JP6346911B2 - 半導体基板用集積フォトダイオード - Google Patents
半導体基板用集積フォトダイオード Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 150
- 239000004065 semiconductor Substances 0.000 title description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 45
- 229910052710 silicon Inorganic materials 0.000 claims description 45
- 239000010703 silicon Substances 0.000 claims description 45
- 230000005540 biological transmission Effects 0.000 claims description 34
- 238000002955 isolation Methods 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 7
- 230000004044 response Effects 0.000 claims description 5
- 238000012360 testing method Methods 0.000 description 48
- 238000004519 manufacturing process Methods 0.000 description 46
- 229910021332 silicide Inorganic materials 0.000 description 37
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 37
- 235000012431 wafers Nutrition 0.000 description 29
- 238000013461 design Methods 0.000 description 26
- 239000000463 material Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 22
- 239000000969 carrier Substances 0.000 description 21
- 230000003287 optical effect Effects 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000013078 crystal Substances 0.000 description 10
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 230000005684 electric field Effects 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 5
- 238000012938 design process Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/1016—Devices sensitive to infrared, visible or ultraviolet radiation comprising transparent or semitransparent devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1443—Devices controlled by radiation with at least one potential jump or surface barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
- H01L31/103—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN homojunction type
- H01L31/1037—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN homojunction type the devices comprising active layers formed only by AIVBVI compounds
Description
[関連出願の相互参照]
本出願は、米国仮出願第61/093,292号(2008年8月29日出願)の優先権を主張するものである。
図3は1つの実施の形態によるシリコン・オン・インシュレータ(SOI)水平膜フォトダイオードを示す図である。接合部が縦方向であるバルク素子(図1、2A及び2B)とは対照的に、SOI素子は一般に分離層(主として酸化物)320の上部に配された単結晶シリコンの非常に薄い層310(例えば、1000オングストローム未満)の上部に水平に形成されている。SOI素子の場合、通常N型及びP型領域は分離層320に達するように薄いシリコン層310に埋め込まれている。その結果、光起電PN接合325は垂直ではなく水平に形成され、光起電力生成用素子はすべてこのことを考慮に入れておく必要がある。
本明細書で説明した多くの実施の形態によれば、上面側から光を照射するフォトダイオードが提供される。前記のように、少なくとも一部の実施の形態においては、構造体や不透明材料(例えば、シリサイド)が存在しない基板装置又は半導体の設計領域に対応するレーザー透過領域が用いられている。
1つ以上の実施の形態によれば(i)光源(例えば、レーザー)を電力に変換する能力及び(ii)照射された光1326(例えば、レーザー)から電力を供給して電気回路及び試験構造体を動作させる能力を有するフォトダイオード1310が半導体基板1330上に形成される。フォトダイオード1310から電力供給を受ける予定の試験構造体1320及び/又は他の構造体/素子に対し1つ以上のリード線1344(即ち、接触素子)を延伸することができる。少なくとも一部の実施の形態において、半導体基板(例えば、シリコン・ウェハー)の本来の目的によって規定される素子設計製造上の制約の範囲内において、集積フォトダイオード1310が半導体基板1330の一部として形成される。
図14は1つ以上の実施の形態による、半導体基板に集積フォトダイオードを形成する方法を説明するための図である。このような方法により、図1〜9に示す集積フォトダイオード構造の一部又は全部を形成することができる。
