JP6198804B2 - 多点計測用のひずみセンサとその製造方法 - Google Patents

多点計測用のひずみセンサとその製造方法 Download PDF

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Publication number
JP6198804B2
JP6198804B2 JP2015234431A JP2015234431A JP6198804B2 JP 6198804 B2 JP6198804 B2 JP 6198804B2 JP 2015234431 A JP2015234431 A JP 2015234431A JP 2015234431 A JP2015234431 A JP 2015234431A JP 6198804 B2 JP6198804 B2 JP 6198804B2
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Japan
Prior art keywords
strain
base film
sensor
portions
strain sensor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2015234431A
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English (en)
Japanese (ja)
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JP2017101982A5 (enExample
JP2017101982A (ja
Inventor
一登 中村
一登 中村
喜博 坂田
喜博 坂田
永嗣 川島
永嗣 川島
六佑 竹村
六佑 竹村
好司 岡本
好司 岡本
宏之 永井
宏之 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
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Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP2015234431A priority Critical patent/JP6198804B2/ja
Priority to PCT/JP2016/080555 priority patent/WO2017094365A1/ja
Priority to US15/759,861 priority patent/US10190864B2/en
Priority to CN201680069985.0A priority patent/CN108291798B/zh
Priority to TW105139165A priority patent/TWI717422B/zh
Publication of JP2017101982A publication Critical patent/JP2017101982A/ja
Publication of JP2017101982A5 publication Critical patent/JP2017101982A5/ja
Application granted granted Critical
Publication of JP6198804B2 publication Critical patent/JP6198804B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2015234431A 2015-12-01 2015-12-01 多点計測用のひずみセンサとその製造方法 Expired - Fee Related JP6198804B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015234431A JP6198804B2 (ja) 2015-12-01 2015-12-01 多点計測用のひずみセンサとその製造方法
PCT/JP2016/080555 WO2017094365A1 (ja) 2015-12-01 2016-10-14 多点計測用のひずみセンサとその製造方法
US15/759,861 US10190864B2 (en) 2015-12-01 2016-10-14 Multipoint-measurement strain sensor and method for producing the same
CN201680069985.0A CN108291798B (zh) 2015-12-01 2016-10-14 多点测量用应变传感器及其制造方法
TW105139165A TWI717422B (zh) 2015-12-01 2016-11-29 多點量測用之應變感測器及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015234431A JP6198804B2 (ja) 2015-12-01 2015-12-01 多点計測用のひずみセンサとその製造方法

Publications (3)

Publication Number Publication Date
JP2017101982A JP2017101982A (ja) 2017-06-08
JP2017101982A5 JP2017101982A5 (enExample) 2017-08-31
JP6198804B2 true JP6198804B2 (ja) 2017-09-20

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Family Applications (1)

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JP2015234431A Expired - Fee Related JP6198804B2 (ja) 2015-12-01 2015-12-01 多点計測用のひずみセンサとその製造方法

Country Status (5)

Country Link
US (1) US10190864B2 (enExample)
JP (1) JP6198804B2 (enExample)
CN (1) CN108291798B (enExample)
TW (1) TWI717422B (enExample)
WO (1) WO2017094365A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019064529A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 電極の保護膜の形成方法
WO2019064528A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 転写型感光性フィルム、保護膜の形成方法、フォースセンサの製造方法及びフォースセンサ
WO2019064535A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 保護膜、フォースセンサ及び感光性フィルム

