JP6205692B2 - 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板 - Google Patents
熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板 Download PDFInfo
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- JP6205692B2 JP6205692B2 JP2012193114A JP2012193114A JP6205692B2 JP 6205692 B2 JP6205692 B2 JP 6205692B2 JP 2012193114 A JP2012193114 A JP 2012193114A JP 2012193114 A JP2012193114 A JP 2012193114A JP 6205692 B2 JP6205692 B2 JP 6205692B2
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
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- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012193114A JP6205692B2 (ja) | 2012-09-03 | 2012-09-03 | 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板 |
| TW108126982A TWI756552B (zh) | 2012-09-03 | 2013-08-29 | 熱硬化性環氧樹脂組成物、絕緣層形成用接著薄膜、絕緣層形成用預浸體、印刷配線板用絕緣體、多層印刷配線板及半導體裝置 |
| TW111104959A TWI836345B (zh) | 2012-09-03 | 2013-08-29 | 熱硬化性環氧樹脂組成物、絕緣層形成用接著薄膜、絕緣層形成用預浸體、印刷配線板用絕緣體、多層印刷配線板及半導體裝置 |
| TW102131035A TWI677528B (zh) | 2012-09-03 | 2013-08-29 | 多層印刷配線板之絕緣層用的熱硬化性環氧樹脂組成物、多層印刷配線板之絕緣層用的接著薄膜及多層印刷配線板 |
| KR1020130104793A KR102077867B1 (ko) | 2012-09-03 | 2013-09-02 | 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012193114A JP6205692B2 (ja) | 2012-09-03 | 2012-09-03 | 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板 |
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| JP2017002144A Division JP6763788B2 (ja) | 2017-01-10 | 2017-01-10 | 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板 |
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| JP2014047318A JP2014047318A (ja) | 2014-03-17 |
| JP6205692B2 true JP6205692B2 (ja) | 2017-10-04 |
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| Country | Link |
|---|---|
| JP (1) | JP6205692B2 (zh) |
| KR (1) | KR102077867B1 (zh) |
| TW (3) | TWI677528B (zh) |
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| JP5624184B1 (ja) | 2013-06-28 | 2014-11-12 | 太陽インキ製造株式会社 | ドライフィルムおよびプリント配線板 |
| JP6398283B2 (ja) * | 2014-04-18 | 2018-10-03 | 味の素株式会社 | 樹脂組成物 |
| JP6503633B2 (ja) * | 2014-04-24 | 2019-04-24 | 味の素株式会社 | 回路基板の製造方法 |
| JP6844311B2 (ja) * | 2016-03-28 | 2021-03-17 | 味の素株式会社 | 樹脂組成物 |
| JP7114214B2 (ja) * | 2016-05-24 | 2022-08-08 | 味の素株式会社 | 接着フィルム |
| JP7418941B2 (ja) * | 2016-08-19 | 2024-01-22 | 味の素株式会社 | 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置 |
| JP6776749B2 (ja) | 2016-09-12 | 2020-10-28 | 味の素株式会社 | 樹脂組成物 |
| JP7258453B2 (ja) * | 2017-03-31 | 2023-04-17 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
| JP7119290B2 (ja) * | 2017-05-30 | 2022-08-17 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
| JP6988588B2 (ja) | 2018-03-08 | 2022-01-05 | 味の素株式会社 | 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置 |
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| WO2020116512A1 (ja) * | 2018-12-04 | 2020-06-11 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品 |
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| KR20240050687A (ko) * | 2022-10-12 | 2024-04-19 | 한국전기연구원 | 열가소성 고분자를 포함하는 절연체 조성물 |
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| JPH10275983A (ja) * | 1997-03-31 | 1998-10-13 | Ibiden Co Ltd | 多層プリント配線板 |
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| JP2006063256A (ja) * | 2004-08-30 | 2006-03-09 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物及びこれを用いた積層板 |
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| US20110189432A1 (en) * | 2008-07-29 | 2011-08-04 | Sekisui Chemical Co., Ltd. | Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| JP5396805B2 (ja) | 2008-10-07 | 2014-01-22 | 味の素株式会社 | エポキシ樹脂組成物 |
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| CN102985485B (zh) * | 2010-07-02 | 2014-09-03 | Dic株式会社 | 热固性树脂组合物、其固化物、活性酯树脂、半导体密封材料、预浸料、电路基板、及积层薄膜 |
| JP6308713B2 (ja) * | 2012-08-07 | 2018-04-11 | 味の素株式会社 | 樹脂組成物 |
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- 2013-08-29 TW TW111104959A patent/TWI836345B/zh active
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- 2013-09-02 KR KR1020130104793A patent/KR102077867B1/ko active IP Right Grant
Also Published As
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|---|---|
| TWI677528B (zh) | 2019-11-21 |
| TW201942246A (zh) | 2019-11-01 |
| KR102077867B1 (ko) | 2020-02-14 |
| TWI756552B (zh) | 2022-03-01 |
| TWI836345B (zh) | 2024-03-21 |
| TW202222889A (zh) | 2022-06-16 |
| TW201418358A (zh) | 2014-05-16 |
| JP2014047318A (ja) | 2014-03-17 |
| KR20140031136A (ko) | 2014-03-12 |
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