JP6231787B2 - 蛍光体及び発光装置 - Google Patents
蛍光体及び発光装置 Download PDFInfo
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- JP6231787B2 JP6231787B2 JP2013130192A JP2013130192A JP6231787B2 JP 6231787 B2 JP6231787 B2 JP 6231787B2 JP 2013130192 A JP2013130192 A JP 2013130192A JP 2013130192 A JP2013130192 A JP 2013130192A JP 6231787 B2 JP6231787 B2 JP 6231787B2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 104
- 239000013078 crystal Substances 0.000 claims description 35
- 229910052712 strontium Inorganic materials 0.000 claims description 30
- 229910052693 Europium Inorganic materials 0.000 claims description 12
- 229910052791 calcium Inorganic materials 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 description 22
- 229920005989 resin Polymers 0.000 description 22
- 238000010586 diagram Methods 0.000 description 17
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- 229910052582 BN Inorganic materials 0.000 description 11
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 11
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 238000002441 X-ray diffraction Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910004122 SrSi Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 4
- 238000000295 emission spectrum Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000695 excitation spectrum Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000008213 purified water Substances 0.000 description 2
- 230000032554 response to blue light Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910004706 CaSi2 Inorganic materials 0.000 description 1
- 102100026816 DNA-dependent metalloprotease SPRTN Human genes 0.000 description 1
- 101710175461 DNA-dependent metalloprotease SPRTN Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- C09K11/0883—Arsenides; Nitrides; Phosphides
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01—ELECTRIC ELEMENTS
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Description
以下では、本発明の一実施例による蛍光体を具体的に説明することにする。
16.35gのSrCO3、12.04gのSiO2、34.25gのSi3N4、4.10gのEu2O3及び33.26gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.2375であった。
21.43gのSrCO3、11.83gのSiO2、33.65gのSi3N4、4.03gのEu2O3及び29.05gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.3135であった。
26.33gのSrCO3、11.63gのSiO2、33.08gのSi3N4、3.96gのEu2O3及び24.99gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.399であった。
31.07gのSrCO3、11.44gのSiO2、32.53gのSi3N4、3.90gのEu2O3、21.06gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.475であった。
10.44gのSiO2、33.72gのSi3N4、3.94gのEu2O3、42.55gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0であった。
35.65gのSrCO3、11.25gのSiO2、32.00gのSi3N4、3.83gのEu2O3、17.26gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.551であった。
40.09gのSrCO3、11.07gのSiO2、31.48gのSi3N4、3.77gのEu2O3、13.59gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.627であった。
44.38gのSrCO3、10.89gのSiO2、30.98gのSi3N4、3.71gのEu2O3、10.03gのCaCO3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.7125であった。
62.75gのSrCO3、10.44gのSiO2、33.72gのSi3N4、3.94gのEu2O3を混合して得られた混合物を窒化ホウ素坩堝に入れて、H2−N2混合ガスを用いた還元雰囲気と約1500℃で約6時間焼成した。その結果できた蛍光体に含まれたストロンチウムの割合は0.95であった。
図1は、実施例による発光装置の断面図である。図1に示された発光装置は、表面実装タイプの発光装置である。
110a,110b 第1、第2リードフレーム
120 発光素子
130 ワイヤー
140 光透過樹脂
210a,210b 第1、第2リードフレーム
220 発光素子
230 ワイヤー
240 光透過樹脂
250 外装材
Claims (8)
- 緑色(Green)波長帯域と黄色(Yellow)波長帯域との間でピーク(peak)波長を有する光を放出し、
MSi2N2O2、M=CaxSryEuzで表わされる組成式の三斜晶系(Triclinic)結晶構造を有し、
Ca,Sr及びEuのモル比をそれぞれx,y,zとする時、
x+y+z=1であり、且つ、
x,y,zを三角図法によって図示した時、三角図上で(0.45,0.55,0)、(0.75,0.25,0)、(0.75,0,0.25)、(0.5,0,0.5)、(0.45,0.05,0.5)の5つの点を実線で結ぶ領域において、線上及び内部の範囲にあり、且つ、
zが0.15以上0.4以下(0.15≦z≦0.4)の範囲にある、蛍光体。 - 前記蛍光体は、三斜晶系ベータ(β)の結晶構造を有する、請求項1に記載の蛍光体。
- 前記ピーク波長は、540nm以上585nm以下である、請求項1又は2に記載の蛍光体。
- 前記三斜晶系結晶構造の単位格子の体積は700Å3以上である、請求項1又は2に記載の蛍光体。
- 発光素子と、
前記発光素子から放出された光のうちの一部の光によって励起され、前記発光素子から放出された光の波長と異なる波長を有する光を放出する蛍光体と、を含み、
前記蛍光体は、
緑色(Green)波長帯域と黄色(Yellow)波長帯域との間でピーク(peak)波長を有する光を放出し、
MSi2N2O2、M=CaxSryEuzで表わされる組成式の三斜晶系(Triclinic)結晶構造を有し、
Ca,Sr及びEuのモル比をそれぞれx,y,zとする時、
x+y+z=1であり、且つ、
x,y,zを三角図法によって図示した時、三角図上で(0.45,0.55,0)、(0.75,0.25,0)、(0.75,0,0.25)、(0.5,0,0.5)、(0.45,0.05,0.5)の5つの点を実線で結ぶ領域において、線上及び内部の範囲にあり、且つ、
zが0.15以上0.4以下(0.15≦z≦0.4)の範囲にある、発光装置。 - 前記蛍光体は、三斜晶系ベータ(β)の結晶構造を有する、請求項5に記載の発光装置。
- 前記ピーク波長は、540nm以上585nm以下である、請求項5又は6に記載の発光装置。
- 前記三斜晶系結晶構造の単位格子の体積は700Å3以上である、請求項5又は6に記載の発光装置。
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KR1020120077940A KR101970774B1 (ko) | 2012-07-17 | 2012-07-17 | 형광체 및 발광 장치 |
KR10-2012-0077940 | 2012-07-17 |
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JP2014019870A JP2014019870A (ja) | 2014-02-03 |
JP6231787B2 true JP6231787B2 (ja) | 2017-11-15 |
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US (1) | US9365769B2 (ja) |
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TWI614918B (zh) * | 2015-06-08 | 2018-02-11 | 歐司朗光電半導體公司 | 複合氮氧化物陶瓷轉換器及具有該轉換器的光源 |
CN106303269A (zh) * | 2015-12-28 | 2017-01-04 | 北京智谷睿拓技术服务有限公司 | 图像采集控制方法和装置、图像采集设备 |
CN105838371A (zh) * | 2016-04-27 | 2016-08-10 | 山东盈光新材料有限公司 | 一种led用氮氧化物荧光粉及制备方法 |
US10177287B1 (en) | 2017-09-19 | 2019-01-08 | Eie Materials, Inc. | Gamut broadened displays with narrow band green phosphors |
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EP1413618A1 (en) | 2002-09-24 | 2004-04-28 | Osram Opto Semiconductors GmbH | Luminescent material, especially for LED application |
JP4415547B2 (ja) | 2002-10-16 | 2010-02-17 | 日亜化学工業株式会社 | オキシ窒化物蛍光体及びその製造方法 |
JP4415548B2 (ja) | 2002-10-16 | 2010-02-17 | 日亜化学工業株式会社 | オキシ窒化物蛍光体を用いた発光装置 |
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US9365769B2 (en) | 2016-06-14 |
CN103540319A (zh) | 2014-01-29 |
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