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JP2019066453A (ja) * 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ
US20190107380A1 (en) * 2017-10-11 2019-04-11 Sikorsky Aircraft Corporation Strain measurement assembly
CN109959358B (zh) * 2017-12-22 2020-10-23 深圳光启超材料技术有限公司 测量薄膜、测量薄膜的制造方法、平面应变场测量方法
CN110132464A (zh) * 2018-02-09 2019-08-16 南昌欧菲显示科技有限公司 导电薄膜及薄膜电阻应变式压力传感器
JP2020085613A (ja) * 2018-11-22 2020-06-04 ムネカタインダストリアルマシナリー株式会社 歪みセンサアレイおよびその製造方法
CN109855687B (zh) * 2019-02-27 2021-05-11 中国工程物理研究院化工材料研究所 一种柔性温度-应变集成传感器阵列及制备方法
JP7246706B2 (ja) * 2019-03-26 2023-03-28 ムネカタインダストリアルマシナリー株式会社 建設構造物用の歪み検知システム
JP2022008026A (ja) * 2020-04-08 2022-01-13 ミネベアミツミ株式会社 ひずみゲージ
US20230175831A1 (en) * 2020-04-08 2023-06-08 Minebea Mitsumi Inc. Strain gauge
JP7438837B2 (ja) * 2020-04-23 2024-02-27 株式会社シマノ 人力駆動車用のコンポーネント
IT202000018331A1 (it) * 2020-07-28 2022-01-28 Koyre S R L Sistema di rilevamento delle sollecitazioni in una struttura flessibile bidimensionale
CN112188759B (zh) * 2020-09-22 2021-11-16 江南大学 一种应变片阵列电路的直书写打印方法
CN116529575A (zh) * 2020-12-18 2023-08-01 松下知识产权经营株式会社 负荷传感器
WO2023145220A1 (ja) * 2022-01-25 2023-08-03 国立研究開発法人産業技術総合研究所 フレキシブルセンサ及びフレキシブルセンサの製造方法
CN115183731B (zh) * 2022-06-20 2024-12-13 成都飞机工业（集团）有限责任公司 一种机翼表面监测系统及其传感器布置方法

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JPH05141907A (ja) 1991-09-24 1993-06-08 Tokyo Electric Co Ltd 歪センサ及びその製造方法並びにその歪センサを使用したロードセル秤
JP2000332369A (ja) * 1999-05-25 2000-11-30 Mitsui Mining & Smelting Co Ltd プリント回路板及びその製造方法
JP2001015882A (ja) * 1999-07-02 2001-01-19 Nec Corp 歪みゲージ内蔵回路基板およびその製造方法
WO2002057731A1 (en) * 2001-01-22 2002-07-25 K-Tech Devices Corp. Stress sensor
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JP4260864B2 (ja) 2007-09-26 2009-04-30 国土交通省国土技術政策総合研究所長 路面のひずみ測定装置
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JP5198608B2 (ja) * 2010-03-18 2013-05-15 韓国標準科学研究院 半導体ストレインゲージを用いたフレキシブルな力または圧力センサアレイ、そのフレキシブルな力または圧力センサアレイの製造方法、及びそのフレキシブルな力または圧力センサアレイを用いた力または圧力測定方法
CN110377189A (zh) * 2010-12-24 2019-10-25 石墨烯广场株式会社 用于同时检测压力和位置的使用石墨烯的触摸传感器
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JP6211866B2 (ja) * 2013-09-20 2017-10-11 株式会社東芝 圧力センサ、マイクロフォン、血圧センサおよびタッチパネル
US10006820B2 (en) * 2016-03-08 2018-06-26 Apple Inc. Magnetic interference avoidance in resistive sensors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019064529A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 電極の保護膜の形成方法
WO2019064528A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 転写型感光性フィルム、保護膜の形成方法、フォースセンサの製造方法及びフォースセンサ
WO2019064535A1 (ja) * 2017-09-29 2019-04-04 日立化成株式会社 保護膜、フォースセンサ及び感光性フィルム

Also Published As

Publication number Publication date
CN108291798B (zh) 2019-11-12
CN108291798A (zh) 2018-07-17
WO2017094365A1 (ja) 2017-06-08
US10190864B2 (en) 2019-01-29
TWI717422B (zh) 2021-02-01
US20180259315A1 (en) 2018-09-13
TW201732218A (zh) 2017-09-16
JP2017101982A (ja) 2017-06-08

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