KR102160840B1 - 임베디드 sem 구조물 오버레이 타겟을 갖는 ovl을 위한 디바이스 상관 계측(dcm) - Google Patents

임베디드 sem 구조물 오버레이 타겟을 갖는 ovl을 위한 디바이스 상관 계측(dcm) Download PDF

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KR102160840B1
KR102160840B1 KR1020157008261A KR20157008261A KR102160840B1 KR 102160840 B1 KR102160840 B1 KR 102160840B1 KR 1020157008261 A KR1020157008261 A KR 1020157008261A KR 20157008261 A KR20157008261 A KR 20157008261A KR 102160840 B1 KR102160840 B1 KR 102160840B1
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periodic structure
target
overlay
layer
periodic
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KR20150053770A (ko
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누리엘 아미르
동섭 최
탈 이츠코비치
다니엘 칸델
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
KR1020157008261A 2012-09-06 2013-09-05 임베디드 sem 구조물 오버레이 타겟을 갖는 ovl을 위한 디바이스 상관 계측(dcm) Active KR102160840B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261697503P 2012-09-06 2012-09-06
US61/697,503 2012-09-06
US13/776,550 2013-02-25
US13/776,550 US9093458B2 (en) 2012-09-06 2013-02-25 Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
PCT/US2013/058278 WO2014039689A1 (en) 2012-09-06 2013-09-05 Device correlated metrology (dcm) for ovl with embedded sem structure overlay targets

Publications (2)

Publication Number Publication Date
KR20150053770A KR20150053770A (ko) 2015-05-18
KR102160840B1 true KR102160840B1 (ko) 2020-09-29

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US (1) US9093458B2 (enExample)
JP (1) JP6320387B2 (enExample)
KR (1) KR102160840B1 (enExample)
TW (1) TWI594294B (enExample)
WO (1) WO2014039689A1 (enExample)

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TW201419377A (zh) 2014-05-16
KR20150053770A (ko) 2015-05-18
JP6320387B2 (ja) 2018-05-09
US20140065736A1 (en) 2014-03-06
WO2014039689A1 (en) 2014-03-13
US9093458B2 (en) 2015-07-28
JP2015532733A (ja) 2015-11-12
TWI594294B (zh) 2017-08-01

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