JP6348829B2 - ケーブルアッセンブリ及びケーブルアッセンブリの製造方法 - Google Patents
ケーブルアッセンブリ及びケーブルアッセンブリの製造方法 Download PDFInfo
- Publication number
- JP6348829B2 JP6348829B2 JP2014249252A JP2014249252A JP6348829B2 JP 6348829 B2 JP6348829 B2 JP 6348829B2 JP 2014249252 A JP2014249252 A JP 2014249252A JP 2014249252 A JP2014249252 A JP 2014249252A JP 6348829 B2 JP6348829 B2 JP 6348829B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive plate
- cable
- cable assembly
- line
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 22
- 239000004020 conductor Substances 0.000 claims description 91
- 239000012212 insulator Substances 0.000 claims description 87
- 238000004804 winding Methods 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000012466 permeate Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0098—Shielding materials for shielding electrical cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/002—Pair constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/26—Sheathing; Armouring; Screening; Applying other protective layers by winding, braiding or longitudinal lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014249252A JP6348829B2 (ja) | 2014-12-09 | 2014-12-09 | ケーブルアッセンブリ及びケーブルアッセンブリの製造方法 |
| EP15868092.6A EP3232447B1 (en) | 2014-12-09 | 2015-11-11 | Cable assembly and cable assembly manufacturing method |
| CN201580067040.0A CN107046814B (zh) | 2014-12-09 | 2015-11-11 | 电缆组件和电缆组件制造方法 |
| MX2017006059A MX383912B (es) | 2014-12-09 | 2015-11-11 | Ensamblaje de cable y método para la manufactura de ensamblaje de cable. |
| PCT/JP2015/081744 WO2016093012A1 (ja) | 2014-12-09 | 2015-11-11 | ケーブルアッセンブリ及びケーブルアッセンブリの製造方法 |
| US15/529,761 US10188020B2 (en) | 2014-12-09 | 2015-11-11 | Cable assembly and cable assembly manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014249252A JP6348829B2 (ja) | 2014-12-09 | 2014-12-09 | ケーブルアッセンブリ及びケーブルアッセンブリの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016110916A JP2016110916A (ja) | 2016-06-20 |
| JP2016110916A5 JP2016110916A5 (enExample) | 2017-10-19 |
| JP6348829B2 true JP6348829B2 (ja) | 2018-06-27 |
Family
ID=56107206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014249252A Active JP6348829B2 (ja) | 2014-12-09 | 2014-12-09 | ケーブルアッセンブリ及びケーブルアッセンブリの製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10188020B2 (enExample) |
| EP (1) | EP3232447B1 (enExample) |
| JP (1) | JP6348829B2 (enExample) |
| CN (1) | CN107046814B (enExample) |
| MX (1) | MX383912B (enExample) |
| WO (1) | WO2016093012A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3074616B1 (fr) * | 2017-12-06 | 2019-11-01 | Raydiall | Piece d'adaptation d'impedance electrique pour connecteur monte sur cable a fils electriques isoles |
| DE102018104253B4 (de) * | 2018-02-26 | 2019-12-05 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Steckverbinderanordnung |
| JP7206906B2 (ja) * | 2018-12-28 | 2023-01-18 | 株式会社オートネットワーク技術研究所 | 端子モジュールおよびコネクタ |
| JP6866887B2 (ja) * | 2018-12-28 | 2021-04-28 | 株式会社オートネットワーク技術研究所 | 端子付き電線、端子モジュールおよびコネクタ |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345905A (ja) * | 1998-06-02 | 1999-12-14 | Mitsubishi Electric Corp | 半導体装置 |
| JP3645170B2 (ja) | 2000-10-27 | 2005-05-11 | タイコエレクトロニクスアンプ株式会社 | 電気ケーブル端部構造および電気ケーブル端部処理方法 |
| JP2004071404A (ja) * | 2002-08-07 | 2004-03-04 | Auto Network Gijutsu Kenkyusho:Kk | ツイストペア電線の端末部分のインピーダンス調整方法及びその端末処理構造 |
| JP2005038617A (ja) | 2003-07-15 | 2005-02-10 | Totoku Electric Co Ltd | 高速ディファレンシャル信号伝送用コネクタ付きケーブルハーネスの接続構造 |
| US6790051B1 (en) * | 2003-12-20 | 2004-09-14 | Lear Corporation | Connector for printed circuit board |
| JP2005294174A (ja) | 2004-04-02 | 2005-10-20 | Toshiba Corp | ケーブル固定処理装置 |
| CN101569063B (zh) * | 2007-05-29 | 2011-08-31 | 株式会社自动网络技术研究所 | 屏蔽连接器 |
| JP5066243B2 (ja) * | 2010-06-08 | 2012-11-07 | ヒロセ電機株式会社 | 電気コネクタ、およびツイストペアケーブルと電気コネクタとの接続方法 |
| WO2013006592A2 (en) * | 2011-07-07 | 2013-01-10 | Molex Incorporated | High performance cable with faraday ground sleeve |
| JP2013069509A (ja) * | 2011-09-21 | 2013-04-18 | Auto Network Gijutsu Kenkyusho:Kk | ハーネス |
| JP2014045016A (ja) * | 2012-08-24 | 2014-03-13 | Panasonic Corp | 通信ケーブル |
| KR101514565B1 (ko) * | 2013-11-14 | 2015-04-22 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판 |
| KR101701022B1 (ko) * | 2015-01-20 | 2017-01-31 | 삼성전기주식회사 | 적층 세라믹 전자부품, 그 제조방법 및 전자부품이 실장된 회로기판 |
| JP6405327B2 (ja) * | 2016-02-26 | 2018-10-17 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
-
2014
- 2014-12-09 JP JP2014249252A patent/JP6348829B2/ja active Active
-
2015
- 2015-11-11 WO PCT/JP2015/081744 patent/WO2016093012A1/ja not_active Ceased
- 2015-11-11 US US15/529,761 patent/US10188020B2/en active Active
- 2015-11-11 MX MX2017006059A patent/MX383912B/es unknown
- 2015-11-11 EP EP15868092.6A patent/EP3232447B1/en active Active
- 2015-11-11 CN CN201580067040.0A patent/CN107046814B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3232447A4 (en) | 2017-12-13 |
| JP2016110916A (ja) | 2016-06-20 |
| US10188020B2 (en) | 2019-01-22 |
| EP3232447A1 (en) | 2017-10-18 |
| WO2016093012A1 (ja) | 2016-06-16 |
| MX2017006059A (es) | 2017-07-27 |
| CN107046814B (zh) | 2019-08-13 |
| MX383912B (es) | 2025-03-14 |
| EP3232447B1 (en) | 2020-09-16 |
| CN107046814A (zh) | 2017-08-15 |
| US20170332525A1 (en) | 2017-11-16 |
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Legal Events
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| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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| A61 | First payment of annual fees (during grant procedure) |
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