JP6313082B2 - 炭化珪素装置および炭化珪素装置の形成方法 - Google Patents
炭化珪素装置および炭化珪素装置の形成方法 Download PDFInfo
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- JP6313082B2 JP6313082B2 JP2014062394A JP2014062394A JP6313082B2 JP 6313082 B2 JP6313082 B2 JP 6313082B2 JP 2014062394 A JP2014062394 A JP 2014062394A JP 2014062394 A JP2014062394 A JP 2014062394A JP 6313082 B2 JP6313082 B2 JP 6313082B2
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- silicon carbide
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 713
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 710
- 238000000034 method Methods 0.000 title claims description 51
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- 239000012778 molding material Substances 0.000 claims description 59
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 150000002500 ions Chemical class 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 22
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 21
- 229920001721 polyimide Polymers 0.000 claims description 21
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 21
- 238000002513 implantation Methods 0.000 claims description 20
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
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- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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Description
本出願は2013年3月26日出願の米国特許出願第13/850,374号明細書の一部継続出願である。
また、本願は以下に記載する態様を含む。
(態様1)
炭化珪素基板と、
横方向に前記炭化珪素基板の主面を少なくとも部分的に覆う無機パッシベーション層構造と、
前記無機パッシベーション層構造に隣接する成形材料層とを含む炭化珪素装置。
(態様2)
前記炭化珪素基板と前記無機パッシベーション層構造は、前記成形材料層に接触する前記無機パッシベーション層構造の表面における電界が前記炭化珪素装置の能動状態において500kV/cmより低くなるように構成される、態様1に記載の炭化珪素装置。
(態様3)
前記炭化珪素基板は、少なくとも1つの領域において、前記炭化珪素装置の能動状態において2.3MV/cmの電界を少なくとも含むように構成される、態様2に記載の炭化珪素装置。
(態様4)
前記成形材料層は前記炭化珪素基板の少なくとも主面全体に沿って延びる、態様1に記載の炭化珪素装置。
(態様5)
前記成形材料層は、エポキシ樹脂、シリカ、またはシリカゲルのうちの少なくとも1つを少なくとも主に含む、態様1に記載の炭化珪素装置。
(態様6)
前記成形材料層は、間にポリミイド材料の無い前記無機パッシベーション層構造に隣接して配置される、態様1に記載の炭化珪素装置。
(態様7)
前記無機パッシベーション層構造は少なくとも1つの遮断領域を含み、前記炭化珪素基板の前記主面は前記無機パッシベーション層構造の前記遮断領域内では前記無機パッシベーション層構造により覆われておらず、前記成形材料層は前記無機パッシベーション層構造の前記遮断領域を貫通する、態様1に記載の炭化珪素装置。
(態様8)
前記無機パッシベーション層構造は少なくとも1つの第1層と第2層を含み、前記第1層は酸化珪素を少なくとも主として含み、前記第2層は窒化珪素を少なくとも主として含む、態様1に記載の炭化珪素装置。
(態様9)
前記第2層は前記成形材料層に隣接して配置される、態様7に記載の炭化珪素装置。
(態様10)
前記炭化珪素基板は前記炭化珪素基板のエッジにおいて前記炭化珪素基板の能動領域を囲むエッジ領域を含み、前記無機パッシベーション層構造は、少なくとも前記エッジ領域内の前記炭化珪素基板と前記成形材料層に接触して配置される、態様1に記載の炭化珪素装置。
