JP6208486B2 - プローブカード及びその製造方法 - Google Patents

プローブカード及びその製造方法 Download PDF

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Publication number
JP6208486B2
JP6208486B2 JP2013150104A JP2013150104A JP6208486B2 JP 6208486 B2 JP6208486 B2 JP 6208486B2 JP 2013150104 A JP2013150104 A JP 2013150104A JP 2013150104 A JP2013150104 A JP 2013150104A JP 6208486 B2 JP6208486 B2 JP 6208486B2
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JP
Japan
Prior art keywords
contact terminal
bonding wire
resin portion
gold
bonding
Prior art date
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Active
Application number
JP2013150104A
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English (en)
Japanese (ja)
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JP2015021842A (ja
JP2015021842A5 (enExample
Inventor
亮 深澤
亮 深澤
堀内　道夫
道夫 堀内
徳武　安衛
安衛 徳武
勇一 松田
勇一 松田
光浩 相澤
光浩 相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2013150104A priority Critical patent/JP6208486B2/ja
Priority to US14/327,732 priority patent/US9470718B2/en
Publication of JP2015021842A publication Critical patent/JP2015021842A/ja
Publication of JP2015021842A5 publication Critical patent/JP2015021842A5/ja
Application granted granted Critical
Publication of JP6208486B2 publication Critical patent/JP6208486B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2013150104A 2013-07-19 2013-07-19 プローブカード及びその製造方法 Active JP6208486B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013150104A JP6208486B2 (ja) 2013-07-19 2013-07-19 プローブカード及びその製造方法
US14/327,732 US9470718B2 (en) 2013-07-19 2014-07-10 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013150104A JP6208486B2 (ja) 2013-07-19 2013-07-19 プローブカード及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015021842A JP2015021842A (ja) 2015-02-02
JP2015021842A5 JP2015021842A5 (enExample) 2016-05-12
JP6208486B2 true JP6208486B2 (ja) 2017-10-04

Family

ID=52343101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013150104A Active JP6208486B2 (ja) 2013-07-19 2013-07-19 プローブカード及びその製造方法

Country Status (2)

Country Link
US (1) US9470718B2 (enExample)
JP (1) JP6208486B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911361A (en) * 1974-06-28 1975-10-07 Ibm Coaxial array space transformer
US3866119A (en) * 1973-09-10 1975-02-11 Probe Rite Inc Probe head-probing machine coupling adaptor
JPS59154054A (ja) * 1983-02-23 1984-09-03 Hitachi Ltd ワイヤおよびそれを用いた半導体装置
US5785538A (en) * 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
JP3307823B2 (ja) * 1996-02-23 2002-07-24 松下電器産業株式会社 電子部品検査用接触体の製造方法
JP3128199B2 (ja) * 1996-06-28 2001-01-29 信越ポリマー株式会社 検査用プローブ
JP2000150701A (ja) * 1998-11-05 2000-05-30 Shinko Electric Ind Co Ltd 半導体装置並びにこれに用いる接続用基板及びその製造方法
JP2000294311A (ja) 1999-04-12 2000-10-20 Shin Etsu Polymer Co Ltd 電気コネクタとその製造方法
JP2001013166A (ja) * 1999-06-28 2001-01-19 Toshiba Corp 半導体装置評価用プローブ構造体及びその製造方法
JP4014912B2 (ja) 2001-09-28 2007-11-28 株式会社ルネサステクノロジ 半導体装置
JP2005091065A (ja) * 2003-09-16 2005-04-07 Oki Electric Ind Co Ltd 半導体装置への動作電圧供給装置及び動作電圧供給方法
JP2005172603A (ja) * 2003-12-10 2005-06-30 Nidec-Read Corp 基板検査装置及びこれに用いられる接続治具の製造方法
JP2006058157A (ja) * 2004-08-20 2006-03-02 Toyota Motor Corp プローブカード
JP2009192309A (ja) * 2008-02-13 2009-08-27 Shinko Electric Ind Co Ltd 半導体検査装置
JP2011061112A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 半導体チップ積層体及び製造方法
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
JP6189187B2 (ja) * 2013-11-19 2017-08-30 新光電気工業株式会社 プローブカード及びプローブカードの製造方法

Also Published As

Publication number Publication date
US9470718B2 (en) 2016-10-18
JP2015021842A (ja) 2015-02-02
US20150022229A1 (en) 2015-01-22

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