JP6168567B2 - 印刷回路基板及びその製造方法 - Google Patents
印刷回路基板及びその製造方法 Download PDFInfo
- Publication number
- JP6168567B2 JP6168567B2 JP2015181086A JP2015181086A JP6168567B2 JP 6168567 B2 JP6168567 B2 JP 6168567B2 JP 2015181086 A JP2015181086 A JP 2015181086A JP 2015181086 A JP2015181086 A JP 2015181086A JP 6168567 B2 JP6168567 B2 JP 6168567B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- resin
- core
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000011521 glass Substances 0.000 claims description 97
- 239000010410 layer Substances 0.000 claims description 84
- 229920005989 resin Polymers 0.000 claims description 61
- 239000011347 resin Substances 0.000 claims description 61
- 238000005520 cutting process Methods 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000009751 slip forming Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010949 copper Substances 0.000 description 8
- 238000003892 spreading Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012779 reinforcing material Substances 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910052798 chalcogen Inorganic materials 0.000 description 2
- 150000001787 chalcogens Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005365 phosphate glass Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15323—Connection portion the connection portion being formed on the die mounting surface of the substrate being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Ceramic Engineering (AREA)
Description
図1aは本発明の一実施形態による印刷回路基板の構造を示す側断面図であり、図1bは図1aのA−A'に沿った断面図である。
図5aから図5dは本発明の一実施形態による印刷回路基板のコア部の製造工程を示す図面である。
11、12 樹脂層
15 溝部
20 内部回路層
21 密着層
31 溝部孔
32、35 ビア孔
100 コア部
110 絶縁層
150、250 ビア
155 保護層
210、220 配線層
300 半田レジスト
350 半田バンプ
500 半導体チップ
1000 印刷回路基板
Claims (13)
- ガラスコアと、
前記ガラスコア上に配置された樹脂層を含むコア部と、
前記コア部上に配置された配線層と、
前記コア部を貫通するビアと、
前記ガラスコアと前記ビアとの間の熱膨張係数の差異を緩和するために前記ガラスコアと前記ビアとの間に配置された保護層と、を含み、
前記ガラスコアには、前記ガラスコアを貫通し、前記ガラスコアを内部と前記内部を取り囲む外郭部とに分離するように、前記ガラスコアに連続的に形成される溝部が形成される、印刷回路基板。 - 前記溝部は、前記コア部の側面に沿って形成される、請求項1に記載の印刷回路基板。
- 前記溝部は、樹脂で充填される、請求項1に記載の印刷回路基板。
- 前記溝部を充填する樹脂は前記樹脂層を形成する樹脂と一体を成す、請求項3に記載の印刷回路基板。
- 前記ガラスコアの側面は、外部に露出する、請求項1に記載の印刷回路基板。
- 前記ガラスコア上に配置された内部回路層をさらに含む、請求項1に記載の印刷回路基板。
- 前記ガラスコアと内部回路層との間に配置された密着層をさらに含む、請求項6に記載の印刷回路基板。
- 前記保護層は、金属層または樹脂層である、請求項1に記載の印刷回路基板。
- ガラスコアの一面に第1樹脂層を形成する段階と、
前記ガラスコアを貫通する溝部孔を形成する段階と、
前記ガラスコアの他面に第2樹脂層を形成し、コア部を形成する段階と、
前記コア部上に配置層を形成する段階と、
前記コア部を、前記溝部孔の外側に位置した切断領域に沿って切断し、単位印刷回路基板を形成する段階と、
を含む、印刷回路基板の製造方法。 - 前記溝部孔を樹脂で充填する段階をさらに含む、請求項9に記載の印刷回路基板の製造方法。
- 前記溝部孔を樹脂で充填する段階は、
前記ガラスコアの他面に積層される前記第2樹脂層の樹脂が溝部孔に充填される、請求項10に記載の印刷回路基板の製造方法。 - 前記単位印刷回路基板を形成する段階において、
前記ガラスコアの側面が外部に露出される、請求項9に記載の印刷回路基板の製造方法。 - 前記溝部孔を形成する段階において、
前記溝部孔は、前記切断領域に沿って連続的に形成される、請求項9に記載の印刷回路基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140153186A KR102281459B1 (ko) | 2014-11-05 | 2014-11-05 | 인쇄회로기판 및 그 제조방법 |
KR10-2014-0153186 | 2014-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016092402A JP2016092402A (ja) | 2016-05-23 |
JP6168567B2 true JP6168567B2 (ja) | 2017-07-26 |
Family
ID=55854372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015181086A Active JP6168567B2 (ja) | 2014-11-05 | 2015-09-14 | 印刷回路基板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160128186A1 (ja) |
JP (1) | JP6168567B2 (ja) |
KR (1) | KR102281459B1 (ja) |
CN (1) | CN105578710B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018181678A1 (ja) * | 2017-03-30 | 2018-10-04 | 太陽誘電株式会社 | 配線基板及びその製造方法 |
CN208938984U (zh) * | 2018-10-11 | 2019-06-04 | 南京索尔玻璃科技股份有限公司 | 一种光伏组件用超薄增强型玻璃背板及包含它的光伏组件 |
TWI705536B (zh) * | 2018-11-16 | 2020-09-21 | 欣興電子股份有限公司 | 載板結構及其製作方法 |
CN111246662A (zh) * | 2018-11-29 | 2020-06-05 | 欣兴电子股份有限公司 | 载板结构及其制作方法 |
CN111757593B (zh) * | 2020-06-29 | 2023-12-22 | 深圳市百柔新材料技术有限公司 | 玻璃芯板电路板及其制备方法 |
