JP6156869B2 - 位置検出装置、基板製造装置、位置検出方法、及び基板の製造方法 - Google Patents

位置検出装置、基板製造装置、位置検出方法、及び基板の製造方法 Download PDF

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JP6156869B2
JP6156869B2 JP2013135629A JP2013135629A JP6156869B2 JP 6156869 B2 JP6156869 B2 JP 6156869B2 JP 2013135629 A JP2013135629 A JP 2013135629A JP 2013135629 A JP2013135629 A JP 2013135629A JP 6156869 B2 JP6156869 B2 JP 6156869B2
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substrate
alignment mark
imaging unit
unit
screen
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Japanese (ja)
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JP2015012095A (ja
Inventor
渡辺 昭彦
昭彦 渡辺
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Jukiオートメーションシステムズ株式会社
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Priority to JP2013135629A priority Critical patent/JP6156869B2/ja
Priority to KR1020140079019A priority patent/KR102261010B1/ko
Priority to TW103122087A priority patent/TWI614143B/zh
Priority to CN201410302738.3A priority patent/CN104249547B/zh
Publication of JP2015012095A publication Critical patent/JP2015012095A/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015Orientation; Alignment; Positioning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
JP2013135629A 2013-06-27 2013-06-27 位置検出装置、基板製造装置、位置検出方法、及び基板の製造方法 Active JP6156869B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013135629A JP6156869B2 (ja) 2013-06-27 2013-06-27 位置検出装置、基板製造装置、位置検出方法、及び基板の製造方法
KR1020140079019A KR102261010B1 (ko) 2013-06-27 2014-06-26 위치 검출 장치, 기판 제조 장치, 위치 검출 방법, 및 기판의 제조 방법
TW103122087A TWI614143B (zh) 2013-06-27 2014-06-26 位置檢測裝置、基板製造裝置、位置檢測方法及基板的製造方法
CN201410302738.3A CN104249547B (zh) 2013-06-27 2014-06-27 位置检测装置、基板制造装置、位置检测方法及基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013135629A JP6156869B2 (ja) 2013-06-27 2013-06-27 位置検出装置、基板製造装置、位置検出方法、及び基板の製造方法

Publications (2)

Publication Number Publication Date
JP2015012095A JP2015012095A (ja) 2015-01-19
JP6156869B2 true JP6156869B2 (ja) 2017-07-05

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JP2013135629A Active JP6156869B2 (ja) 2013-06-27 2013-06-27 位置検出装置、基板製造装置、位置検出方法、及び基板の製造方法

Country Status (4)

Country Link
JP (1) JP6156869B2 (zh)
KR (1) KR102261010B1 (zh)
CN (1) CN104249547B (zh)
TW (1) TWI614143B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016170573A1 (ja) * 2015-04-20 2016-10-27 ヤマハ発動機株式会社 粘性流体供給装置および部品実装装置
WO2017212541A1 (ja) * 2016-06-07 2017-12-14 富士機械製造株式会社 スクリーン印刷装置
KR101866139B1 (ko) * 2017-08-25 2018-06-08 캐논 톡키 가부시키가이샤 얼라인먼트 방법, 얼라인먼트 장치, 이를 포함하는 진공증착방법 및 진공증착장치
CN208520767U (zh) * 2017-12-07 2019-02-19 南京熊猫电子制造有限公司 一种丝网印刷机钢网洁净度检查设备
CN109377526B (zh) * 2018-11-16 2024-02-23 信利光电股份有限公司 一种圆形基板的丝印对位方法和圆形盖板
CN109360242A (zh) * 2018-11-16 2019-02-19 信利光电股份有限公司 一种圆形基板的丝印对位方法和圆形盖板
HU5103U (hu) * 2018-12-20 2019-12-30 Forgacs Istvan Denes Stencilnyomtatáshoz való, állítható szélességû alátámasztás
CN109466189A (zh) * 2018-12-21 2019-03-15 昆山森特斯印刷技术有限公司 套印定位设备及具有该套印定位设备的套印定位系统
CN110978128B (zh) * 2019-12-23 2021-04-09 重庆大学 一种用于pcb数控钻孔的控制系统及方法
CN111083919B (zh) * 2020-01-15 2021-10-26 东莞市南工机械设备科技有限公司 具有甄别功能的插件机
KR102227885B1 (ko) * 2020-06-02 2021-03-15 주식회사 기가레인 패턴 정렬 가능한 전사 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9323978D0 (en) * 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
JP3384335B2 (ja) * 1998-09-02 2003-03-10 松下電器産業株式会社 自動組立装置および自動組立方法
JP4944407B2 (ja) * 2005-08-01 2012-05-30 富士機械製造株式会社 スクリーン・基板位置合わせ方法および装置
JP2008179029A (ja) 2007-01-24 2008-08-07 Matsushita Electric Ind Co Ltd スクリーン印刷装置およびスクリーン印刷方法
JP5241530B2 (ja) * 2009-01-16 2013-07-17 Juki株式会社 電子部品実装装置および搭載方法
JP5585089B2 (ja) * 2010-01-18 2014-09-10 富士ゼロックス株式会社 劣化状態判定装置、画像形成装置及び劣化状態判定プログラム
JP5565384B2 (ja) * 2011-06-29 2014-08-06 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷装置における画像認識方法
JP6014315B2 (ja) * 2011-09-30 2016-10-25 ヤマハ発動機株式会社 電子部品装着装置の測定方法
JP5868122B2 (ja) * 2011-10-31 2016-02-24 Jukiオートメーションシステムズ株式会社 基板処理装置、テーブル機構、位置決め方法及びプログラム

Also Published As

Publication number Publication date
KR102261010B1 (ko) 2021-06-03
KR20150001675A (ko) 2015-01-06
TW201509688A (zh) 2015-03-16
CN104249547A (zh) 2014-12-31
TWI614143B (zh) 2018-02-11
JP2015012095A (ja) 2015-01-19
CN104249547B (zh) 2018-11-09

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