(態様11)
前記炭化珪素基板は前記炭化珪素基板のエッジにおいて前記炭化珪素基板の能動領域を囲むエッジ領域を含み、前記炭化珪素基板は、主として第1の導電型と、前記炭化珪素基板の前記能動領域を囲む前記エッジ領域内に位置する少なくとも1つのエッジ終端領域とを有するエピタキシャル炭化珪素層を含み、前記エッジ終端領域は第2の導電型を有する、態様1に記載の炭化珪素装置。
(態様12)
前記炭化珪素基板は、第1の導電型と、前記エピタキシャル炭化珪素層内に位置する第2の導電型を有する埋め込み横方向炭化珪素エッジ終端領域とを有するエピタキシャル炭化珪素層を含み、前記埋め込み横方向炭化珪素エッジ終端領域は前記第1の導電型を含む炭化珪素表面層により覆われる、態様1に記載の炭化珪素装置。
(態様13)
前記炭化珪素表面層は、前記埋め込み横方向炭化珪素エッジ終端領域と前記炭化珪素表面層との間のpn接合の空乏領域が前記炭化珪素装置の少なくとも所定の状態において前記埋め込み横方向炭化珪素エッジ終端領域と反対の前記炭化珪素表面層の表面まで少なくともある時点で延びるように、厚さとドーピング濃度を含む、態様12に記載の炭化珪素装置。
(態様14)
前記炭化珪素表面層は前記エピタキシャル炭化珪素層の一部であり、前記埋め込み横方向炭化珪素エッジ終端領域は、前記炭化珪素表面層に相当する前記エピタキシャル炭化珪素層の表面領域を通して前記エピタキシャル炭化珪素層中に前記第2の導電型のイオンを注入することにより作製される注入領域である、態様12に記載の炭化珪素装置。
(態様15)
前記炭化珪素表面層は前記埋め込み横方向炭化珪素エッジ終端領域を含む前記エピタキシャル炭化珪素層の上に堆積されるエピタキシャル層である、態様12に記載の炭化珪素装置。
(態様16)
前記炭化珪素表面層は前記炭化珪素装置のエッジ近くの前記埋め込み横方向炭化珪素エッジ終端領域の外側端から前記炭化珪素装置の能動領域まで横方向に延び、前記能動領域は前記炭化珪素表面層に覆わずに残される、態様12に記載の炭化珪素装置。
(態様17)
炭化珪素基板と、
横方向に前記炭化珪素基板の主面を少なくとも部分的に覆う無機パッシベーション層構造とを含む炭化珪素装置であって、
前記炭化珪素基板と前記無機パッシベーション層は、前記炭化珪素基板に対向して位置する前記無機パッシベーション層構造の表面における電界が500kV/cmより低くなる一方で前記炭化珪素基板の少なくとも1つの領域が少なくとも2.3MV/cmの電界を含むように、構成される、炭化珪素装置。
(態様18)
前記炭化珪素装置は、ショットキーダイオード、マージピンショットキーダイオード、pnダイオード、バイポーラトランジスタ、電界効果トランジスタ、金属酸化物半導体トランジスタ、または接合電界効果トランジスタを含む、態様1に記載の炭化珪素装置。
(態様19)
横方向に炭化珪素基板の主面を少なくとも部分的に覆う無機パッシベーション層構造を形成する工程と、
前記無機パッシベーション層構造に隣接して成形材料層を形成する工程と、を含む炭化珪素装置の形成方法。
(態様20)
少なくとも、第1の導電型を含む炭化珪素構造のエピタキシャル炭化珪素層を形成する工程と、前記エピタキシャル炭化珪素層内に位置する第2の導電型を含む埋め込み横方向炭化珪素エッジ終端領域を形成する工程とをさらに含み、
前記埋め込み横方向炭化珪素エッジ終端領域は前記第1の導電型を含む炭化珪素表面層により覆われるように形成される、態様19に記載の方法。
110 炭化珪素基板
112 主面
114 接合終端延長領域
120 無機パッシベーション層構造
122 酸化珪素層
124 窒化珪素層
126 ポリイミド膜
130 成形材料層
140 金属層
190 炭化珪素装置
200 炭化珪素装置
210 エピタキシャル炭化珪素層
220 埋め込み横方向炭化珪素エッジ終端領域
222 空乏領域
230 炭化珪素表面層
240 金属コンタクト
250 炭化珪素装置、炭化珪素基板材料
300 炭化珪素装置
302 エッジ
304 能動チップ領域
310 nドープ炭化珪素ドリフト層
320 pドープ炭化珪素領域
330 炭化珪素表面層
350 高nドープ炭化珪素基板
360 無機パッシベーション層構造
400 炭化珪素装置
422 酸化珪素層
424 窒化珪素層
430 成形材料層
500 炭化珪素装置
510 炭化珪素基板
512 主面
520 無機パッシベーション層構造
522 表面
600 炭化珪素装置の形成方法
610 無機パッシベーション層構造形成工程
620 成形材料層形成工程
Claims (15)
- 炭化珪素基板と、
横方向に前記炭化珪素基板の主面を少なくとも部分的に覆う無機パッシベーション層構造と、
前記無機パッシベーション層構造に隣接する成形材料層とを含む炭化珪素装置であって、
前記無機パッシベーション層構造は少なくとも1つの遮断領域を含み、前記炭化珪素基板の前記主面は前記無機パッシベーション層構造の前記遮断領域内では前記無機パッシベーション層構造により覆われておらず、前記成形材料層は前記無機パッシベーション層構造の前記遮断領域を貫通し、
