JP6283158B2 - 配線基板、及び、配線基板の製造方法 - Google Patents

配線基板、及び、配線基板の製造方法 Download PDF

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Publication number
JP6283158B2
JP6283158B2 JP2012183523A JP2012183523A JP6283158B2 JP 6283158 B2 JP6283158 B2 JP 6283158B2 JP 2012183523 A JP2012183523 A JP 2012183523A JP 2012183523 A JP2012183523 A JP 2012183523A JP 6283158 B2 JP6283158 B2 JP 6283158B2
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Japan
Prior art keywords
layer
insulating
magnetic layer
wiring
wiring board
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JP2012183523A
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English (en)
Japanese (ja)
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JP2013236046A (ja
JP2013236046A5 (enExample
Inventor
朋治 藤井
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012183523A priority Critical patent/JP6283158B2/ja
Priority to US13/857,226 priority patent/US9336938B2/en
Publication of JP2013236046A publication Critical patent/JP2013236046A/ja
Publication of JP2013236046A5 publication Critical patent/JP2013236046A5/ja
Application granted granted Critical
Publication of JP6283158B2 publication Critical patent/JP6283158B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2012183523A 2012-04-12 2012-08-22 配線基板、及び、配線基板の製造方法 Active JP6283158B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012183523A JP6283158B2 (ja) 2012-04-12 2012-08-22 配線基板、及び、配線基板の製造方法
US13/857,226 US9336938B2 (en) 2012-04-12 2013-04-05 Wiring substrate and method for manufacturing the wiring substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012091289 2012-04-12
JP2012091289 2012-04-12
JP2012183523A JP6283158B2 (ja) 2012-04-12 2012-08-22 配線基板、及び、配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013236046A JP2013236046A (ja) 2013-11-21
JP2013236046A5 JP2013236046A5 (enExample) 2015-09-24
JP6283158B2 true JP6283158B2 (ja) 2018-02-21

Family

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Family Applications (1)

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JP2012183523A Active JP6283158B2 (ja) 2012-04-12 2012-08-22 配線基板、及び、配線基板の製造方法

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US (1) US9336938B2 (enExample)
JP (1) JP6283158B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102069629B1 (ko) * 2014-05-08 2020-01-23 삼성전기주식회사 칩 전자부품 및 그 제조방법
US20170084379A1 (en) 2015-09-21 2017-03-23 Qorvo Us, Inc. Substrates with integrated three dimensional inductors with via columns
US10720788B2 (en) * 2015-10-09 2020-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wireless charging devices having wireless charging coils and methods of manufacture thereof
US10923259B2 (en) * 2016-07-07 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Coil component
US11417614B2 (en) * 2018-03-28 2022-08-16 Intel Corporation Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
JP7449660B2 (ja) 2019-09-06 2024-03-14 株式会社村田製作所 インダクタ部品
JP7529414B2 (ja) * 2020-02-26 2024-08-06 株式会社村田製作所 インダクタ部品
US12336197B2 (en) 2020-02-28 2025-06-17 Intel Corporation In-plane inductors in IC packages
US12272484B2 (en) * 2021-03-04 2025-04-08 Intel Corporation Coreless electronic substrates having embedded inductors
CN116564943A (zh) * 2023-03-31 2023-08-08 珠海越亚半导体股份有限公司 埋磁器件集成结构及其制作方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752114A (en) * 1980-09-16 1982-03-27 Asahi Chem Ind Co Ltd Fine coil
JPS5967909U (ja) * 1982-10-28 1984-05-08 日本電気ホームエレクトロニクス株式会社 コイル装置
JPS63300593A (ja) * 1987-05-29 1988-12-07 Nec Corp セラミック複合基板
KR960006848B1 (ko) * 1990-05-31 1996-05-23 가부시끼가이샤 도시바 평면형 자기소자
US5312674A (en) * 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
JPH07268610A (ja) * 1994-03-28 1995-10-17 Alps Electric Co Ltd 軟磁性合金薄膜
JPH0936312A (ja) * 1995-07-18 1997-02-07 Nec Corp インダクタンス素子およびその製造方法
JPH1055916A (ja) * 1996-08-08 1998-02-24 Kiyoto Yamazawa 薄型磁気素子およびトランス
US6136458A (en) * 1997-09-13 2000-10-24 Kabushiki Kaisha Toshiba Ferrite magnetic film structure having magnetic anisotropy
FR2790328B1 (fr) * 1999-02-26 2001-04-20 Memscap Composant inductif, transformateur integre, notamment destines a etre incorpores dans un circuit radiofrequence,et circuit integre associe avec un tel composant inductif ou transformateur integre
JP2001077538A (ja) 1999-09-02 2001-03-23 Fuji Photo Film Co Ltd プリント基板のパターンコイル
JP3373181B2 (ja) * 1999-09-17 2003-02-04 ティーディーケイ株式会社 薄膜磁気ヘッドおよびその製造方法
JP2001244123A (ja) * 2000-02-28 2001-09-07 Kawatetsu Mining Co Ltd 表面実装型平面磁気素子及びその製造方法
JP4200631B2 (ja) * 2000-03-29 2008-12-24 沖電気工業株式会社 オンチップ・コイルとその製造方法
JP2003059719A (ja) * 2001-08-16 2003-02-28 Denki Kagaku Kogyo Kk コイル回路付き金属ベース回路基板
JP3755453B2 (ja) * 2001-11-26 2006-03-15 株式会社村田製作所 インダクタ部品およびそのインダクタンス値調整方法
US7061359B2 (en) * 2003-06-30 2006-06-13 International Business Machines Corporation On-chip inductor with magnetic core
US7375609B2 (en) * 2003-09-29 2008-05-20 Tamura Corporation Multilayer laminated circuit board
JP4012526B2 (ja) * 2004-07-01 2007-11-21 Ｔｄｋ株式会社 薄膜コイルおよびその製造方法、ならびにコイル構造体およびその製造方法
US7436281B2 (en) * 2004-07-30 2008-10-14 Texas Instruments Incorporated Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
JP2007250924A (ja) * 2006-03-17 2007-09-27 Sony Corp インダクタ素子とその製造方法、並びにインダクタ素子を用いた半導体モジュール
US8248200B2 (en) * 2006-03-24 2012-08-21 Panasonic Corporation Inductance component
JP2007281230A (ja) 2006-04-07 2007-10-25 Fujikura Ltd 半導体装置およびその製造方法
US7612963B2 (en) * 2006-06-30 2009-11-03 Hitachi Global Storage Technologies Netherlands B.V. Perpendicular magnetic recording head with photoresist dam between write coil and air bearing surface
JP2008041115A (ja) * 2006-08-01 2008-02-21 Alps Electric Co Ltd 垂直磁気記録ヘッド
JP2008103603A (ja) * 2006-10-20 2008-05-01 Seiko Epson Corp 電子基板および電子機器
JP5339974B2 (ja) * 2009-03-11 2013-11-13 新光電気工業株式会社 インダクタ装置及びその製造方法
CN102771199B (zh) * 2010-07-16 2015-02-04 株式会社村田制作所 线圈内置基板
TWI474349B (zh) * 2010-07-23 2015-02-21 Cyntec Co Ltd 線圈元件

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Publication number Publication date
JP2013236046A (ja) 2013-11-21
US20130271252A1 (en) 2013-10-17
US9336938B2 (en) 2016-05-10

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