JP6200534B2 - 鉛フリーはんだ合金、電子回路基板および電子制御装置 - Google Patents
鉛フリーはんだ合金、電子回路基板および電子制御装置 Download PDFInfo
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- JP6200534B2 JP6200534B2 JP2016038976A JP2016038976A JP6200534B2 JP 6200534 B2 JP6200534 B2 JP 6200534B2 JP 2016038976 A JP2016038976 A JP 2016038976A JP 2016038976 A JP2016038976 A JP 2016038976A JP 6200534 B2 JP6200534 B2 JP 6200534B2
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- 229910000679 solder Inorganic materials 0.000 title claims description 236
- 229910045601 alloy Inorganic materials 0.000 title claims description 112
- 239000000956 alloy Substances 0.000 title claims description 112
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910000927 Ge alloy Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 44
- 239000010949 copper Substances 0.000 description 37
- 230000004907 flux Effects 0.000 description 36
- 238000012360 testing method Methods 0.000 description 31
- 239000000047 product Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 20
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 19
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 19
- 230000035939 shock Effects 0.000 description 19
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 16
- 239000000203 mixture Substances 0.000 description 15
- -1 for example Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 239000004593 Epoxy Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 8
- 239000000539 dimer Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 229910000765 intermetallic Inorganic materials 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011800 void material Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000003405 preventing effect Effects 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000001629 suppression Effects 0.000 description 5
- 239000003981 vehicle Substances 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 229910006913 SnSb Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000002530 phenolic antioxidant Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000013008 thixotropic agent Substances 0.000 description 3
- DSESGJJGBBAHNW-UHFFFAOYSA-N (e)-[amino(anilino)methylidene]-phenylazanium;bromide Chemical class Br.C=1C=CC=CC=1N=C(N)NC1=CC=CC=C1 DSESGJJGBBAHNW-UHFFFAOYSA-N 0.000 description 2
- 206010053759 Growth retardation Diseases 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JJOJFIHJIRWASH-UHFFFAOYSA-N Eicosanedioic acid Natural products OC(=O)CCCCCCCCCCCCCCCCCCC(O)=O JJOJFIHJIRWASH-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- QOHWJRRXQPGIQW-UHFFFAOYSA-N cyclohexanamine;hydron;bromide Chemical class Br.NC1CCCCC1 QOHWJRRXQPGIQW-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000001664 diethylamino group Chemical class [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical class [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Chemical class 0.000 description 1
- 229920005906 polyester polyol Chemical class 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/073,570 US20160279741A1 (en) | 2015-03-24 | 2016-03-17 | Lead-free solder alloy, electronic circuit board, and electronic control device |
| CN201610154029.4A CN106001978B (zh) | 2015-03-24 | 2016-03-17 | 无铅软钎料合金、电子电路基板和电子控制装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015061792 | 2015-03-24 | ||
| JP2015061792 | 2015-03-24 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017046823A Division JP6677668B2 (ja) | 2015-03-24 | 2017-03-10 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| JP2017143140A Division JP6755837B2 (ja) | 2015-03-24 | 2017-07-24 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016179498A JP2016179498A (ja) | 2016-10-13 |
| JP6200534B2 true JP6200534B2 (ja) | 2017-09-20 |
Family
