JP6254259B2 - 静電放電ダイオード - Google Patents
静電放電ダイオード Download PDFInfo
- Publication number
- JP6254259B2 JP6254259B2 JP2016512918A JP2016512918A JP6254259B2 JP 6254259 B2 JP6254259 B2 JP 6254259B2 JP 2016512918 A JP2016512918 A JP 2016512918A JP 2016512918 A JP2016512918 A JP 2016512918A JP 6254259 B2 JP6254259 B2 JP 6254259B2
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- semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/887,723 | 2013-05-06 | ||
| US13/887,723 US9093462B2 (en) | 2013-05-06 | 2013-05-06 | Electrostatic discharge diode |
| PCT/US2014/035076 WO2014182449A1 (en) | 2013-05-06 | 2014-04-23 | Electrostatic discharge diode |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016526285A JP2016526285A (ja) | 2016-09-01 |
| JP2016526285A5 JP2016526285A5 (enExample) | 2017-03-23 |
| JP6254259B2 true JP6254259B2 (ja) | 2017-12-27 |
Family
ID=50819974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016512918A Expired - Fee Related JP6254259B2 (ja) | 2013-05-06 | 2014-04-23 | 静電放電ダイオード |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9093462B2 (enExample) |
| EP (1) | EP2994937B1 (enExample) |
| JP (1) | JP6254259B2 (enExample) |
| KR (1) | KR101755555B1 (enExample) |
| CN (1) | CN105190888B (enExample) |
| WO (1) | WO2014182449A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9093462B2 (en) | 2013-05-06 | 2015-07-28 | Qualcomm Incorporated | Electrostatic discharge diode |
| US9443764B2 (en) * | 2013-10-11 | 2016-09-13 | GlobalFoundries, Inc. | Method of eliminating poor reveal of through silicon vias |
| US9786580B2 (en) * | 2013-11-15 | 2017-10-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-alignment for redistribution layer |
| TWI581325B (zh) | 2014-11-12 | 2017-05-01 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
| EP3035385A1 (en) * | 2014-12-16 | 2016-06-22 | IMEC vzw | Semiconductor interposer comprising a schottky diode and a method for fabricating the interposer |
| US9583462B2 (en) * | 2015-01-22 | 2017-02-28 | Qualcomm Incorporated | Damascene re-distribution layer (RDL) in fan out split die application |
| US9922970B2 (en) * | 2015-02-13 | 2018-03-20 | Qualcomm Incorporated | Interposer having stacked devices |
| DE102016118709B3 (de) * | 2016-10-04 | 2018-01-25 | Infineon Technologies Ag | Schutzvorrichtung vor elektrostatischer entladung und elektronische schaltvorrichtung |
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| US9093462B2 (en) | 2015-07-28 |
| US9379201B2 (en) | 2016-06-28 |
| EP2994937A1 (en) | 2016-03-16 |
| WO2014182449A1 (en) | 2014-11-13 |
| US20140327105A1 (en) | 2014-11-06 |
| KR20160004356A (ko) | 2016-01-12 |
| KR101755555B1 (ko) | 2017-07-07 |
| US20150333053A1 (en) | 2015-11-19 |
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