JP6595987B2 - 研磨方法 - Google Patents
研磨方法 Download PDFInfo
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- JP6595987B2 JP6595987B2 JP2016514859A JP2016514859A JP6595987B2 JP 6595987 B2 JP6595987 B2 JP 6595987B2 JP 2016514859 A JP2016514859 A JP 2016514859A JP 2016514859 A JP2016514859 A JP 2016514859A JP 6595987 B2 JP6595987 B2 JP 6595987B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/05—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
1)ステップ4で求められた最小偏差の頻度が最大のスペクトルグループ(参照領域候補)を、最適スペクトルグループ(最適参照領域)とするか、又は
2)ステップ4で求められた最小偏差のうち、最小のものに対応するスペクトルグループ(参照領域候補)を、最適スペクトルグループ(最適参照領域)とする。
1a 研磨面
3 研磨テーブル
3a テーブル軸
5 研磨ヘッド
6 キャリヤ
7 弾性膜
7a 仕切り壁
8 リテーナリング
9 弾性膜
10 研磨液供給ノズル
12 研磨制御部
16 研磨ヘッドシャフト
17 連結手段
18 研磨ヘッドモータ
19 テーブルモータ
20 上下動機構
25 光学式膜厚測定器
31 膜厚センサ
32 処理部
42 投光部
43 受光部(光ファイバー)
44 分光器
47 光源
48 光ファイバー
50A 第1の孔
50B 第2の孔
51 通孔
53 液体供給路
54 液体排出路
55 液体供給源
58 記憶装置
60 データサーバ
61 スペクトルグループデータベース
62 スペクトルグループ選択履歴データベース
70 研磨装置
D1,D2,D3,D4 圧力室
G1,G2,G3,G4 流体ライン
U1,U2,U3,U4 真空ライン
Claims (2)
- 異なる膜厚に対応する複数の参照スペクトルをそれぞれ含む複数のスペクトルグループを用意し、
前記複数のスペクトルグループのうち、互いに形状が近い参照スペクトルを含むスペクトルグループを予め排除し、
基板に光を照射しながら、該基板からの反射光を受光し、
スペクトルグループを選択するためのサンプリングスペクトルを前記反射光から生成し、
前記サンプリングスペクトルに最も形状が近い参照スペクトルを含むスペクトルグループを選択し、
前記基板を研磨しながら、膜厚を取得するための測定スペクトルを生成し、
前記基板の研磨中に生成された前記測定スペクトルに最も形状が近い参照スペクトルを前記選択されたスペクトルグループから選択し、
前記選択された参照スペクトルに対応する膜厚を取得することを特徴とする研磨方法。 - 参照基板を研磨して複数の参照スペクトルを含む少なくとも1つのスペクトルグループを取得し、
前記参照基板の膜厚の時間変化を表す推定線上の参照スペクトルを、研磨レートが一定であると仮定したときの前記参照基板の膜厚の時間変化を表す仮想線上に移動させることによって、前記参照基板の研磨レートが一定とみなせるように前記複数の参照スペクトルを補正して、異なる膜厚に対応する複数の補正参照スペクトルを取得し、
基板に光を照射しながら、該基板からの反射光を受光し、
前記基板を研磨しながら、膜厚を取得するための測定スペクトルを生成し、
前記基板の研磨中に生成された前記測定スペクトルに最も形状が近い補正参照スペクトルを前記少なくとも1つのスペクトルグループから選択し、
前記選択された補正参照スペクトルに対応する膜厚を取得することを特徴とする研磨方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014087945 | 2014-04-22 | ||
JP2014087945 | 2014-04-22 | ||
PCT/JP2015/061224 WO2015163164A1 (ja) | 2014-04-22 | 2015-04-10 | 研磨方法および研磨装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2015163164A1 JPWO2015163164A1 (ja) | 2017-04-13 |
JP6595987B2 true JP6595987B2 (ja) | 2019-10-23 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016514859A Active JP6595987B2 (ja) | 2014-04-22 | 2015-04-10 | 研磨方法 |
Country Status (6)
Country | Link |
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US (1) | US10399203B2 (ja) |
JP (1) | JP6595987B2 (ja) |
KR (1) | KR102131090B1 (ja) |
CN (1) | CN106457507B (ja) |
TW (1) | TWI657894B (ja) |
WO (1) | WO2015163164A1 (ja) |
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2015
- 2015-04-10 JP JP2016514859A patent/JP6595987B2/ja active Active
- 2015-04-10 WO PCT/JP2015/061224 patent/WO2015163164A1/ja active Application Filing
- 2015-04-10 KR KR1020167031720A patent/KR102131090B1/ko active IP Right Grant
- 2015-04-10 US US15/304,829 patent/US10399203B2/en active Active
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TWI657894B (zh) | 2019-05-01 |
TW201544250A (zh) | 2015-12-01 |
KR20160147823A (ko) | 2016-12-23 |
CN106457507B (zh) | 2019-04-09 |
US20170190020A1 (en) | 2017-07-06 |
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