JP6226105B1 - 積層部材及びタッチパネル - Google Patents

積層部材及びタッチパネル Download PDF

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Publication number
JP6226105B1
JP6226105B1 JP2017514923A JP2017514923A JP6226105B1 JP 6226105 B1 JP6226105 B1 JP 6226105B1 JP 2017514923 A JP2017514923 A JP 2017514923A JP 2017514923 A JP2017514923 A JP 2017514923A JP 6226105 B1 JP6226105 B1 JP 6226105B1
Authority
JP
Japan
Prior art keywords
transparent electrode
conductive layer
electrode layer
compound
laminated member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2017514923A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2017159448A1 (ja
Inventor
創 水口
創 水口
麻里恵 小山
麻里恵 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Application granted granted Critical
Publication of JP6226105B1 publication Critical patent/JP6226105B1/ja
Publication of JPWO2017159448A1 publication Critical patent/JPWO2017159448A1/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Position Input By Displaying (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2017514923A 2016-03-17 2017-03-07 積層部材及びタッチパネル Expired - Fee Related JP6226105B1 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016053828 2016-03-17
JP2016053829 2016-03-17
JP2016053829 2016-03-17
JP2016053828 2016-03-17
PCT/JP2017/008913 WO2017159448A1 (ja) 2016-03-17 2017-03-07 積層部材及びタッチパネル

Publications (2)

Publication Number Publication Date
JP6226105B1 true JP6226105B1 (ja) 2017-11-08
JPWO2017159448A1 JPWO2017159448A1 (ja) 2018-03-22

Family

ID=59850919

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017514923A Expired - Fee Related JP6226105B1 (ja) 2016-03-17 2017-03-07 積層部材及びタッチパネル
JP2017514922A Expired - Fee Related JP6566027B2 (ja) 2016-03-17 2017-03-07 感光性導電ペーストおよび導電パターン付基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017514922A Expired - Fee Related JP6566027B2 (ja) 2016-03-17 2017-03-07 感光性導電ペーストおよび導電パターン付基板の製造方法

Country Status (5)

Country Link
JP (2) JP6226105B1 (zh)
KR (2) KR20180121875A (zh)
CN (2) CN108700806A (zh)
TW (2) TWI697994B (zh)
WO (2) WO2017159445A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020110453A1 (ja) * 2018-11-30 2020-06-04 東レ株式会社 感光性導電ペーストおよび導電パターン形成用フィルム並びに積層部材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006019019A1 (ja) * 2004-08-17 2006-02-23 Toray Industries, Inc. タッチパネル用複合透明導電性基材およびタッチパネル
JP2010077187A (ja) * 2008-09-24 2010-04-08 Shin Etsu Polymer Co Ltd 導電性高分子溶液、導電性塗膜および入力デバイス
JP2011005793A (ja) * 2009-06-29 2011-01-13 Dainippon Printing Co Ltd タッチパネル用耐湿熱性透明導電積層体及び耐湿熱透明積層プラスチックタッチパネル

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3297199B2 (ja) * 1993-09-14 2002-07-02 株式会社東芝 レジスト組成物
JP3239772B2 (ja) * 1995-10-09 2001-12-17 信越化学工業株式会社 化学増幅ポジ型レジスト材料
JP4048777B2 (ja) * 2001-12-27 2008-02-20 東レ株式会社 透明導電ペースト、それを用いたディスプレイ用部材およびプラズマディスプレイパネルならびにプラズマディスプレイパネル用部材の製造方法
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
TW200420694A (en) * 2003-04-15 2004-10-16 Taiyo Ink Mfg Co Ltd Photo-curable thermosetting conductive composition, conductive circuit using the conductive composition, and forming method thereof
US7666326B2 (en) * 2004-08-30 2010-02-23 Shin-Etsu Polymer Co., Ltd. Conductive composition and conductive cross-linked product, capacitor and production method thereof, and antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium
JP2007095506A (ja) * 2005-09-29 2007-04-12 Shin Etsu Polymer Co Ltd タッチパネル用透明導電シート並びにその製造方法、及びタッチパネル
JP4635888B2 (ja) 2006-02-01 2011-02-23 藤倉化成株式会社 導電性ペーストおよび導電性回路の製造方法
JP5650363B2 (ja) * 2007-04-27 2015-01-07 信越ポリマー株式会社 導電性回路及びその形成方法
JP4936142B2 (ja) 2008-03-21 2012-05-23 福田金属箔粉工業株式会社 導電性ペースト組成物及び電子回路並びに電子部品
JP5612814B2 (ja) * 2008-09-22 2014-10-22 信越ポリマー株式会社 導電性高分子溶液、導電性塗膜および入力デバイス
KR101752023B1 (ko) * 2010-02-05 2017-06-28 나믹스 가부시끼가이샤 금속 도전성 페이스트용의 환원제 조성물
JP5375692B2 (ja) 2010-03-17 2013-12-25 大日本印刷株式会社 タッチパネルセンサの製造方法
WO2011114846A1 (ja) * 2010-03-18 2011-09-22 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
SG190020A1 (en) * 2010-10-29 2013-06-28 Shinetsu Polymer Co Transparent conductive glass substrate
JP5492967B2 (ja) 2011-11-29 2014-05-14 太陽インキ製造株式会社 導電回路形成用導電性樹脂組成物及び導電回路
JP5360285B2 (ja) * 2012-01-26 2013-12-04 東レ株式会社 感光性導電ペースト
JP5463498B1 (ja) * 2012-12-28 2014-04-09 東洋インキＳｃホールディングス株式会社 感光性導電性インキ及びその硬化物
CN105340023B (zh) * 2013-06-27 2017-06-13 东丽株式会社 导电糊剂、导电图案的制造方法及触摸面板
KR20150073529A (ko) 2013-12-23 2015-07-01 삼성전기주식회사 터치 패널, 이의 제조 방법 및 터치스크린 장치.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006019019A1 (ja) * 2004-08-17 2006-02-23 Toray Industries, Inc. タッチパネル用複合透明導電性基材およびタッチパネル
JP2010077187A (ja) * 2008-09-24 2010-04-08 Shin Etsu Polymer Co Ltd 導電性高分子溶液、導電性塗膜および入力デバイス
JP2011005793A (ja) * 2009-06-29 2011-01-13 Dainippon Printing Co Ltd タッチパネル用耐湿熱性透明導電積層体及び耐湿熱透明積層プラスチックタッチパネル

Also Published As

Publication number Publication date
KR102096831B1 (ko) 2020-04-03
KR20180121876A (ko) 2018-11-09
CN108701509A (zh) 2018-10-23
KR20180121875A (ko) 2018-11-09
JPWO2017159445A1 (ja) 2019-01-17
TW201800850A (zh) 2018-01-01
TWI697994B (zh) 2020-07-01
WO2017159448A1 (ja) 2017-09-21
CN108700806A (zh) 2018-10-23
WO2017159445A1 (ja) 2017-09-21
JPWO2017159448A1 (ja) 2018-03-22
TWI704417B (zh) 2020-09-11
TW201739029A (zh) 2017-11-01
CN108701509B (zh) 2020-02-07
JP6566027B2 (ja) 2019-08-28

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