JP6249892B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP6249892B2
JP6249892B2 JP2014132430A JP2014132430A JP6249892B2 JP 6249892 B2 JP6249892 B2 JP 6249892B2 JP 2014132430 A JP2014132430 A JP 2014132430A JP 2014132430 A JP2014132430 A JP 2014132430A JP 6249892 B2 JP6249892 B2 JP 6249892B2
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cylindrical electrode
substrate
cavity
mold
semiconductor device
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Japanese (ja)
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JP2016012604A5 (enExample
JP2016012604A (ja
Inventor
吉松　直樹
直樹 吉松
清宏 内田
清宏 内田
武敏 鹿野
武敏 鹿野
雅芳 新飼
雅芳 新飼
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2014132430A priority Critical patent/JP6249892B2/ja
Priority to US14/665,577 priority patent/US9437460B2/en
Priority to DE102015210603.9A priority patent/DE102015210603B4/de
Priority to CN201510363009.3A priority patent/CN105225971B/zh
Publication of JP2016012604A publication Critical patent/JP2016012604A/ja
Publication of JP2016012604A5 publication Critical patent/JP2016012604A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2014132430A 2014-06-27 2014-06-27 半導体装置の製造方法 Active JP6249892B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014132430A JP6249892B2 (ja) 2014-06-27 2014-06-27 半導体装置の製造方法
US14/665,577 US9437460B2 (en) 2014-06-27 2015-03-23 Method for manufacturing semiconductor device
DE102015210603.9A DE102015210603B4 (de) 2014-06-27 2015-06-10 Verfahren zur Herstellung einer Halbleitervorrichtung
CN201510363009.3A CN105225971B (zh) 2014-06-27 2015-06-26 半导体装置的制造方法

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Application Number Priority Date Filing Date Title
JP2014132430A JP6249892B2 (ja) 2014-06-27 2014-06-27 半導体装置の製造方法

Publications (3)

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JP2016012604A JP2016012604A (ja) 2016-01-21
JP2016012604A5 JP2016012604A5 (enExample) 2016-06-23
JP6249892B2 true JP6249892B2 (ja) 2017-12-20

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US (1) US9437460B2 (enExample)
JP (1) JP6249892B2 (enExample)
CN (1) CN105225971B (enExample)
DE (1) DE102015210603B4 (enExample)

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DE112017000083T5 (de) 2016-03-18 2018-04-26 Fuji Electric Co., Ltd. Halbleitervorrichtung, metallelektrodenelement und verfahren zum herstellen der halbleitervorrichtung
US10347549B2 (en) * 2016-04-30 2019-07-09 Littelfuse, Inc. Power semiconductor device module having mechanical corner press-fit anchors
US10062621B2 (en) * 2016-04-30 2018-08-28 Ixys, Llc Power semiconductor device module having mechanical corner press-fit anchors
CN109417068B (zh) * 2017-01-17 2022-05-06 富士电机株式会社 半导体装置
DE112017007673B4 (de) * 2017-06-21 2022-08-18 Mitsubishi Electric Corporation Halbleitereinrichtung, Leistungsumwandlungsvorrichtung und Verfahren zum Herstellen einer Halbleitereinrichtung
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
JP7107120B2 (ja) * 2018-09-14 2022-07-27 富士電機株式会社 半導体装置、半導体装置の製造方法
JP7279354B2 (ja) * 2018-12-17 2023-05-23 富士電機株式会社 半導体素子及び半導体素子の識別方法
JP7293936B2 (ja) 2019-07-19 2023-06-20 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP7404834B2 (ja) * 2019-12-06 2023-12-26 富士電機株式会社 半導体装置及び半導体装置の製造方法
CN111769090A (zh) * 2020-07-21 2020-10-13 无锡利普思半导体有限公司 塑封功率模块、塑封模具及塑封方法
JP7666045B2 (ja) * 2021-03-19 2025-04-22 富士電機株式会社 半導体装置
JP7692720B2 (ja) * 2021-04-06 2025-06-16 三菱重工業株式会社 パワーモジュール、及びパワーモジュールの製造方法
JP7484800B2 (ja) * 2021-04-08 2024-05-16 三菱電機株式会社 半導体装置および半導体装置の製造方法
US11901273B2 (en) * 2021-07-26 2024-02-13 Infineon Technologies Ag Power module with press-fit contacts
US12494418B2 (en) * 2021-07-26 2025-12-09 Infineon Technologies Ag Power module with press-fit contacts
DE102021121797A1 (de) * 2021-08-23 2023-02-23 Infineon Technologies Ag Leistungshalbleitermodul mit buchse oder einpresspin und verfahren zu seiner herstellung
US12438068B2 (en) 2022-01-18 2025-10-07 Infineon Technologies Austria Ag Stacked module arrangement
US20240170378A1 (en) * 2022-11-17 2024-05-23 Semiconductor Components Industries, Llc Power module package with molded via and dual side press-fit pin
CN120239903A (zh) * 2022-11-25 2025-07-01 华为数字能源技术有限公司 模具成型功率模块
DE102024202665A1 (de) * 2024-03-20 2025-09-25 Volkswagen Aktiengesellschaft Verfahren zur Herstellung einer leistungselektronischen Einrichtung, leistungselektronische Einrichtung und Kraftfahrzeug

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JP4626098B2 (ja) * 2001-06-15 2011-02-02 イビデン株式会社 プリント配線板の製造方法
JP5358077B2 (ja) * 2007-09-28 2013-12-04 スパンション エルエルシー 半導体装置及びその製造方法
DE102008005547B4 (de) * 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
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JP5245880B2 (ja) * 2009-02-04 2013-07-24 三菱電機株式会社 電力用半導体モジュールとその製造方法
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Publication number Publication date
CN105225971B (zh) 2018-12-04
DE102015210603A1 (de) 2015-12-31
US9437460B2 (en) 2016-09-06
JP2016012604A (ja) 2016-01-21
US20150380274A1 (en) 2015-12-31
CN105225971A (zh) 2016-01-06
DE102015210603B4 (de) 2019-05-23

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