JP6202788B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP6202788B2
JP6202788B2 JP2012130099A JP2012130099A JP6202788B2 JP 6202788 B2 JP6202788 B2 JP 6202788B2 JP 2012130099 A JP2012130099 A JP 2012130099A JP 2012130099 A JP2012130099 A JP 2012130099A JP 6202788 B2 JP6202788 B2 JP 6202788B2
Authority
JP
Japan
Prior art keywords
layer
electronic component
ground
pad
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012130099A
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English (en)
Japanese (ja)
Other versions
JP2013254869A5 (enExample
JP2013254869A (ja
Inventor
清和 中禮
清和 中禮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012130099A priority Critical patent/JP6202788B2/ja
Publication of JP2013254869A publication Critical patent/JP2013254869A/ja
Publication of JP2013254869A5 publication Critical patent/JP2013254869A5/ja
Application granted granted Critical
Publication of JP6202788B2 publication Critical patent/JP6202788B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Images

Landscapes

  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2012130099A 2012-06-07 2012-06-07 電子機器 Expired - Fee Related JP6202788B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012130099A JP6202788B2 (ja) 2012-06-07 2012-06-07 電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012130099A JP6202788B2 (ja) 2012-06-07 2012-06-07 電子機器

Publications (3)

Publication Number Publication Date
JP2013254869A JP2013254869A (ja) 2013-12-19
JP2013254869A5 JP2013254869A5 (enExample) 2015-07-23
JP6202788B2 true JP6202788B2 (ja) 2017-09-27

Family

ID=49952144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012130099A Expired - Fee Related JP6202788B2 (ja) 2012-06-07 2012-06-07 電子機器

Country Status (1)

Country Link
JP (1) JP6202788B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6729044B2 (ja) * 2016-06-20 2020-07-22 大日本印刷株式会社 配線基板およびその製造方法、ならびに半導体装置の製造方法
JP7308999B1 (ja) 2022-02-10 2023-07-14 三菱電機株式会社 電力変換装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065994A (ja) * 1992-06-18 1994-01-14 Mitsubishi Electric Corp 多層プリント配線板
JP3193142B2 (ja) * 1992-08-28 2001-07-30 株式会社東芝 基 板
JPH0799396A (ja) * 1993-09-29 1995-04-11 Fujitsu Ltd ヒートシンク
JP4306000B2 (ja) * 1999-03-24 2009-07-29 パナソニック株式会社 電気回路部の放熱装置
JP2005150454A (ja) * 2003-11-17 2005-06-09 Yaskawa Electric Corp 電力変換装置の冷却構造

Also Published As

Publication number Publication date
JP2013254869A (ja) 2013-12-19

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