JP6141627B2 - シリコン基板上にGaN層を形成する方法およびGaN基板 - Google Patents
シリコン基板上にGaN層を形成する方法およびGaN基板 Download PDFInfo
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 92
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 35
- 238000000034 method Methods 0.000 title claims description 35
- 239000010703 silicon Substances 0.000 title claims description 35
- 229910052710 silicon Inorganic materials 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 title claims description 33
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 65
- 239000011800 void material Substances 0.000 claims description 19
- 239000013078 crystal Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910017121 AlSiO Inorganic materials 0.000 claims 1
- 241000287462 Phalacrocorax carbo Species 0.000 claims 1
- 239000010408 film Substances 0.000 description 149
- 229910002601 GaN Inorganic materials 0.000 description 62
- 235000012431 wafers Nutrition 0.000 description 44
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 34
- 238000004519 manufacturing process Methods 0.000 description 14
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001451 molecular beam epitaxy Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 208000012868 Overgrowth Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- YAIQCYZCSGLAAN-UHFFFAOYSA-N [Si+4].[O-2].[Al+3] Chemical compound [Si+4].[O-2].[Al+3] YAIQCYZCSGLAAN-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Description
Claims (19)
- シリコン基板上にGaN層を形成する方法であって、
シリコンウェハと前記シリコンウェハの表面上の結晶性のAl2O3膜との間にAlSiOのアモルファス膜を形成する工程と、
前記Al2O3膜上に複数の積層層を堆積させる工程と、
シリコンウェハの上面上の前記Al2O3膜中にボイドを形成する工程とを含み、
各積層層は、AlNの層上にGaNの層を含み、
前記アモルファス膜は、前記シリコンウェハおよび前記結晶性のAl 2 O 3 膜に由来するアルミニウム、シリコンおよび酸素を含み、
前記シリコンウェハの前記上面は、<111>シリコン結晶方位に沿っており、前記ボイドはAlNおよびGaNによって埋められ、
前記Al2O3膜中のボイド上のGaN膜中の領域は、Al2O3膜中のボイド上以外のGaN膜中の領域よりも高い貫通転位密度を有する、方法。 - 前記ボイドを形成する工程は、前記アモルファス膜の一部を前記ボイドの底部に沿って露出させる工程を含む、請求項1に記載の方法。
- 前記ボイドを形成する工程および前記アモルファス膜を形成する工程は、同時に行われる、請求項2に記載の方法。
- 前記ボイドを形成する工程は、有機金属気相成長(MOCVD)プロセスの一部として行われる、請求項2に記載の方法。
- 前記積層層を堆積する工程は、MOCVDプロセスの一部として行われる、請求項2に記載の方法。
- 前記複数の積層層は、3つの積層層のみである、請求項3に記載の方法。
- 前記複数の積層層は、4つの積層層のみである、請求項3に記載の方法。
- 前記複数の積層層の最終的に形成される積層層のGaN膜は、少なくとも2.5μmの厚さである、請求項1に記載の方法。
- 前記最終的に形成される積層層の前記GaN膜は、少なくとも4μmの厚さである、請求項8に記載の方法。
- 前記アモルファス膜の厚みは2nmから10nmであり、
前記複数の積層層の最終的に形成される積層層のGaN膜上にトランジスタを形成する工程をさらに含む、請求項1に記載の方法。 - GaN基板であって、
<111>結晶方位に沿う上面と、底面と、を有するシリコン基板と、
前記シリコン基板の前記上面上にAl2O3膜とを備え、前記Al2O3膜は結晶性であり、前記GaN基板はさらに、
前記シリコン基板の前記上面と前記Al2O3膜との間にアモルファス膜と、
前記Al2O3膜上に複数の積層層とを備え、
各積層層はAlN膜上にGaN膜を含み、
Al2O3膜中のボイド上のGaN膜中の領域は、Al2O3膜中のボイド上以外のGaN膜中の領域よりも高い貫通転位密度を有する、GaN基板。 - Al2O3膜中に画定される複数のボイドをさらに備える、請求項11に記載のGaN基板。
- 前記シリコン基板から最も遠い最終的な積層層の前記GaN膜は、少なくとも2.5μmの厚さである、請求項12に記載のGaN基板。
- 前記最終的な積層層の前記GaN膜は、少なくとも4μmの厚さである、請求項13に記載のGaN基板。
- 前記シリコン基板の前記上面に最も近い第1の積層層が前記ボイドを埋める、請求項12に記載のGaN基板。
- 第2の積層層は、前記第1の積層層よりも低い貫通転位密度を有し、前記第2の積層層は、前記第1の積層層と比較して前記シリコン基板の前記上面からさらに遠い、請求項15に記載のGaN基板。
- 前記複数の積層層は、3つの積層層のみである、請求項11に記載のGaN基板。
- 前記複数の積層層は、4つの積層層のみである、請求項11に記載のGaN基板。
- 請求項11に記載のGaN基板において、前記シリコン基板から最も遠い最終的な積層層上に形成されたトランジスタであって、
前記アモルファス膜の厚みは2nmから10nmである、トランジスタ。
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US8507947B2 (en) * | 2011-12-09 | 2013-08-13 | Power Integrations, Inc. | High quality GaN high-voltage HFETS on silicon |
US9478708B2 (en) | 2015-03-11 | 2016-10-25 | International Business Machines Corporation | Embedded gallium—nitride in silicon |
