JP6133039B2 - 発光素子 - Google Patents

発光素子 Download PDF

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Publication number
JP6133039B2
JP6133039B2 JP2012237129A JP2012237129A JP6133039B2 JP 6133039 B2 JP6133039 B2 JP 6133039B2 JP 2012237129 A JP2012237129 A JP 2012237129A JP 2012237129 A JP2012237129 A JP 2012237129A JP 6133039 B2 JP6133039 B2 JP 6133039B2
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JP
Japan
Prior art keywords
light emitting
layer
semiconductor layer
electrode
disposed
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JP2012237129A
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English (en)
Japanese (ja)
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JP2013098561A (ja
JP2013098561A5 (enExample
Inventor
キム・ソンキョン
オ・ユンギョン
チュ・ソンホ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication date
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Publication of JP2013098561A publication Critical patent/JP2013098561A/ja
Publication of JP2013098561A5 publication Critical patent/JP2013098561A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors

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  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2012237129A 2011-10-28 2012-10-26 発光素子 Active JP6133039B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110111309A KR101871372B1 (ko) 2011-10-28 2011-10-28 발광 소자
KR10-2011-0111309 2011-10-28

Publications (3)

Publication Number Publication Date
JP2013098561A JP2013098561A (ja) 2013-05-20
JP2013098561A5 JP2013098561A5 (enExample) 2016-01-21
JP6133039B2 true JP6133039B2 (ja) 2017-05-24

Family

ID=47172418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012237129A Active JP6133039B2 (ja) 2011-10-28 2012-10-26 発光素子

Country Status (6)

Country Link
US (1) US9153622B2 (enExample)
EP (1) EP2587541B1 (enExample)
JP (1) JP6133039B2 (enExample)
KR (1) KR101871372B1 (enExample)
CN (1) CN103094300A (enExample)
TW (1) TWI535061B (enExample)

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Publication number Priority date Publication date Assignee Title
US10388690B2 (en) * 2012-08-07 2019-08-20 Seoul Viosys Co., Ltd. Wafer level light-emitting diode array
TWI684292B (zh) * 2013-07-17 2020-02-01 新世紀光電股份有限公司 發光二極體結構
TWI527263B (zh) 2013-07-17 2016-03-21 新世紀光電股份有限公司 發光二極體結構
KR102156376B1 (ko) * 2014-02-21 2020-09-15 엘지이노텍 주식회사 발광 소자
KR102212666B1 (ko) 2014-06-27 2021-02-05 엘지이노텍 주식회사 발광소자
US10074775B2 (en) 2015-07-16 2018-09-11 Nichia Corporation Light emitting element and light emitting device
JP6555043B2 (ja) 2015-09-18 2019-08-07 日亜化学工業株式会社 発光素子及び発光装置
SG10201912836WA (en) 2015-09-28 2020-02-27 Jxtg Nippon Oil & Energy Corp Cylinder lubricating oil composition for crosshead diesel engine
KR102443033B1 (ko) * 2015-10-12 2022-09-16 삼성전자주식회사 발광소자 패키지 및 이를 포함하는 조명 장치
WO2018182299A1 (ko) * 2017-03-27 2018-10-04 엘지이노텍 주식회사 반도체 소자
KR102343087B1 (ko) * 2017-04-28 2021-12-24 엘지이노텍 주식회사 반도체 소자 패키지
KR102515603B1 (ko) * 2018-04-11 2023-03-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 모듈
JP7014973B2 (ja) * 2019-08-28 2022-02-02 日亜化学工業株式会社 発光装置
KR102348950B1 (ko) * 2020-03-26 2022-01-11 주식회사 에스엘바이오닉스 반도체 발광소자
KR20210134103A (ko) * 2020-04-29 2021-11-09 삼성디스플레이 주식회사 발광 소자 및 이를 포함하는 표시 장치
CN112490260B (zh) * 2020-11-13 2024-02-02 泉州三安半导体科技有限公司 一种发光器件及其制备方法
TWI769817B (zh) * 2021-05-17 2022-07-01 友達光電股份有限公司 顯示裝置及其製造方法
KR20230033185A (ko) * 2021-08-30 2023-03-08 삼성디스플레이 주식회사 표시 장치, 발광 소자의 제조 방법, 및 이에 따라 제조된 발광 소자를 포함하는 표시 장치의 제조 방법
KR102879100B1 (ko) * 2021-10-14 2025-10-30 엘지디스플레이 주식회사 표시 장치

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Publication number Priority date Publication date Assignee Title
WO2005062389A2 (en) * 2003-12-24 2005-07-07 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device
JP3802911B2 (ja) 2004-09-13 2006-08-02 ローム株式会社 半導体発光装置
WO2006098545A2 (en) * 2004-12-14 2006-09-21 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of light emitting cells and package mounting the same
KR100974923B1 (ko) * 2007-03-19 2010-08-10 서울옵토디바이스주식회사 발광 다이오드
CN101663919B (zh) * 2007-04-02 2013-07-24 皇家飞利浦电子股份有限公司 驱动发光二极管
KR100999689B1 (ko) * 2008-10-17 2010-12-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법, 이를 구비한 발광장치
TWI466266B (zh) * 2009-02-24 2014-12-21 晶元光電股份有限公司 陣列式發光元件及其裝置
JP5614938B2 (ja) * 2009-02-26 2014-10-29 日亜化学工業株式会社 半導体発光素子
US8476668B2 (en) * 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US9093293B2 (en) * 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
JP5246199B2 (ja) * 2010-03-31 2013-07-24 豊田合成株式会社 Ｉｉｉ族窒化物半導体発光素子
KR101081193B1 (ko) 2009-10-15 2011-11-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100986374B1 (ko) * 2009-12-09 2010-10-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
KR101106151B1 (ko) * 2009-12-31 2012-01-20 서울옵토디바이스주식회사 발광 소자 및 그것을 제조하는 방법
JP2011151190A (ja) * 2010-01-21 2011-08-04 Stanley Electric Co Ltd 半導体発光装置
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
TW201238043A (en) * 2011-03-11 2012-09-16 Chi Mei Lighting Tech Corp Light-emitting diode device and method for manufacturing the same
KR101115539B1 (ko) * 2011-06-10 2012-02-28 서울옵토디바이스주식회사 발광 소자 및 그것을 제조하는 방법
US8759847B2 (en) * 2011-12-22 2014-06-24 Bridgelux, Inc. White LED assembly with LED string and intermediate node substrate terminals
US9276166B2 (en) * 2012-04-13 2016-03-01 Epistar Corporation Method for forming light-emitting device

Also Published As

Publication number Publication date
JP2013098561A (ja) 2013-05-20
EP2587541B1 (en) 2017-09-06
CN103094300A (zh) 2013-05-08
KR101871372B1 (ko) 2018-08-02
US20130105828A1 (en) 2013-05-02
EP2587541A1 (en) 2013-05-01
TW201327917A (zh) 2013-07-01
US9153622B2 (en) 2015-10-06
KR20130046755A (ko) 2013-05-08
TWI535061B (zh) 2016-05-21

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