JP6268469B2 - 基板処理装置、基板処理装置の制御方法、および記録媒体 - Google Patents

基板処理装置、基板処理装置の制御方法、および記録媒体 Download PDF

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Publication number
JP6268469B2
JP6268469B2 JP2013261468A JP2013261468A JP6268469B2 JP 6268469 B2 JP6268469 B2 JP 6268469B2 JP 2013261468 A JP2013261468 A JP 2013261468A JP 2013261468 A JP2013261468 A JP 2013261468A JP 6268469 B2 JP6268469 B2 JP 6268469B2
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Japan
Prior art keywords
exhaust
processing
schedule
substrate
flow rate
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JP2013261468A
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English (en)
Japanese (ja)
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JP2015119042A (ja
Inventor
伸広 近成
伸広 近成
荒木　浩之
浩之 荒木
仁 緒方
仁 緒方
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2013261468A priority Critical patent/JP6268469B2/ja
Priority to PCT/JP2014/080806 priority patent/WO2015093226A1/ja
Priority to TW103141761A priority patent/TWI618170B/zh
Publication of JP2015119042A publication Critical patent/JP2015119042A/ja
Application granted granted Critical
Publication of JP6268469B2 publication Critical patent/JP6268469B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013261468A 2013-12-18 2013-12-18 基板処理装置、基板処理装置の制御方法、および記録媒体 Active JP6268469B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013261468A JP6268469B2 (ja) 2013-12-18 2013-12-18 基板処理装置、基板処理装置の制御方法、および記録媒体
PCT/JP2014/080806 WO2015093226A1 (ja) 2013-12-18 2014-11-20 基板処理装置、基板処理装置の制御方法、および記録媒体
TW103141761A TWI618170B (zh) 2013-12-18 2014-12-02 基板處理裝置，基板處理裝置之控制方法及記錄媒體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013261468A JP6268469B2 (ja) 2013-12-18 2013-12-18 基板処理装置、基板処理装置の制御方法、および記録媒体

Publications (2)

Publication Number Publication Date
JP2015119042A JP2015119042A (ja) 2015-06-25
JP6268469B2 true JP6268469B2 (ja) 2018-01-31

Family

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JP2013261468A Active JP6268469B2 (ja) 2013-12-18 2013-12-18 基板処理装置、基板処理装置の制御方法、および記録媒体

Country Status (3)

Country Link
JP (1) JP6268469B2 (zh)
TW (1) TWI618170B (zh)
WO (1) WO2015093226A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6489524B2 (ja) * 2015-08-18 2019-03-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6499563B2 (ja) * 2015-11-06 2019-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のスケジュール作成方法及びそのプログラム
US10453721B2 (en) 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
JP6712482B2 (ja) * 2016-03-31 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6890992B2 (ja) 2017-02-10 2021-06-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP7040870B2 (ja) * 2017-07-28 2022-03-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理装置の部品検査方法
JP6985964B2 (ja) * 2018-03-23 2021-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置用のピトー管式流量計、基板処理装置、および基板処理方法
JP7027284B2 (ja) * 2018-09-07 2022-03-01 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN112992741A (zh) * 2021-03-04 2021-06-18 长江存储科技有限责任公司 半导体处理装置及排气方法
KR102594076B1 (ko) * 2021-07-08 2023-10-25 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03224213A (ja) * 1989-12-26 1991-10-03 Nec Corp 低圧ｃｖｄ装置
JPH09148231A (ja) * 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP2003213422A (ja) * 2002-01-24 2003-07-30 Nec Corp 薄膜の形成装置及びその形成方法
JP2009246007A (ja) * 2008-03-28 2009-10-22 Epson Toyocom Corp プラズマ処理方法およびプラズマ処理装置
JP2009277789A (ja) * 2008-05-13 2009-11-26 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5312856B2 (ja) * 2008-06-27 2013-10-09 大日本スクリーン製造株式会社 基板処理装置
JP2011044446A (ja) * 2009-08-19 2011-03-03 Tokyo Electron Ltd 圧力制御機器、圧力制御方法および基板処理装置
JP5257328B2 (ja) * 2009-11-04 2013-08-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5704766B2 (ja) * 2010-12-22 2015-04-22 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
KR101652613B1 (ko) * 2012-03-07 2016-08-30 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램

Also Published As

Publication number Publication date
TW201528412A (zh) 2015-07-16
WO2015093226A1 (ja) 2015-06-25
TWI618170B (zh) 2018-03-11
JP2015119042A (ja) 2015-06-25

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