JP6333761B2 - 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置 - Google Patents
圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置 Download PDFInfo
- Publication number
- JP6333761B2 JP6333761B2 JP2015071472A JP2015071472A JP6333761B2 JP 6333761 B2 JP6333761 B2 JP 6333761B2 JP 2015071472 A JP2015071472 A JP 2015071472A JP 2015071472 A JP2015071472 A JP 2015071472A JP 6333761 B2 JP6333761 B2 JP 6333761B2
- Authority
- JP
- Japan
- Prior art keywords
- slit plate
- resin
- compression molding
- slit
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 title claims description 229
- 239000011347 resin Substances 0.000 title claims description 229
- 239000000463 material Substances 0.000 title claims description 81
- 238000000748 compression moulding Methods 0.000 title claims description 47
- 238000000034 method Methods 0.000 title claims description 35
- 230000007246 mechanism Effects 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015071472A JP6333761B2 (ja) | 2015-03-31 | 2015-03-31 | 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置 |
| TW104135565A TWI652156B (zh) | 2015-03-31 | 2015-10-29 | 壓縮成形裝置之樹脂材料供應方法及供應裝置以及壓縮成形方法及壓縮成形裝置 |
| KR1020160004757A KR101787234B1 (ko) | 2015-03-31 | 2016-01-14 | 압축 성형 장치의 수지 재료 공급 방법 및 공급 장치 및 압축 성형 방법 및 압축 성형 장치 |
| CN201610128596.2A CN106003518B (zh) | 2015-03-31 | 2016-03-08 | 压缩成形装置、树脂材料供应方法及装置、压缩成形方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015071472A JP6333761B2 (ja) | 2015-03-31 | 2015-03-31 | 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016190393A JP2016190393A (ja) | 2016-11-10 |
| JP2016190393A5 JP2016190393A5 (enExample) | 2017-04-20 |
| JP6333761B2 true JP6333761B2 (ja) | 2018-05-30 |
Family
ID=57082941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015071472A Active JP6333761B2 (ja) | 2015-03-31 | 2015-03-31 | 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6333761B2 (enExample) |
| KR (1) | KR101787234B1 (enExample) |
| CN (1) | CN106003518B (enExample) |
| TW (1) | TWI652156B (enExample) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3380633A (en) | 1967-01-16 | 1968-04-30 | Vern F. Du Bois | Multiple cavity gunpowder dispenser |
| JP3356728B2 (ja) * | 1999-08-27 | 2002-12-16 | 日清紡績株式会社 | 燃料電池セパレータ用の粉末状原料の投入装置、燃料電池セパレータの製造方法、及び燃料電池セパレータ |
| JP3812287B2 (ja) * | 2000-06-01 | 2006-08-23 | コニカミノルタホールディングス株式会社 | 成形型、成形装置、成形方法、射出成形機、射出圧縮成形機、圧縮成形機及びガラス成形機 |
| JP2002059442A (ja) * | 2000-08-22 | 2002-02-26 | Urushido Plastic Kogyo:Kk | 成型方法及び材料供給装置 |
| JP4326786B2 (ja) * | 2002-11-26 | 2009-09-09 | Towa株式会社 | 樹脂封止装置 |
| JP2005118786A (ja) * | 2003-10-14 | 2005-05-12 | Meiki Co Ltd | 圧縮成形機の材料供給装置と材料供給方法 |
| JP4415048B2 (ja) * | 2005-10-12 | 2010-02-17 | 関西チューブ株式会社 | 閉鎖型チューブの頭部形成方法、閉鎖型チューブの製造方法及び閉鎖型チューブ容器 |
| JP4953619B2 (ja) | 2005-11-04 | 2012-06-13 | Towa株式会社 | 電子部品の樹脂封止成形装置 |
| JP5953600B2 (ja) | 2011-08-12 | 2016-07-20 | アピックヤマダ株式会社 | 樹脂供給装置、樹脂モールド装置および樹脂供給方法 |
| JP2013252693A (ja) * | 2012-06-05 | 2013-12-19 | Nitto Gosei Kk | 熱硬化性樹脂粉末原料の計量器 |
| US10532498B2 (en) * | 2012-06-12 | 2020-01-14 | Mitsubishi Chemical Corporation | Molding method for fiber-reinforced plastic structure, and vehicle wheel |
| JP5792681B2 (ja) * | 2012-06-20 | 2015-10-14 | Towa株式会社 | 樹脂供給方法、樹脂供給装置及び圧縮成形装置 |
| CN203198128U (zh) * | 2013-04-20 | 2013-09-18 | 广东科硕机械科技股份有限公司 | 一种成型机的全自动成型机构 |
-
2015
- 2015-03-31 JP JP2015071472A patent/JP6333761B2/ja active Active
- 2015-10-29 TW TW104135565A patent/TWI652156B/zh active
-
2016
- 2016-01-14 KR KR1020160004757A patent/KR101787234B1/ko active Active
- 2016-03-08 CN CN201610128596.2A patent/CN106003518B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106003518A (zh) | 2016-10-12 |
| KR101787234B1 (ko) | 2017-10-18 |
| TW201634216A (zh) | 2016-10-01 |
| CN106003518B (zh) | 2018-08-28 |
| TWI652156B (zh) | 2019-03-01 |
| JP2016190393A (ja) | 2016-11-10 |
| KR20160117157A (ko) | 2016-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5906528B2 (ja) | モールド金型及びこれを用いた樹脂モールド装置 | |
| JP5824765B2 (ja) | 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ | |
| JP6137679B2 (ja) | 樹脂モールド装置および樹脂モールド方法 | |
| JP6049597B2 (ja) | 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置 | |
| JP3680005B2 (ja) | 半導体装置の製造方法及び樹脂封止装置 | |
| JP4326786B2 (ja) | 樹脂封止装置 | |
| JP3207837B2 (ja) | 半導体装置の製造方法および樹脂封止装置 | |
| WO2014199733A1 (ja) | 樹脂モールド金型及び樹脂モールド装置 | |
| KR102184809B1 (ko) | 수지 성형 장치 및 수지 성형품의 제조 방법 | |
| KR102220397B1 (ko) | 수지 성형 장치 및 수지 성형품의 제조 방법 | |
| JP6017634B1 (ja) | 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法 | |
| JP6349376B2 (ja) | 圧縮成形装置の樹脂材料供給装置及び方法、並びに圧縮成形装置及び樹脂成形品製造方法 | |
| JP6333761B2 (ja) | 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置 | |
| JP2004119803A (ja) | 電子部品の樹脂注入方法及び装置 | |
| JP6080907B2 (ja) | 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法 | |
| JP6039750B1 (ja) | 圧縮成形装置の樹脂材料供給装置及び圧縮成形装置 | |
| JP6611631B2 (ja) | 樹脂モールド方法及び樹脂モールド装置 | |
| JP6371816B2 (ja) | 半導体装置の製造方法、半導体製造装置 | |
| JP6257737B2 (ja) | 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法 | |
| JP6270969B2 (ja) | 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170316 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170316 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180125 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180130 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180312 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180403 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180425 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6333761 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |