JP6370387B2 - オプトエレクトロニクス半導体部品と、自動車用のアダプティブヘッドライト - Google Patents
オプトエレクトロニクス半導体部品と、自動車用のアダプティブヘッドライト Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 142
- 230000003044 adaptive effect Effects 0.000 title claims description 22
- 230000005693 optoelectronics Effects 0.000 title claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000001746 injection moulding Methods 0.000 claims description 10
- 239000012778 molding material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- -1 nitride compound Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Description
Claims (12)
- 取り付けプラットフォーム(11)と複数のオプトエレクトロニクス半導体部品(1)とを備えたアダプティブヘッドライト(10)であって、
前記複数の半導体部品(1)はそれぞれ、
・支持体上面(23)と支持体下面(24)とを有する支持体(2)と、
・前記支持体上面(23)に取り付けられており、かつ、ビームを放射するように構成されている複数のアクティブ領域(33)と、
・少なくとも、前記相応する半導体部品(1)と電気的に接続するように構成されている、前記支持体下面(24)に位置する少なくとも3つの電気的なコンタクト箇所(4)と、
・前記相応する半導体部品(1)を電気的にアドレッシングし、かつ、前記アクティブ領域(33)を電気的に駆動制御する少なくとも1つの駆動制御ユニット(5)とを含んでおり、かつ、
・前記アクティブ領域(33)は、平面図で見て、規則的な格子で、前記半導体部品(1)の前記支持体上面(23)に取り付けられており、
・前記格子は、格子間隔(M)を有しており、
・平面図で見て、前記複数の半導体部品(1)内で、それぞれ、前記アクティブ領域(33)のビーム主要面(30)の幾何学形状的な中心点(P)は、最大で、前記格子間隔(M)の20%の公差で、前記格子の格子点上に位置し、
・縁部にあるアクティブ領域(33)の前記幾何学形状的な中心点(P)と、前記属する半導体部品(1)の前記支持体(2)の最も近い縁辺との間の間隔(D)は、最大で、前記格子間隔(M)の50%であり、
・前記半導体部品(1)の全てのアクティブ領域(33)が、最大で、前記格子間隔(M)の20%の公差で、前記規則的な格子の前記格子点上に位置するように、前記半導体部品(1)は前記取り付けプラットフォーム(11)上に配置されており、
・前記格子は、全ての半導体部品(1)にわたって不変に延在しており、
・複数の前記半導体部品(1)は厳密に1つの共通のデータ線路(8)を介して相互に接続されており、
・前記ヘッドライト(10)の個々のアクティブ領域(33)またはアクティブ領域(33)のグループは、前記駆動制御ユニット(5)を介して、相互に依存しないで駆動制御可能であり、
・前記複数の半導体部品(1)は、前記少なくとも3つの電気的なコンタクト箇所(4)から構成される、共通の電圧線路(VCC)、共通のアース線路(GND)、および、前記共通のデータ線路(8)を有している、
ことを特徴とする、アダプティブヘッドライト(10)。 - 前記複数のオプトエレクトロニクス半導体部品(1)はそれぞれ表面実装可能であり、
・前記各アクティブ領域(33)は、厳密に1つのオプトエレクトロニクス半導体チップ(3)によって形成されており、
・平面図で見て、前記オプトエレクトロニクス半導体チップ(3)は、前記格子に従って配置されており、
・前記格子は、長方形のn×mマトリクスであり、格子間隔(M)を有しており、
・nおよびmは、2から12までの間の自然数であり、
・前記複数のアクティブ領域(33)は平面図で見て、それぞれ厳密に1つの幾何学形状的な中心点(P)を有しており、
・全ての幾何学形状的な中心点(P)は、最大で、前記格子間隔(M)の5%の公差で、前記格子の前記格子点上に位置する、請求項1記載のアダプティブヘッドライト(10)。 - 前記支持体(2)から離れる方向において、前記アクティブ領域(33)の後方に、部分的にビームを変換する変換部材(6)がそれぞれ1つ配置されており、
平面図で見て、前記複数の変換部材(6)は、前記ビーム主要面(30)をそれぞれ完全に覆い、
平面図で見て、前記複数の変換部材(6)は、それぞれ、反射体注入成形材(7)によって周りを包囲されている、請求項1または2記載のアダプティブヘッドライト(10)。 - 隣り合うアクティブ領域(33)間および隣り合う半導体チップ(3)間の平均間隔は最大で、前記格子間隔(M)の50%である、請求項1から3までのいずれか1項記載のアダプティブヘッドライト(10)。
- 前記複数の支持体(2)はそれぞれシリコン支持体またはゲルマニウム支持体であり、当該支持体内に複数の前記属する駆動制御ユニット(5)がモノリシックに組み込まれており、
前記複数の駆動制御ユニット(5)はそれぞれ、シリコンまたはゲルマニウムをベースにしている複数のトランジスタを含んでいる、請求項1から4までのいずれか1項記載のアダプティブヘッドライト(10)。 - 前記各支持体上面(23)には、それぞれ、再結晶シリコンから成る層が取り付けられており、当該層は、前記属する駆動制御ユニット(5)を形成し、かつ、前記属する支持体(2)と前記アクティブ領域(33)との間に位置している、請求項1から4までのいずれか1項記載のアダプティブヘッドライト(10)。
- 前記複数の駆動制御ユニット(5)は、それぞれ、1つのデータ入力側と、複数の信号出力側とを備えた直列シフトレジスタを含んでおり、
前記信号出力側は導電性にスイッチと接続されており、各スイッチは、前記アクティブ領域(33)のうちの1つと電気的に並列に接続されている、請求項1から6までのいずれか1項記載のアダプティブヘッドライト(10)。 - 前記各支持体下面(24)に、それぞれ、前記電圧線路(VCC)用の厳密に1つの電気的なコンタクト面と、前記アース線路(GND)用の厳密に1つの電気的なコンタクト面と、前記データ線路(8)用の2つのコンタクト面とを有しており、データ入力用のコンタクト箇所(Din)と、データ出力用のコンタクト箇所(Dout)とに分けられている、請求項1から7までのいずれか1項記載のアダプティブヘッドライト(10)。
- 半導体部品(1)毎に厳密に4つの電気的なコンタクト箇所(4)が、前記支持体下面(24)に設けられている、請求項8記載のアダプティブヘッドライト(10)。
- 全てのアクティブ領域(33)および全ての半導体チップ(3)は、動作時に同じ色の光を放射し、
当該色は固定されており、調整可能ではない、請求項1から9までのいずれか1項記載のアダプティブヘッドライト(10)。 - 複数の前記アクティブ領域(33)は、共通の成長基板(32)を有しており、