図12に示すようなこれまでの実施の形態を参照しながら、1つのフォトダイオード構造体から成る電源を評価するため、2つのフォトダイオードを直列に重畳したところ、1つのフォトダイオードの2倍の電圧が得られた。3つのフォトダイオードを直列に重畳することにより、電源容量がさらに増加し、これにより、レーザ光が照射されると、1つのフォトダイオードの3倍の電圧が得られるであろう。重畳された2つのフォトダイオードの構成の回路接続図も得られる。集積されたフォトダイオード装置構造の実施の形態の断面は、所定の回路に適切に電力を供給するための接続部を有する。重畳されたフォトダイオードの構成の隔離は、接続部で電位を損なうかもしれない望ましくない寄生的漏電成分を抑制するために重要である。重畳された2つのフォトダイオードの間に加えられたSTI絶縁領域およびP型ドープ領域は、寄生的NPNのBETAおよび輸送電流を低下させることによって、望ましくない漏電成分を緩和するか除外する。また、2つのフォトダイオードの間の間隔を意図的に調節することによって、寄生的NPNの漏電成分をさらに緩和する。
110 P型基板
113 シリサイド
120 PN接合
121 金属接点(端末接触子)
122 P型領域
124 N型領域
144 リード線
Claims (6)
- シリコン・オン・インシュレータ(SOI)基板であって、
シリコン基板と、
前記シリコン基板上の埋込酸化物層と、
前記埋込酸化物層上のシリコン層と、
当該SOI基板上に形成された回路と、
入射する光を透過する光透過領域であり、前記埋込酸化物層及び前記シリコン層の一部を含む光透過領域と、
前記光透過領域に一致する前記シリコン基板の表面内に一体的に形成され、前記回路に電力を供給するフォトダイオードであって、複数のドープされた領域の組合せにより電気的及び光学的に隣接回路及び素子から分離されるように形成され、前記光透過領域を通しての光の照射により光起電圧を発生する少なくとも2つの逆ドープされた領域を含むフォトダイオードと、
を有し、
前記フォトダイオードが、前記回路中の第1及び第2の素子と共に集積され、前記入射する光に応答して前記第1及び第2の素子を駆動する電力を供給する、
SOI基板。 - 前記第1の素子が、リング発振器を有する、請求項1記載のSOI基板。
- 前記フォトダイオードのキャリア生成領域が、前記フォトダイオードの固有接合に近接している、請求項1記載のSOI基板。
- 入射光が、前記光透過領域を通った後においてのみ前記フォトダイオードに達する、請求項1記載のSOI基板。
- 前記フォトダイオードのN型井戸領域が、第1の高濃度にドープされたP型領域、高濃度にドープされたN型領域、および、前記第1の高濃度にドープされたP型領域と前記高濃度にドープされたN型領域との間のPN接合を含み、前記高濃度にドープされたN型領域が、前記N型井戸領域の外にある第2の高濃度にドープされたP型領域とショートされることにより、入射光に応答して前記第2のP型領域において生成される前記シリコン基板に対して正の電圧の生成を促進し、前記シリコン基板に対して前記PN接合の分離を提供する、請求項1記載のSOI基板。
- 直列スタックにて共に接続され、且つ前記第1の素子と集積された複数のフォトダイオードであり、入射光に応答して、前記第1の素子を駆動する電力を供給するようにされた複数のフォトダイオード、を形成するよう1つ以上の更なるフォトダイオードを有し、
前記直列スタックの構成が、前記第1の素子に供給される電力を、前記複数のフォトダイオードのうちの単一のフォトダイオードによって前記第1の素子に供給されるであろう電力よりも増大させる、
請求項1に記載のSOI基板。
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US9329208P | 2008-08-29 | 2008-08-29 | |
US61/093,292 | 2008-08-29 |
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2009
- 2009-08-25 US US12/547,463 patent/US8410568B2/en active Active
- 2009-08-28 JP JP2011525243A patent/JP5734854B2/ja not_active Expired - Fee Related
- 2009-08-28 TW TW098129125A patent/TW201013953A/zh unknown
- 2009-08-28 KR KR1020147027667A patent/KR101619206B1/ko active IP Right Grant
- 2009-08-28 KR KR1020117007285A patent/KR101627684B1/ko active IP Right Grant
- 2009-08-28 WO PCT/US2009/055408 patent/WO2010025391A2/en active Application Filing
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- 2014-04-01 JP JP2014075479A patent/JP2014140065A/ja active Pending
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Publication number | Publication date |
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JP2016157956A (ja) | 2016-09-01 |
KR101619206B1 (ko) | 2016-05-18 |
KR20110084876A (ko) | 2011-07-26 |
WO2010025391A3 (en) | 2010-04-22 |
US20100084729A1 (en) | 2010-04-08 |
KR101627684B1 (ko) | 2016-06-07 |
US8872297B2 (en) | 2014-10-28 |
US20130334644A1 (en) | 2013-12-19 |
TW201013953A (en) | 2010-04-01 |
JP2014140065A (ja) | 2014-07-31 |
JP5734854B2 (ja) | 2015-06-17 |
US20160104812A1 (en) | 2016-04-14 |
US8410568B2 (en) | 2013-04-02 |
JP2012501554A (ja) | 2012-01-19 |
WO2010025391A2 (en) | 2010-03-04 |
KR20140127916A (ko) | 2014-11-04 |
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