JP6263028B2 - 部品装着装置 - Google Patents

部品装着装置 Download PDF

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Publication number
JP6263028B2
JP6263028B2 JP2013272115A JP2013272115A JP6263028B2 JP 6263028 B2 JP6263028 B2 JP 6263028B2 JP 2013272115 A JP2013272115 A JP 2013272115A JP 2013272115 A JP2013272115 A JP 2013272115A JP 6263028 B2 JP6263028 B2 JP 6263028B2
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JP
Japan
Prior art keywords
light emitting
led element
emitting portion
light
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013272115A
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English (en)
Japanese (ja)
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JP2015126216A (ja
Inventor
俊明 和田
俊明 和田
貴志 吉井
貴志 吉井
卓哉 井本
卓哉 井本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2013272115A priority Critical patent/JP6263028B2/ja
Priority to KR1020140188183A priority patent/KR101615948B1/ko
Publication of JP2015126216A publication Critical patent/JP2015126216A/ja
Application granted granted Critical
Publication of JP6263028B2 publication Critical patent/JP6263028B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2013272115A 2013-12-27 2013-12-27 部品装着装置 Active JP6263028B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013272115A JP6263028B2 (ja) 2013-12-27 2013-12-27 部品装着装置
KR1020140188183A KR101615948B1 (ko) 2013-12-27 2014-12-24 부품 장착 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013272115A JP6263028B2 (ja) 2013-12-27 2013-12-27 部品装着装置

Publications (2)

Publication Number Publication Date
JP2015126216A JP2015126216A (ja) 2015-07-06
JP6263028B2 true JP6263028B2 (ja) 2018-01-17

Family

ID=53536694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013272115A Active JP6263028B2 (ja) 2013-12-27 2013-12-27 部品装着装置

Country Status (2)

Country Link
JP (1) JP6263028B2 (ko)
KR (1) KR101615948B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016035135A1 (ja) * 2014-09-02 2016-03-10 富士機械製造株式会社 部品実装装置
JP6398082B2 (ja) * 2015-02-26 2018-10-03 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装装置
JP6828223B2 (ja) * 2016-02-04 2021-02-10 株式会社Ｆｕｊｉ 実装装置
JP6789561B2 (ja) * 2016-03-02 2020-11-25 株式会社Ｆｕｊｉ 部品実装装置
JP6714729B2 (ja) 2016-12-07 2020-06-24 ヤマハ発動機株式会社 表面実装機、部品認識装置、部品認識方法
US11477927B2 (en) * 2017-02-20 2022-10-18 Fuji Corporation Component mounting system and component mounting method
CN109219269A (zh) * 2017-07-07 2019-01-15 深圳市炫硕智造技术有限公司 高速贴片机
JP7117507B2 (ja) * 2018-01-29 2022-08-15 パナソニックＩｐマネジメント株式会社 部品装着方法および部品装着装置
JPWO2021044688A1 (ko) * 2019-09-02 2021-03-11
WO2021084831A1 (ja) * 2019-10-29 2021-05-06 パナソニックＩｐマネジメント株式会社 部品実装装置および実装基板の製造方法
JP7285194B2 (ja) * 2019-11-01 2023-06-01 ヤマハ発動機株式会社 部品実装機、部品認識方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09238000A (ja) * 1996-02-29 1997-09-09 Sanyo Electric Co Ltd 電子部品の認識方法及び電子部品自動装着装置
JP2000150970A (ja) * 1998-11-18 2000-05-30 Fuji Photo Film Co Ltd 発光素子のボンディング方法および装置
JP2000183404A (ja) * 1998-12-14 2000-06-30 Fuji Photo Film Co Ltd 発光素子アレイ、そのボンディング方法および装置
JP4328409B2 (ja) * 1999-04-12 2009-09-09 富士フイルム株式会社 発光素子のボンディング装置
JP3617483B2 (ja) * 2001-09-06 2005-02-02 松下電器産業株式会社 電子部品実装方法
JP2007294576A (ja) * 2006-04-24 2007-11-08 Shibuya Kogyo Co Ltd 検査装置及び検査方法
JP5194819B2 (ja) * 2008-01-16 2013-05-08 コニカミノルタオプティクス株式会社 蛍光検出装置および蛍光検出方法
JP2012127924A (ja) * 2010-12-17 2012-07-05 Murata Mfg Co Ltd 複数の対象物の検出装置及び検出方法
JP5566359B2 (ja) * 2011-09-29 2014-08-06 株式会社日立ハイテクインスツルメンツ 部品装着装置
JP6259274B2 (ja) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 部品装着装置
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
EP3179523B1 (en) * 2014-08-04 2020-09-23 FUJI Corporation Mounting device

Also Published As

Publication number Publication date
KR101615948B1 (ko) 2016-04-27
JP2015126216A (ja) 2015-07-06
KR20150077349A (ko) 2015-07-07

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