隣り合うアクティブ領域(33)の間で、前記アクティブ領域(33)を形成する半導体材料が完全にまたは部分的に除去されている、請求項1から10までのいずれか1項記載のアダプティブヘッドライト(10)。 - 前記データ線路(8)は、全ての半導体部品(1)を貫いて接続されており、
前記駆動制御ユニット(5)を介して、個々の前記アクティブ領域(33)が前記各半導体部品(1)内でも、相互に依存せずに駆動制御可能である、請求項1から11までのいずれか1項記載のアダプティブヘッドライト(10)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013114691.0 | 2013-12-20 | ||
DE102013114691.0A DE102013114691A1 (de) | 2013-12-20 | 2013-12-20 | Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug |
PCT/EP2014/076602 WO2015091005A1 (de) | 2013-12-20 | 2014-12-04 | Optoelektronisches halbleiterbauteil und adaptiver scheinwerfer für ein kraftfahrzeug |
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JP2017502515A JP2017502515A (ja) | 2017-01-19 |
JP6370387B2 true JP6370387B2 (ja) | 2018-08-08 |
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JP2016541476A Active JP6370387B2 (ja) | 2013-12-20 | 2014-12-04 | オプトエレクトロニクス半導体部品と、自動車用のアダプティブヘッドライト |
Country Status (6)
Country | Link |
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US (1) | US9964270B2 (ja) |
JP (1) | JP6370387B2 (ja) |
KR (1) | KR102193174B1 (ja) |
CN (1) | CN105830215B (ja) |
DE (2) | DE102013114691A1 (ja) |
WO (1) | WO2015091005A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102013114691A1 (de) | 2013-12-20 | 2015-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug |
DE102015118433A1 (de) * | 2015-10-28 | 2017-05-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
JP6782539B2 (ja) * | 2015-11-24 | 2020-11-11 | スタンレー電気株式会社 | 発光装置 |
DE102016105777A1 (de) * | 2016-03-30 | 2017-10-05 | Osram Opto Semiconductors Gmbh | Bauelement |
JP6812695B2 (ja) * | 2016-08-08 | 2021-01-13 | 市光工業株式会社 | 車両用灯具 |
FR3065116B1 (fr) | 2017-04-05 | 2021-08-27 | Commissariat Energie Atomique | Dispositif d'affichage d'images emissif a led |
FR3065117B1 (fr) * | 2017-04-05 | 2019-07-05 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif d'affichage d'images emissif a led |
FR3066320B1 (fr) | 2017-05-11 | 2019-07-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un dispositif d'affichage emissif a led |
DE102017126044A1 (de) * | 2017-11-08 | 2019-05-09 | HELLA GmbH & Co. KGaA | Schaltungsanordnung einer Leuchteinheit eines Scheinwerfers für ein Fahrzeug |
US10674582B1 (en) | 2018-11-15 | 2020-06-02 | Abl Ip Holding Llc | Adaptive surface illumination |
FR3104819A1 (fr) * | 2019-12-12 | 2021-06-18 | Valeo Vision | Source lumineuse a elements semiconducteurs electroluminescents |
FR3119664B1 (fr) * | 2021-02-09 | 2023-01-20 | Valeo Vision | Source lumineuse pour la signalisation d’un véhicule automobile |
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JP4013507B2 (ja) * | 2001-09-17 | 2007-11-28 | シーシーエス株式会社 | 発光パネル装置 |
JP3928413B2 (ja) * | 2001-11-15 | 2007-06-13 | ソニー株式会社 | 画像表示装置の駆動方法及び画像表示装置 |
DE102005009060A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Modul mit strahlungsemittierenden Halbleiterkörpern |
JP5010108B2 (ja) * | 2005-03-25 | 2012-08-29 | 株式会社沖データ | 半導体複合装置、プリントヘッド、及びそれを用いた画像形成装置 |
JP4753419B2 (ja) * | 2005-08-05 | 2011-08-24 | パナソニック株式会社 | 発光モジュール |
JP2007165791A (ja) * | 2005-12-16 | 2007-06-28 | Nippon Leiz Co Ltd | 光源装置 |
JP4905069B2 (ja) | 2006-11-09 | 2012-03-28 | 豊田合成株式会社 | 発光装置及びその製造方法 |
RU2489774C2 (ru) * | 2007-11-29 | 2013-08-10 | Нития Корпорейшн | Светоизлучающее устройство и способ его изготовления |