炭化珪素基板の少なくとも1つの領域が少なくとも2.3MV/cmの電界を含む一方で、炭化珪素基板に対して配置された無機パッシベーション構造の表面における電界が、炭化珪素装置の特定の能動状態、換言すれば、炭化珪素装置が通常または目的動作条件下で最大全電流を供給するまたは定格電流を供給する状態(定格電流とは、当該定格電流について、装置により到達されるべき寿命の50%を越える間、能動状態において装置が供給することができる電流のことをいう。)において、500kV/cmより低くなるように構成される、
炭化珪素装置。 - 前記成形材料層は前記炭化珪素基板の少なくとも主面全体に沿って延びる、請求項1に記載の炭化珪素装置。
- 前記成形材料層は、エポキシ樹脂、シリカ、またはシリカゲルのうちの少なくとも1つを少なくとも主に含む、請求項1に記載の炭化珪素装置。
- 前記成形材料層は、間にポリイミド材料の無い前記無機パッシベーション層構造に隣接して配置される、請求項1に記載の炭化珪素装置。
- 前記無機パッシベーション層構造は少なくとも1つの第1層と第2層を含み、前記第1層は酸化珪素を少なくとも主として含み、前記第2層は窒化珪素を少なくとも主として含む、請求項1に記載の炭化珪素装置。
- 前記第2層は前記成形材料層に隣接して配置される、請求項5記載の炭化珪素装置。
- 前記炭化珪素基板は前記炭化珪素基板のエッジにおいて前記炭化珪素基板の能動領域を囲むエッジ領域を含み、前記無機パッシベーション層構造は、少なくとも前記エッジ領域内の前記炭化珪素基板と前記成形材料層に接触して配置される、請求項1に記載の炭化珪素装置。
- 前記炭化珪素基板は前記炭化珪素基板のエッジにおいて前記炭化珪素基板の能動領域を囲むエッジ領域を含み、前記炭化珪素基板は、主として第1の導電型と、前記炭化珪素基板の前記能動領域を囲む前記エッジ領域内に位置する少なくとも1つのエッジ終端領域とを有するエピタキシャル炭化珪素層を含み、前記エッジ終端領域は第2の導電型を有する、請求項1に記載の炭化珪素装置。
- 前記炭化珪素基板は、第1の導電型と、前記エピタキシャル炭化珪素層内に位置する第2の導電型を有する埋め込み横方向炭化珪素エッジ終端領域とを有するエピタキシャル炭化珪素層を含み、前記埋め込み横方向炭化珪素エッジ終端領域は前記第1の導電型を含む炭化珪素表面層により覆われる、請求項8に記載の炭化珪素装置。
- 前記炭化珪素表面層は前記エピタキシャル炭化珪素層の一部であり、前記埋め込み横方向炭化珪素エッジ終端領域は、前記炭化珪素表面層に相当する前記エピタキシャル炭化珪素層の表面領域を通して前記エピタキシャル炭化珪素層中に前記第2の導電型のイオンを注入することにより作製される注入領域である、請求項9に記載の炭化珪素装置。
- 前記炭化珪素表面層は前記埋め込み横方向炭化珪素エッジ終端領域を含む前記エピタキシャル炭化珪素層の上に堆積されるエピタキシャル層である、請求項9に記載の炭化珪素装置。
- 前記炭化珪素表面層は前記炭化珪素装置のエッジ近くの前記埋め込み横方向炭化珪素エッジ終端領域の外側端から前記炭化珪素装置の能動領域まで横方向に延び、前記能動領域は前記炭化珪素表面層に覆わずに残される、請求項9に記載の炭化珪素装置。
- 前記炭化珪素装置は、ショットキーダイオード、マージピンショットキーダイオード、pnダイオード、バイポーラトランジスタ、電界効果トランジスタ、金属酸化物半導体トランジスタ、または接合電界効果トランジスタを含む、請求項1に記載の炭化珪素装置。
- 横方向に炭化珪素基板の主面を少なくとも部分的に覆う無機パッシベーション層構造を形成する工程と、
前記無機パッシベーション層構造に隣接して成形材料層を形成する工程と、を含む炭化珪素装置の形成方法であって、
前記無機パッシベーション層構造は少なくとも1つの遮断領域を含み、前記炭化珪素基板の前記主面は前記無機パッシベーション層構造の前記遮断領域内では前記無機パッシベーション層構造により覆われておらず、前記成形材料層は前記無機パッシベーション層構造の前記遮断領域を貫通し、
炭化珪素基板の少なくとも1つの領域が少なくとも2.3MV/cmの電界を含む一方で、炭化珪素基板に対して配置された無機パッシベーション構造の表面における電界が、炭化珪素装置の特定の能動状態、換言すれば、炭化珪素装置が通常または目的動作条件下で最大全電流を供給するまたは定格電流を供給する状態(定格電流とは、当該定格電流について、装置により到達されるべき寿命の50%を越える間、能動状態において装置が供給することができる電流のことをいう。)において、500kV/cmより低くなるように構成される、方法。 - 少なくとも、第1の導電型を含む炭化珪素構造のエピタキシャル炭化珪素層を形成する工程と、前記エピタキシャル炭化珪素層内に位置する第2の導電型を含む埋め込み横方向炭化珪素エッジ終端領域を形成する工程とをさらに含み、
前記埋め込み横方向炭化珪素エッジ終端領域は前記第1の導電型を含む炭化珪素表面層により覆われるように形成される、請求項14に記載の方法。
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US9257511B2 (en) | 2016-02-09 |
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US20160104779A1 (en) | 2016-04-14 |
US20140291697A1 (en) | 2014-10-02 |
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