US10818611B2 (en) | 2015-07-01 | 2020-10-27 | Ii-Vi Delaware, Inc. | Stress relief in semiconductor wafers |
US20170148747A1 (en) * | 2015-07-01 | 2017-05-25 | Ii-Vi Optoelectronic Devices, Inc. | Stress relief in semiconductor wafers |
CN105591004B (zh) * | 2016-03-29 | 2020-07-10 | 苏州晶湛半导体有限公司 | 基于图形化Si衬底的LED外延片及其制备方法 |
US9917156B1 (en) | 2016-09-02 | 2018-03-13 | IQE, plc | Nucleation layer for growth of III-nitride structures |
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US20220139709A1 (en) * | 2020-11-05 | 2022-05-05 | International Business Machines Corporation | Confined gallium nitride epitaxial layers |
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JP2000164510A (ja) * | 1998-11-26 | 2000-06-16 | Sony Corp | 窒化物系iii−v族化合物半導体基板およびその製造方法ならびに半導体装置およびその製造方法 |
KR20020084194A (ko) * | 2000-03-14 | 2002-11-04 | 도요다 고세이 가부시키가이샤 | Iii족 질화물계 화합물 반도체의 제조방법 및 iii족질화물계 화합물 반도체 소자 |
US20030012984A1 (en) * | 2001-07-11 | 2003-01-16 | Tetsuzo Ueda | Buffer layer and growth method for subsequent epitaxial growth of III-V nitride semiconductors |
JP3785970B2 (ja) * | 2001-09-03 | 2006-06-14 | 日本電気株式会社 | Iii族窒化物半導体素子の製造方法 |
JP2003224071A (ja) * | 2002-01-29 | 2003-08-08 | Matsushita Electric Ind Co Ltd | 窒化物系半導体の製造方法及びそれを用いた窒化物半導体素子 |
JP2004051446A (ja) * | 2002-07-22 | 2004-02-19 | Asahi Kasei Corp | 酸化物単結晶薄膜形成方法および半導体薄膜形成方法 |
US6818061B2 (en) | 2003-04-10 | 2004-11-16 | Honeywell International, Inc. | Method for growing single crystal GaN on silicon |
US7547925B2 (en) | 2005-11-14 | 2009-06-16 | Palo Alto Research Center Incorporated | Superlattice strain relief layer for semiconductor devices |
US7413982B2 (en) * | 2006-03-29 | 2008-08-19 | Eastman Kodak Company | Process for atomic layer deposition |
RU2326993C2 (ru) * | 2006-07-25 | 2008-06-20 | Самсунг Электро-Меканикс Ко., Лтд. | Способ выращивания монокристалла нитрида на кремниевой пластине, нитридный полупроводниковый светоизлучающий диод, изготовленный с его использованием, и способ такого изготовления |
JP2008053554A (ja) * | 2006-08-25 | 2008-03-06 | Osaka Univ | 電子デバイスとその製造方法 |
JP5401758B2 (ja) * | 2006-12-12 | 2014-01-29 | サンケン電気株式会社 | 半導体装置及びその製造方法 |
KR20090107882A (ko) * | 2008-04-10 | 2009-10-14 | 삼성전자주식회사 | 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법 |
WO2010061617A1 (ja) * | 2008-11-28 | 2010-06-03 | 国立大学法人山口大学 | 半導体発光素子及びその製造方法 |
EP2498293B1 (en) * | 2009-11-06 | 2018-08-01 | NGK Insulators, Ltd. | Epitaxial substrate for semiconductor element and method for producing epitaxial substrate for semiconductor element |
JP2011198837A (ja) * | 2010-03-17 | 2011-10-06 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
US8507947B2 (en) * | 2011-12-09 | 2013-08-13 | Power Integrations, Inc. | High quality GaN high-voltage HFETS on silicon |
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US20130302972A1 (en) | 2013-11-14 |
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CN106206258A (zh) | 2016-12-07 |
EP2602812A1 (en) | 2013-06-12 |
US9147734B2 (en) | 2015-09-29 |
TWI481027B (zh) | 2015-04-11 |
US8703561B2 (en) | 2014-04-22 |
US8507947B2 (en) | 2013-08-13 |
TW201539752A (zh) | 2015-10-16 |
CN103165444A (zh) | 2013-06-19 |
CN106206258B (zh) | 2018-11-09 |
US20150364552A1 (en) | 2015-12-17 |
US9437688B2 (en) | 2016-09-06 |
TWI569444B (zh) | 2017-02-01 |
CN103165444B (zh) | 2016-09-21 |
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