂組成物、その硬化物からなる光学部材 |
| JP5546893B2 (ja) * | 2010-02-16 | 2014-07-09 | 東京エレクトロン株式会社 | インプリント方法 |
| US20110245371A1 (en) * | 2010-03-31 | 2011-10-06 | Claude Schweitzer | Pneumatic tire with rubber component containing alkylalkoxysilane and silicone resin |
| JP2014074158A (ja) * | 2012-09-11 | 2014-04-24 | Nippon Synthetic Chem Ind Co Ltd:The | 活性エネルギー線硬化性樹脂組成物およびこれを用いてなるコーティング剤組成物 |
-
2014
- 2014-06-05 US US14/297,488 patent/US9240565B2/en active Active
- 2014-06-06 JP JP2014118092A patent/JP6443850B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140361275A1 (en) | 2014-12-11 |
| JP2015038188A (ja) | 2015-02-26 |
| US9240565B2 (en) | 2016-01-19 |
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