JP6440741B2 - 終点検出のための連続特徴トラッキング - Google Patents

終点検出のための連続特徴トラッキング Download PDF

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Publication number
JP6440741B2
JP6440741B2 JP2016564580A JP2016564580A JP6440741B2 JP 6440741 B2 JP6440741 B2 JP 6440741B2 JP 2016564580 A JP2016564580 A JP 2016564580A JP 2016564580 A JP2016564580 A JP 2016564580A JP 6440741 B2 JP6440741 B2 JP 6440741B2
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Japan
Prior art keywords
spectral feature
sequence
value
substrate
polishing
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Japanese (ja)
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JP2017515307A5 (enExample
JP2017515307A (ja
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ジェフリー ドリュー デーヴィッド，
ジェフリー ドリュー デーヴィッド，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2016564580A 2014-04-30 2015-04-13 終点検出のための連続特徴トラッキング Active JP6440741B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/265,707 US9352440B2 (en) 2014-04-30 2014-04-30 Serial feature tracking for endpoint detection
US14/265,707 2014-04-30
PCT/US2015/025616 WO2015167790A1 (en) 2014-04-30 2015-04-13 Serial feature tracking for endpoint detection

Publications (3)

Publication Number Publication Date
JP2017515307A JP2017515307A (ja) 2017-06-08
JP2017515307A5 JP2017515307A5 (enExample) 2018-05-31
JP6440741B2 true JP6440741B2 (ja) 2018-12-19

Family

ID=54354538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016564580A Active JP6440741B2 (ja) 2014-04-30 2015-04-13 終点検出のための連続特徴トラッキング

Country Status (6)

Country Link
US (1) US9352440B2 (enExample)
JP (1) JP6440741B2 (enExample)
KR (1) KR102368644B1 (enExample)
CN (1) CN106463378B (enExample)
TW (1) TWI654678B (enExample)
WO (1) WO2015167790A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
KR102131090B1 (ko) * 2014-04-22 2020-07-07 가부시키가이샤 에바라 세이사꾸쇼 연마 방법 및 연마 장치
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10898986B2 (en) * 2017-09-15 2021-01-26 Applied Materials, Inc. Chattering correction for accurate sensor position determination on wafer
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US20200035495A1 (en) * 2018-07-25 2020-01-30 Globalfoundries Inc. Chemical-mechanical polishing with variable-pressure polishing pads
WO2020067914A1 (en) * 2018-09-26 2020-04-02 Applied Materials, Inc. Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
JP2021028099A (ja) * 2019-08-09 2021-02-25 株式会社荏原製作所 終点検知装置、終点検知方法
CN110549240B (zh) * 2019-09-18 2020-12-29 清华大学 一种终点检测方法和化学机械抛光装置
CN112247740B (zh) * 2020-09-25 2025-12-09 富联裕展科技(深圳)有限公司 打磨装置、方法、辅助打磨的装置、系统及方法
CN116141178B (zh) * 2023-04-17 2023-07-18 杭州鄂达精密机电科技有限公司 一种半导体阀门的加工系统及其方法

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US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
JP2004001227A (ja) 1995-07-20 2004-01-08 Ebara Corp ポリッシング装置および方法
US6111634A (en) 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
TW398036B (en) 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
JP4484370B2 (ja) 1998-11-02 2010-06-16 アプライド マテリアルズ インコーポレイテッド 基板上のメタル層の化学機械研磨に関して終点を決定するための方法及び基板のメタル層を研磨するための装置
US6399501B2 (en) 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
JP2002359217A (ja) * 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
US7306507B2 (en) * 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
CN105773398B (zh) * 2005-08-22 2019-11-19 应用材料公司 基于光谱的监测化学机械研磨的装置及方法
US7998358B2 (en) 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
JP2011000647A (ja) * 2009-06-16 2011-01-06 Ebara Corp 研磨監視方法
JP5436969B2 (ja) * 2009-05-27 2014-03-05 株式会社荏原製作所 研磨終点検知方法、研磨終点検知装置、研磨方法、および研磨装置
JP5339859B2 (ja) * 2008-11-07 2013-11-13 株式会社東京精密 研磨終了時点の検出方法及び検出装置
US8352061B2 (en) * 2008-11-14 2013-01-08 Applied Materials, Inc. Semi-quantitative thickness determination
US8751033B2 (en) * 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
JP5376293B2 (ja) * 2008-11-17 2013-12-25 株式会社ニコン 終点検出装置および研磨装置
KR101956838B1 (ko) * 2009-11-03 2019-03-11 어플라이드 머티어리얼스, 인코포레이티드 시간에 대한 스펙트럼들 등고선 플롯들의 피크 위치를 이용한 종료점 방법
WO2011139571A2 (en) * 2010-05-05 2011-11-10 Applied Materials, Inc. Dynamically or adaptively tracking spectrum features for endpoint detection
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US8930013B2 (en) 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
TWI478259B (zh) * 2010-07-23 2015-03-21 Applied Materials Inc 用於終點偵測之二維光譜特徵追蹤
KR101981814B1 (ko) * 2011-04-28 2019-05-23 어플라이드 머티어리얼스, 인코포레이티드 연마를 위한 모델 기반 스펙트럼 라이브러리의 생성
KR101892914B1 (ko) * 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅

Also Published As

Publication number Publication date
US20150314415A1 (en) 2015-11-05
CN106463378A (zh) 2017-02-22
KR20160148676A (ko) 2016-12-26
WO2015167790A1 (en) 2015-11-05
US9352440B2 (en) 2016-05-31
JP2017515307A (ja) 2017-06-08
KR102368644B1 (ko) 2022-02-25
TWI654678B (zh) 2019-03-21
CN106463378B (zh) 2019-06-11
TW201606870A (zh) 2016-02-16

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