JP6429582B2 - 表面実装機の部品保持ヘッド - Google Patents
表面実装機の部品保持ヘッド Download PDFInfo
- Publication number
- JP6429582B2 JP6429582B2 JP2014208223A JP2014208223A JP6429582B2 JP 6429582 B2 JP6429582 B2 JP 6429582B2 JP 2014208223 A JP2014208223 A JP 2014208223A JP 2014208223 A JP2014208223 A JP 2014208223A JP 6429582 B2 JP6429582 B2 JP 6429582B2
- Authority
- JP
- Japan
- Prior art keywords
- spindle
- component
- nozzle
- head
- rotary head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001133 acceleration Effects 0.000 claims description 22
- 239000013307 optical fiber Substances 0.000 description 20
- 238000001514 detection method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000001174 ascending effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014208223A JP6429582B2 (ja) | 2014-10-09 | 2014-10-09 | 表面実装機の部品保持ヘッド |
KR1020140169978A KR102025372B1 (ko) | 2014-10-09 | 2014-12-01 | 부품 장착기의 부품 지지 헤드 |
CN201510633674.XA CN105517425B (zh) | 2014-10-09 | 2015-09-29 | 部件安装机的部件支撑头及部件安装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014208223A JP6429582B2 (ja) | 2014-10-09 | 2014-10-09 | 表面実装機の部品保持ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016081941A JP2016081941A (ja) | 2016-05-16 |
JP6429582B2 true JP6429582B2 (ja) | 2018-11-28 |
Family
ID=55724940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014208223A Active JP6429582B2 (ja) | 2014-10-09 | 2014-10-09 | 表面実装機の部品保持ヘッド |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6429582B2 (ko) |
KR (1) | KR102025372B1 (ko) |
CN (1) | CN105517425B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6887024B2 (ja) * | 2017-12-27 | 2021-06-16 | 株式会社Fuji | 載置装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4023851B2 (ja) * | 1996-06-27 | 2007-12-19 | 松下電器産業株式会社 | 電子部品実装方法 |
JPH10284889A (ja) | 1997-04-02 | 1998-10-23 | Matsushita Electric Ind Co Ltd | ロータリーヘッド式電子部品実装装置 |
JP4104765B2 (ja) * | 1999-02-16 | 2008-06-18 | 松下電器産業株式会社 | 部品の装着方法と装置 |
US7302755B2 (en) * | 2005-02-07 | 2007-12-04 | Samsung Techwin Co., Ltd. | Head assembly for a component mounter |
JP4713353B2 (ja) * | 2006-01-31 | 2011-06-29 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP5903346B2 (ja) * | 2012-07-17 | 2016-04-13 | ヤマハ発動機株式会社 | 部品実装装置 |
JP5991888B2 (ja) * | 2012-09-07 | 2016-09-14 | ヤマハ発動機株式会社 | 電子部品装着方法及び電子部品装着装置 |
JP6008979B2 (ja) * | 2012-11-16 | 2016-10-19 | 富士機械製造株式会社 | 作業機器および部品実装機 |
WO2014125648A1 (ja) * | 2013-02-18 | 2014-08-21 | 富士機械製造株式会社 | 電子回路部品装着装置 |
JP6178693B2 (ja) * | 2013-10-09 | 2017-08-09 | ハンファテクウィン株式会社Hanwha Techwin Co.,Ltd. | 表面実装機の部品保持ヘッド |
-
2014
- 2014-10-09 JP JP2014208223A patent/JP6429582B2/ja active Active
- 2014-12-01 KR KR1020140169978A patent/KR102025372B1/ko active IP Right Grant
-
2015
- 2015-09-29 CN CN201510633674.XA patent/CN105517425B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2016081941A (ja) | 2016-05-16 |
CN105517425A (zh) | 2016-04-20 |
KR20160042369A (ko) | 2016-04-19 |
CN105517425B (zh) | 2019-11-05 |
KR102025372B1 (ko) | 2019-09-25 |
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