JP6288985B2 - リソグラフィ装置、および物品の製造方法 - Google Patents

リソグラフィ装置、および物品の製造方法 Download PDF

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Publication number
JP6288985B2
JP6288985B2 JP2013168335A JP2013168335A JP6288985B2 JP 6288985 B2 JP6288985 B2 JP 6288985B2 JP 2013168335 A JP2013168335 A JP 2013168335A JP 2013168335 A JP2013168335 A JP 2013168335A JP 6288985 B2 JP6288985 B2 JP 6288985B2
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Japan
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peripheral
pattern
area
shot
region
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JP2013168335A
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English (en)
Japanese (ja)
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JP2015037123A5 (enExample
JP2015037123A (ja
Inventor
森　堅一郎
堅一郎 森
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013168335A priority Critical patent/JP6288985B2/ja
Priority to US14/452,725 priority patent/US9529270B2/en
Publication of JP2015037123A publication Critical patent/JP2015037123A/ja
Publication of JP2015037123A5 publication Critical patent/JP2015037123A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2013168335A 2013-08-13 2013-08-13 リソグラフィ装置、および物品の製造方法 Active JP6288985B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013168335A JP6288985B2 (ja) 2013-08-13 2013-08-13 リソグラフィ装置、および物品の製造方法
US14/452,725 US9529270B2 (en) 2013-08-13 2014-08-06 Lithography apparatus, and method of manufacturing article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013168335A JP6288985B2 (ja) 2013-08-13 2013-08-13 リソグラフィ装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2015037123A JP2015037123A (ja) 2015-02-23
JP2015037123A5 JP2015037123A5 (enExample) 2016-09-29
JP6288985B2 true JP6288985B2 (ja) 2018-03-07

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JP2013168335A Active JP6288985B2 (ja) 2013-08-13 2013-08-13 リソグラフィ装置、および物品の製造方法

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US (1) US9529270B2 (enExample)
JP (1) JP6288985B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7145620B2 (ja) * 2018-02-27 2022-10-03 株式会社オーク製作所 投影露光装置
JP7162430B2 (ja) * 2018-02-27 2022-10-28 株式会社オーク製作所 投影露光装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62136859A (ja) 1985-12-10 1987-06-19 Nippon Denso Co Ltd 半導体ウエハのメツキ装置
JPH0950951A (ja) * 1995-08-04 1997-02-18 Nikon Corp リソグラフィ方法およびリソグラフィ装置
US6680774B1 (en) 2001-10-09 2004-01-20 Ultratech Stepper, Inc. Method and apparatus for mechanically masking a workpiece
SG121843A1 (en) * 2002-12-19 2006-05-26 Asml Netherlands Bv Device manufacturing method, device manufactured thereby, computer program and lithographic apparatus
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
US7777863B2 (en) * 2007-05-30 2010-08-17 Asml Netherlands B.V. Lithographic apparatus with mask to prevent exposure of peripheral exposure region of substrate
JP2010135426A (ja) * 2008-12-02 2010-06-17 Renesas Electronics Corp 露光方法及び露光装置
JP5127875B2 (ja) * 2010-04-28 2013-01-23 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP5789135B2 (ja) * 2011-06-17 2015-10-07 キヤノン株式会社 露光装置及びデバイスの製造方法
JP5535164B2 (ja) * 2011-09-22 2014-07-02 株式会社東芝 インプリント方法およびインプリント装置
JP5868094B2 (ja) * 2011-09-26 2016-02-24 キヤノン株式会社 露光装置及びデバイス製造方法
JP6029289B2 (ja) * 2012-02-28 2016-11-24 キヤノン株式会社 露光装置、それを用いたデバイスの製造方法

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Publication number Publication date
US9529270B2 (en) 2016-12-27
US20150050813A1 (en) 2015-02-19
JP2015037123A (ja) 2015-02-23

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