JP2010010476A (ja) * | 2008-06-27 | 2010-01-14 | Omron Corp | 発光ダイオード駆動装置および方法、並びにプログラム |
CN102089893B (zh) * | 2008-07-07 | 2013-02-06 | 格罗有限公司 | 纳米结构led |
JP5442027B2 (ja) | 2009-02-09 | 2014-03-12 | ホエジョウ・ライト・エンジン・リミテッド | メッシュプラットフォーム上の発光ダイオード光アレイ |
DE102009041189A1 (de) * | 2009-09-14 | 2011-03-24 | Bayerische Motoren Werke Aktiengesellschaft | Fahrzeugscheinwerfer |
US8344659B2 (en) * | 2009-11-06 | 2013-01-01 | Neofocal Systems, Inc. | System and method for lighting power and control system |
EP2386792B1 (de) * | 2010-05-12 | 2013-09-11 | Zizala Lichtsysteme GmbH | LED-Lichtmodul |
DE102010029149B4 (de) | 2010-05-20 | 2012-04-05 | Robert Bosch Gmbh | Verfahren und Steuergerät zum Plausibilisieren eines Leuchtweite-Testwerts eines Lichtkegels eines Fahrzeugscheinwerfers |
TWI478319B (zh) * | 2010-07-20 | 2015-03-21 | Epistar Corp | 整合式發光裝置及其製造方法 |
JP2012114184A (ja) * | 2010-11-24 | 2012-06-14 | Hitachi Cable Ltd | 発光ダイオード |
DE102011102032A1 (de) * | 2011-05-19 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleitermodul und Display mit einer Mehrzahl derartiger Module |
US8773006B2 (en) | 2011-08-22 | 2014-07-08 | Lg Innotek Co., Ltd. | Light emitting device package, light source module, and lighting system including the same |
DE102011056888A1 (de) | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
DE102012101160A1 (de) | 2012-02-14 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Lichtquellenmodul |
JP2013171942A (ja) * | 2012-02-20 | 2013-09-02 | Oki Data Corp | 発光装置、led装置、及び表示装置 |
JP6052952B2 (ja) * | 2012-03-22 | 2016-12-27 | 株式会社小糸製作所 | 発光モジュールおよび車両用灯具 |
EP2898357A1 (en) * | 2012-09-20 | 2015-07-29 | Koninklijke Philips N.V. | Optical device, lens, lighting device, system and method |
DE102012109460B4 (de) | 2012-10-04 | 2024-03-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Leuchtdioden-Displays und Leuchtdioden-Display |
DE102012111247A1 (de) | 2012-11-21 | 2014-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
DE102012112302A1 (de) | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
US8944656B1 (en) * | 2013-11-13 | 2015-02-03 | E-Lead Electronic Co., Ltd. | Vehicle infrared projection device |
DE102013114691A1 (de) | 2013-12-20 | 2015-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug |
-
2013
- 2013-12-20 DE DE102013114691.0A patent/DE102013114691A1/de not_active Withdrawn
-
2014
- 2014-12-04 WO PCT/EP2014/076602 patent/WO2015091005A1/de active Application Filing
- 2014-12-04 JP JP2016541476A patent/JP6370387B2/ja active Active
- 2014-12-04 US US15/032,502 patent/US9964270B2/en active Active
- 2014-12-04 DE DE112014005960.9T patent/DE112014005960B4/de active Active
- 2014-12-04 CN CN201480069853.9A patent/CN105830215B/zh active Active
- 2014-12-04 KR KR1020167015333A patent/KR102193174B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE112014005960A5 (de) | 2016-09-29 |
CN105830215A (zh) | 2016-08-03 |
WO2015091005A1 (de) | 2015-06-25 |
DE102013114691A1 (de) | 2015-06-25 |
JP2017502515A (ja) | 2017-01-19 |
CN105830215B (zh) | 2018-10-12 |
US20160258588A1 (en) | 2016-09-08 |
DE112014005960B4 (de) | 2020-01-02 |
KR20160100947A (ko) | 2016-08-24 |
KR102193174B1 (ko) | 2020-12-18 |
US9964270B2 (en) | 2018-05-08 |
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