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016038976A Active JP6200534B2 (ja) | 2015-03-24 | 2016-03-01 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| JP2017046823A Active JP6677668B2 (ja) | 2015-03-24 | 2017-03-10 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| JP2017143140A Active JP6755837B2 (ja) | 2015-03-24 | 2017-07-24 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017046823A Active JP6677668B2 (ja) | 2015-03-24 | 2017-03-10 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| JP2017143140A Active JP6755837B2 (ja) | 2015-03-24 | 2017-07-24 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (3) | JP6200534B2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017170465A (ja) * | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| US10456872B2 (en) | 2017-09-08 | 2019-10-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit substrate, and electronic device |
| US10926360B2 (en) | 2016-03-22 | 2021-02-23 | Tamura Corporation | Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device |
| US11167379B2 (en) | 2019-03-27 | 2021-11-09 | Senju Metal Industry Co., Ltd. | Solder alloy, solder ball, solder preform, solder paste and solder joint |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6516013B2 (ja) * | 2015-09-17 | 2019-05-22 | 富士電機株式会社 | 半導体装置用はんだ材 |
| JP6522674B2 (ja) * | 2017-01-31 | 2019-05-29 | 株式会社タムラ製作所 | フラックス組成物、ソルダペースト及び電子回路基板 |
| PT3603877T (pt) | 2017-03-31 | 2021-09-09 | Senju Metal Industry Co | Liga de soldadura, pasta de soldadura, e junta de soldadura |
| JP6397079B1 (ja) * | 2017-04-07 | 2018-09-26 | 株式会社ケーヒン | はんだ材料 |
| CA3054395A1 (en) * | 2017-09-14 | 2019-03-21 | Tamura Corporation | Lead-free solder alloy, electronic circuit substrate, and electronic control device |
| JP7133397B2 (ja) * | 2017-09-27 | 2022-09-08 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板及び電子制御装置 |
| JP6349615B1 (ja) * | 2017-10-03 | 2018-07-04 | 株式会社弘輝 | はんだ合金、はんだ接合材料及び電子回路基板 |
| JP6370458B1 (ja) * | 2017-10-27 | 2018-08-08 | ニホンハンダ株式会社 | 鉛フリーはんだ合金、及び、電子回路基板 |
| JP6719443B2 (ja) * | 2017-12-12 | 2020-07-08 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置 |
| JP6427752B1 (ja) * | 2018-03-06 | 2018-11-28 | 株式会社弘輝 | はんだ合金、はんだ接合材料及び電子回路基板 |
| WO2020031361A1 (ja) * | 2018-08-09 | 2020-02-13 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 |
| EP3931364A1 (en) * | 2019-02-26 | 2022-01-05 | Indium Corporation | High reliability leadfree solder alloys for harsh service conditions |
| JP7089491B2 (ja) * | 2019-04-23 | 2022-06-22 | 株式会社タムラ製作所 | フラックス組成物、ソルダペースト及び電子回路基板 |
| TWI742813B (zh) * | 2019-09-02 | 2021-10-11 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金 |
| JP6889387B1 (ja) | 2020-06-23 | 2021-06-18 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置 |
| JP6836040B1 (ja) | 2020-07-31 | 2021-02-24 | 千住金属工業株式会社 | はんだ合金 |
| JP2023141365A (ja) * | 2022-03-23 | 2023-10-05 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 |
| KR20250041178A (ko) * | 2022-08-12 | 2025-03-25 | 센주긴조쿠고교 가부시키가이샤 | 땜납 합금, 땜납 페이스트 및 땜납 조인트 |
| CN117798544B (zh) * | 2023-11-10 | 2024-09-20 | 苏州优诺电子材料科技有限公司 | 一种高强抗热疲劳无铅焊料合金及其制备方法 |
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| JP4787384B1 (ja) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2017170465A (ja) * | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| US10926360B2 (en) | 2016-03-22 | 2021-02-23 | Tamura Corporation | Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device |
| US10456872B2 (en) | 2017-09-08 | 2019-10-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit substrate, and electronic device |
| US11167379B2 (en) | 2019-03-27 | 2021-11-09 | Senju Metal Industry Co., Ltd. | Solder alloy, solder ball, solder preform, solder paste and solder joint |
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| JP2017127907A (ja) | 2017-07-27 |
| JP2016179498A (ja) | 2016-10-13 |
| JP6755837B2 (ja) | 2020-09-16 |
| JP6677668B2 (ja) | 2020-04-08 |
| JP2017209732A (ja) | 2017-11-30 |
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