US20230092740A1 (en) * | 2021-09-21 | 2023-03-23 | Intel Corporation | Moat protection to prevent crack propagation in glass core substrates or glass interposers |
CN118629988A (zh) * | 2023-03-08 | 2024-09-10 | 奥特斯奥地利科技与系统技术有限公司 | 部件承载件及其制造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4023076B2 (ja) * | 2000-07-27 | 2007-12-19 | 富士通株式会社 | 表裏導通基板及びその製造方法 |
KR100691725B1 (ko) * | 2002-12-11 | 2007-03-12 | 다이니폰 인사츠 가부시키가이샤 | 다층 배선기판 및 그 제조 방법 |
JP4387269B2 (ja) * | 2004-08-23 | 2009-12-16 | 株式会社テクニスコ | ビアが形成されたガラス基板及びビアの形成方法 |
JP4605499B2 (ja) * | 2004-10-28 | 2011-01-05 | 富士電機ホールディングス株式会社 | 有機elディスプレイの封止構造 |
US7834274B2 (en) * | 2005-12-30 | 2010-11-16 | Industrial Technology Research Institute | Multi-layer printed circuit board and method for fabricating the same |
JP5297139B2 (ja) * | 2008-10-09 | 2013-09-25 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
JP5193809B2 (ja) * | 2008-11-05 | 2013-05-08 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
KR20110030152A (ko) * | 2009-09-17 | 2011-03-23 | 삼성전기주식회사 | 패키지기판 및 그 제조방법 |
JP5452195B2 (ja) * | 2009-12-03 | 2014-03-26 | 株式会社 日立パワーデバイス | 半導体装置及びそれを用いた電力変換装置 |
US8207453B2 (en) | 2009-12-17 | 2012-06-26 | Intel Corporation | Glass core substrate for integrated circuit devices and methods of making the same |
WO2011152085A1 (ja) * | 2010-06-04 | 2011-12-08 | 株式会社 村田製作所 | 集合基板の製造方法 |
EP2627159A4 (en) * | 2010-10-08 | 2018-01-17 | Ngk Spark Plug Co., Ltd. | Multi-cavity wiring board and method for manufacturing same |
JP6038517B2 (ja) * | 2012-07-13 | 2016-12-07 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
-
2014
- 2014-11-05 KR KR1020140153186A patent/KR102281459B1/ko active IP Right Grant
-
2015
- 2015-09-14 JP JP2015181086A patent/JP6168567B2/ja active Active
- 2015-09-17 US US14/857,817 patent/US20160128186A1/en not_active Abandoned
- 2015-09-30 CN CN201510642475.5A patent/CN105578710B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR102281459B1 (ko) | 2021-07-27 |
CN105578710A (zh) | 2016-05-11 |
CN105578710B (zh) | 2019-11-05 |
KR20160053715A (ko) | 2016-05-13 |
JP2016092402A (ja) | 2016-05-23 |
US20160128186A1 (en) | 2016-05-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6168567B2 (ja) | 印刷回路基板及びその製造方法 | |
JP6690830B2 (ja) | 印刷回路基板及びその製造方法 | |
JP6427817B2 (ja) | 印刷回路基板及びその製造方法 | |
JP5114041B2 (ja) | 半導体素子内蔵プリント配線板及びその製造方法 | |
TWI581681B (zh) | 印刷電路板及其製造方法 | |
KR101580287B1 (ko) | 인쇄회로기판, 인쇄회로기판 스트립 및 그 제조방법 | |
KR102450599B1 (ko) | 패키지기판 | |
KR101516072B1 (ko) | 반도체 패키지 및 그 제조 방법 | |
KR102333081B1 (ko) | 인쇄회로기판 | |
JP6721143B2 (ja) | プリント回路基板及びその製造方法 | |
TW201444440A (zh) | 配線基板及其製造方法 | |
US20150373842A1 (en) | Substrate strip, substrate panel, and manufacturing method of substrate strip | |
JP2010062199A (ja) | 回路基板 | |
KR20170004260A (ko) | 인쇄회로기판 및 그 제조방법 | |
KR102470168B1 (ko) | 패키지기판 | |
JP6586814B2 (ja) | 配線基板及びその製造方法、並びに電子装置 | |
JP6523039B2 (ja) | プリント配線板及びその製造方法 | |
KR102442388B1 (ko) | 패키지기판 및 그 제조방법 | |
KR20170047774A (ko) | 인쇄회로기판 및 그 제조방법 | |
JP2019165112A (ja) | 配線基板及び配線基板の製造方法 | |
KR20140131499A (ko) | 인쇄회로기판 | |
CN105828514A (zh) | 布线基板 | |
JP2016219477A (ja) | 電子部品内蔵配線板及びその製造方法 | |
JP2010010431A (ja) | 配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160817 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160913 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20161213 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170208 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170221 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170519 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170530 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170621 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6168567 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |