KR102077867B1 - 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 - Google Patents

열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 Download PDF

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Publication number
KR102077867B1
KR102077867B1 KR1020130104793A KR20130104793A KR102077867B1 KR 102077867 B1 KR102077867 B1 KR 102077867B1 KR 1020130104793 A KR1020130104793 A KR 1020130104793A KR 20130104793 A KR20130104793 A KR 20130104793A KR 102077867 B1 KR102077867 B1 KR 102077867B1
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KR
South Korea
Prior art keywords
resin composition
epoxy resin
printed wiring
insulating layer
mass
Prior art date
Application number
KR1020130104793A
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English (en)
Korean (ko)
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KR20140031136A (ko
Inventor
겐지 가와이
유키 야마모토
Original Assignee
아지노모토 가부시키가이샤
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Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20140031136A publication Critical patent/KR20140031136A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020130104793A 2012-09-03 2013-09-02 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 KR102077867B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012193114A JP6205692B2 (ja) 2012-09-03 2012-09-03 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JPJP-P-2012-193114 2012-09-03

Publications (2)

Publication Number Publication Date
KR20140031136A KR20140031136A (ko) 2014-03-12
KR102077867B1 true KR102077867B1 (ko) 2020-02-14

Family

ID=50607323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130104793A KR102077867B1 (ko) 2012-09-03 2013-09-02 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판

Country Status (3)

Country Link
JP (1) JP6205692B2 (zh)
KR (1) KR102077867B1 (zh)
TW (3) TWI677528B (zh)

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* Cited by examiner, † Cited by third party
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JP5624184B1 (ja) * 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP6398283B2 (ja) * 2014-04-18 2018-10-03 味の素株式会社 樹脂組成物
JP6503633B2 (ja) * 2014-04-24 2019-04-24 味の素株式会社 回路基板の製造方法
JP6844311B2 (ja) * 2016-03-28 2021-03-17 味の素株式会社 樹脂組成物
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP7418941B2 (ja) * 2016-08-19 2024-01-22 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP6776749B2 (ja) 2016-09-12 2020-10-28 味の素株式会社 樹脂組成物
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7119290B2 (ja) * 2017-05-30 2022-08-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6988588B2 (ja) 2018-03-08 2022-01-05 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP6627944B2 (ja) * 2018-10-09 2020-01-08 味の素株式会社 回路基板の製造方法
WO2020116512A1 (ja) * 2018-12-04 2020-06-11 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
JP2023063949A (ja) 2021-10-25 2023-05-10 味の素株式会社 樹脂組成物
KR20240050687A (ko) * 2022-10-12 2024-04-19 한국전기연구원 열가소성 고분자를 포함하는 절연체 조성물

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2006063256A (ja) * 2004-08-30 2006-03-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びこれを用いた積層板
JP2012012534A (ja) * 2010-07-02 2012-01-19 Dic Corp 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

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JPH0782348A (ja) 1993-07-22 1995-03-28 Hitachi Chem Co Ltd エポキシ樹脂組成物及びその硬化物
JPH10275983A (ja) * 1997-03-31 1998-10-13 Ibiden Co Ltd 多層プリント配線板
JP4058672B2 (ja) * 2002-02-28 2008-03-12 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
JP2004210936A (ja) * 2002-12-27 2004-07-29 Tdk Corp プリプレグ、シート状樹脂硬化物及び積層体
JP4983228B2 (ja) * 2005-11-29 2012-07-25 味の素株式会社 多層プリント配線板の絶縁層用樹脂組成物
JP2009040919A (ja) * 2007-08-09 2009-02-26 Sekisui Chem Co Ltd 熱硬化性樹脂組成物、及びこれを用いてなる樹脂フィルム、積層板、プリプレグ
KR101383434B1 (ko) * 2008-07-31 2014-04-08 세키스이가가쿠 고교가부시키가이샤 에폭시 수지 조성물, 프리프레그, 경화체, 시트상 성형체, 적층판 및 다층 적층판
JP5396805B2 (ja) 2008-10-07 2014-01-22 味の素株式会社 エポキシ樹脂組成物
WO2010061980A1 (ja) * 2008-11-28 2010-06-03 味の素株式会社 樹脂組成物
TWI494364B (zh) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5408046B2 (ja) * 2010-06-10 2014-02-05 味の素株式会社 樹脂組成物
EP2589625B1 (en) * 2010-07-02 2016-10-26 DIC Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film
JP6308713B2 (ja) * 2012-08-07 2018-04-11 味の素株式会社 樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063256A (ja) * 2004-08-30 2006-03-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びこれを用いた積層板
JP2012012534A (ja) * 2010-07-02 2012-01-19 Dic Corp 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

Also Published As

Publication number Publication date
TWI756552B (zh) 2022-03-01
KR20140031136A (ko) 2014-03-12
TWI836345B (zh) 2024-03-21
JP2014047318A (ja) 2014-03-17
JP6205692B2 (ja) 2017-10-04
TW201942246A (zh) 2019-11-01
TW201418358A (zh) 2014-05-16
TWI677528B (zh) 2019-11-21
TW202222889A (zh) 2022-06-16

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