JP6337630B2 - 回路接続材料及び回路接続構造体 - Google Patents

回路接続材料及び回路接続構造体 Download PDF

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Publication number
JP6337630B2
JP6337630B2 JP2014121278A JP2014121278A JP6337630B2 JP 6337630 B2 JP6337630 B2 JP 6337630B2 JP 2014121278 A JP2014121278 A JP 2014121278A JP 2014121278 A JP2014121278 A JP 2014121278A JP 6337630 B2 JP6337630 B2 JP 6337630B2
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circuit
connection
electrode
circuit connection
conductive particles
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JP2014121278A
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Japanese (ja)
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JP2016001562A (ja
Inventor
智樹 森尻
智樹 森尻
直 工藤
直 工藤
田中　勝
勝 田中
藤縄　貢
貢 藤縄
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Priority to JP2014121278A priority Critical patent/JP6337630B2/ja
Priority to CN201510319226.2A priority patent/CN105273670B/zh
Publication of JP2016001562A publication Critical patent/JP2016001562A/ja
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  • Adhesives Or Adhesive Processes (AREA)
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JP2014121278A 2014-06-12 2014-06-12 回路接続材料及び回路接続構造体 Active JP6337630B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014121278A JP6337630B2 (ja) 2014-06-12 2014-06-12 回路接続材料及び回路接続構造体
CN201510319226.2A CN105273670B (zh) 2014-06-12 2015-06-11 电路连接材料和电路连接结构体

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JP2014121278A JP6337630B2 (ja) 2014-06-12 2014-06-12 回路接続材料及び回路接続構造体

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JP2016001562A JP2016001562A (ja) 2016-01-07
JP6337630B2 true JP6337630B2 (ja) 2018-06-06

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6002862B1 (ja) * 2016-01-26 2016-10-05 ユーエムジー・エービーエス株式会社 強化熱可塑性樹脂組成物およびその成形品
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
JP2019179647A (ja) 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
JP2021178913A (ja) * 2020-05-13 2021-11-18 昭和電工マテリアルズ株式会社 導電性接着剤、回路接続構造体の製造方法及び回路接続構造体
CN116171311A (zh) 2021-08-06 2023-05-26 凡纳克株式会社 连接体的制造方法及连接体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100409423C (zh) * 2003-02-05 2008-08-06 千住金属工业株式会社 端子间的连接方法及半导体装置的安装方法
JP2004265823A (ja) * 2003-03-04 2004-09-24 Asahi Kasei Electronics Co Ltd 異方導電性フィルム及びその接続体
JP2007248694A (ja) * 2006-03-15 2007-09-27 Epson Imaging Devices Corp 電気光学装置及び電子機器
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
KR101683312B1 (ko) * 2008-09-30 2016-12-06 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법
JP5476262B2 (ja) * 2010-09-14 2014-04-23 積水化学工業株式会社 接続構造体及び接続構造体の製造方法
JP5559723B2 (ja) * 2011-02-23 2014-07-23 積水化学工業株式会社 接続構造体の製造方法
JP5965666B2 (ja) * 2011-02-25 2016-08-10 積水化学工業株式会社 接続構造体の製造方法及び異方性導電材料
JP6197263B2 (ja) * 2012-02-06 2017-09-20 ソニー株式会社 マイクロチップ
JP6438194B2 (ja) * 2013-01-24 2018-12-12 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
KR102172942B1 (ko) * 2013-01-24 2020-11-02 세키스이가가쿠 고교가부시키가이샤 기재 입자, 도전성 입자, 도전 재료 및 접속 구조체

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JP2016001562A (ja) 2016-01-07
CN105273670A (zh) 2016-01-27
CN105273670B (zh) 2020-03-24

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