JP6320387B2 - 埋設ｓｅｍ構造オーバーレイ標的を用いたｏｖｌのためのデバイス相関計測法（ｄｃｍ） - Google Patents

埋設ｓｅｍ構造オーバーレイ標的を用いたｏｖｌのためのデバイス相関計測法（ｄｃｍ） Download PDF

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JP6320387B2
JP6320387B2 JP2015531199A JP2015531199A JP6320387B2 JP 6320387 B2 JP6320387 B2 JP 6320387B2 JP 2015531199 A JP2015531199 A JP 2015531199A JP 2015531199 A JP2015531199 A JP 2015531199A JP 6320387 B2 JP6320387 B2 JP 6320387B2
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periodic structure
layer
target
overlay
periodic
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JP2015532733A (ja
JP2015532733A5 (enExample
Inventor
ヌリエル アミール
ヌリエル アミール
ドンサブ チョイ
ドンサブ チョイ
タル イタズコヴィッチ
タル イタズコヴィッチ
ダニエル カンデル
ダニエル カンデル
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KLA Corp
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KLA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
JP2015531199A 2012-09-06 2013-09-05 埋設ｓｅｍ構造オーバーレイ標的を用いたｏｖｌのためのデバイス相関計測法（ｄｃｍ） Active JP6320387B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261697503P 2012-09-06 2012-09-06
US61/697,503 2012-09-06
US13/776,550 US9093458B2 (en) 2012-09-06 2013-02-25 Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
US13/776,550 2013-02-25
PCT/US2013/058278 WO2014039689A1 (en) 2012-09-06 2013-09-05 Device correlated metrology (dcm) for ovl with embedded sem structure overlay targets

Publications (3)

Publication Number Publication Date
JP2015532733A JP2015532733A (ja) 2015-11-12
JP2015532733A5 JP2015532733A5 (enExample) 2017-06-22
JP6320387B2 true JP6320387B2 (ja) 2018-05-09

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JP2015531199A Active JP6320387B2 (ja) 2012-09-06 2013-09-05 埋設ｓｅｍ構造オーバーレイ標的を用いたｏｖｌのためのデバイス相関計測法（ｄｃｍ）

Country Status (5)

Country Link
US (1) US9093458B2 (enExample)
JP (1) JP6320387B2 (enExample)
KR (1) KR102160840B1 (enExample)
TW (1) TWI594294B (enExample)
WO (1) WO2014039689A1 (enExample)

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Also Published As

Publication number Publication date
US9093458B2 (en) 2015-07-28
WO2014039689A1 (en) 2014-03-13
KR20150053770A (ko) 2015-05-18
JP2015532733A (ja) 2015-11-12
TWI594294B (zh) 2017-08-01
TW201419377A (zh) 2014-05-16
KR102160840B1 (ko) 2020-09-29
US20140065736A1 (en) 2014-03-06

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