JP6266096B2 - ピラジン含有化合物を含むエポキシ樹脂 - Google Patents

ピラジン含有化合物を含むエポキシ樹脂 Download PDF

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Publication number
JP6266096B2
JP6266096B2 JP2016513975A JP2016513975A JP6266096B2 JP 6266096 B2 JP6266096 B2 JP 6266096B2 JP 2016513975 A JP2016513975 A JP 2016513975A JP 2016513975 A JP2016513975 A JP 2016513975A JP 6266096 B2 JP6266096 B2 JP 6266096B2
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Japan
Prior art keywords
epoxy resin
epoxy
alkyl
compound
alkyl groups
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Expired - Fee Related
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JP2016513975A
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English (en)
Japanese (ja)
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JP2016526067A (ja
JP2016526067A5 (OSRAM
Inventor
ウィリアム エイチ． モーザー，
ウィリアム エイチ． モーザー，
デイリー， メアリー， エム． カルーソー
デイリー， メアリー， エム． カルーソー
マーク エー． スミス，
マーク エー． スミス，
クリシュナムルティ スリダー，
クリシュナムルティ スリダー，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2016526067A5 publication Critical patent/JP2016526067A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3462—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L9/00—Rigid pipes
    • F16L9/14—Compound tubes, i.e. made of materials not wholly covered by any one of the preceding groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2016513975A 2013-05-14 2014-05-02 ピラジン含有化合物を含むエポキシ樹脂 Expired - Fee Related JP6266096B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361823111P 2013-05-14 2013-05-14
US61/823,111 2013-05-14
PCT/US2014/036547 WO2014186151A1 (en) 2013-05-14 2014-05-02 Epoxy resins comprising a pyrazine-containing compound

Publications (3)

Publication Number Publication Date
JP2016526067A JP2016526067A (ja) 2016-09-01
JP2016526067A5 JP2016526067A5 (OSRAM) 2017-03-30
JP6266096B2 true JP6266096B2 (ja) 2018-01-24

Family

ID=50896556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016513975A Expired - Fee Related JP6266096B2 (ja) 2013-05-14 2014-05-02 ピラジン含有化合物を含むエポキシ樹脂

Country Status (6)

Country Link
US (1) US9975988B2 (OSRAM)
EP (1) EP2997086B1 (OSRAM)
JP (1) JP6266096B2 (OSRAM)
KR (1) KR101885703B1 (OSRAM)
CN (1) CN105209536B (OSRAM)
WO (1) WO2014186151A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160007581A (ko) * 2013-05-14 2016-01-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 피리딘- 또는 피라진-함유 화합물
NO2769142T3 (OSRAM) * 2015-04-16 2018-07-21
CN110997789B (zh) * 2017-05-25 2022-10-04 汉高股份有限及两合公司 可固化组合物
JP6687759B2 (ja) * 2017-08-22 2020-04-28 サンスター技研株式会社 硬化性組成物
EP3778736A1 (en) 2019-08-15 2021-02-17 Sika Technology Ag Thermally expandable compositions comprising a chemical blowing agent
US12157835B2 (en) * 2020-04-07 2024-12-03 Rohr, Inc. Corrosion inhibition system primers and adhesives for metal bond structures
US20220186041A1 (en) * 2020-12-15 2022-06-16 TE Connectivity Services Gmbh Coating for improved flammability performance in electrical components

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH484972A (de) 1967-12-08 1970-01-31 Ciba Geigy Härtbare Mischungen aus Epoxidharzen, Dicyandiamid und Aminbeschleunigern
US3928351A (en) 1972-03-06 1975-12-23 Du Pont Multifunctional pyrazines
US3931109A (en) 1972-03-13 1976-01-06 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
CH606253A5 (OSRAM) 1977-01-07 1978-10-31 Ciba Geigy Ag
JPS58111843A (ja) 1981-12-25 1983-07-04 Osaka Soda Co Ltd ブレンドゴム加硫組成物
US5503937A (en) * 1984-07-17 1996-04-02 The Dow Chemical Company Curable composition which comprises adducts of heterocyclic compounds
US4895702A (en) * 1985-10-15 1990-01-23 The Dow Chemical Company Corrosion inhibitor compositions containing inhibitor prepared from amino substituted pyrazines and epoxy compounds
DE3830750A1 (de) * 1987-09-11 1989-03-30 Koei Chemical Co Haertbare harzzusammensetzung und daraus hergestellte schichtstoffe
EP0458502B1 (en) 1990-05-21 2003-06-18 Dow Global Technologies Inc. Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
US5541000A (en) * 1993-08-17 1996-07-30 Minnesota Mining And Manufacturing Company Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms
US5859153A (en) 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
KR100230575B1 (ko) * 1996-10-30 1999-11-15 김충섭 열잠재성 촉매령 경화제인 n-벤질-피라지늄-헥사폴루오로 안티모네이트에 의해 경화된 열잠재성 및 내열성의 이관능성 에폭시 수지 경화물
US7001938B2 (en) 2003-01-27 2006-02-21 Resolution Performance Products Llc Epoxy resin curing compositions and resin compositions including same
TW202429692A (zh) 2006-09-29 2024-07-16 日商半導體能源研究所股份有限公司 半導體裝置
JP2008274080A (ja) * 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
CN105255312A (zh) 2008-01-23 2016-01-20 蓝立方知识产权公司 环氧树脂硬化剂组合物及含有这样的硬化剂组合物的环氧树脂组合物
JP2009173812A (ja) 2008-01-25 2009-08-06 Panasonic Electric Works Co Ltd 封止用エポキシ樹脂組成物および半導体装置
EP2367794B1 (en) 2008-11-24 2013-01-09 Basf Se Curable composition comprising a thermolatent base
CA2750475C (en) 2009-02-19 2017-04-18 3M Innovative Properties Company Fusion bonded epoxy coating compositions that include magnesium oxide
KR20160007581A (ko) 2013-05-14 2016-01-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 피리딘- 또는 피라진-함유 화합물

Also Published As

Publication number Publication date
KR20160007580A (ko) 2016-01-20
JP2016526067A (ja) 2016-09-01
EP2997086B1 (en) 2018-01-03
CN105209536A (zh) 2015-12-30
WO2014186151A1 (en) 2014-11-20
CN105209536B (zh) 2018-01-09
US9975988B2 (en) 2018-05-22
KR101885703B1 (ko) 2018-08-06
US20160068627A1 (en) 2016-03-10
EP2997086A1 (en) 2016-03-23

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