JP6128609B2 - 半田処理装置 - Google Patents
半田処理装置 Download PDFInfo
- Publication number
- JP6128609B2 JP6128609B2 JP2014266868A JP2014266868A JP6128609B2 JP 6128609 B2 JP6128609 B2 JP 6128609B2 JP 2014266868 A JP2014266868 A JP 2014266868A JP 2014266868 A JP2014266868 A JP 2014266868A JP 6128609 B2 JP6128609 B2 JP 6128609B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- head
- tip
- tray
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005476 soldering Methods 0.000 title claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 127
- 238000000034 method Methods 0.000 claims description 58
- 238000004140 cleaning Methods 0.000 claims description 48
- 238000010309 melting process Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 26
- 238000007664 blowing Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims 2
- 239000000428 dust Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000015067 sauces Nutrition 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014266868A JP6128609B2 (ja) | 2014-12-27 | 2014-12-27 | 半田処理装置 |
| PCT/JP2015/084996 WO2016104231A1 (ja) | 2014-12-27 | 2015-12-15 | 半田処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014266868A JP6128609B2 (ja) | 2014-12-27 | 2014-12-27 | 半田処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016124004A JP2016124004A (ja) | 2016-07-11 |
| JP2016124004A5 JP2016124004A5 (enrdf_load_stackoverflow) | 2017-02-09 |
| JP6128609B2 true JP6128609B2 (ja) | 2017-05-17 |
Family
ID=56150256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014266868A Active JP6128609B2 (ja) | 2014-12-27 | 2014-12-27 | 半田処理装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6128609B2 (enrdf_load_stackoverflow) |
| WO (1) | WO2016104231A1 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6366561B2 (ja) * | 2015-11-09 | 2018-08-01 | 株式会社パラット | 半田付け装置、および半田付け方法 |
| JP6773322B2 (ja) * | 2016-11-29 | 2020-10-21 | 株式会社アンド | 半田孔の汚れ状態判定方法 |
| JP6875718B2 (ja) * | 2016-11-27 | 2021-05-26 | 株式会社アンド | 鏝先の状態判定方法および半田付け装置 |
| US11691210B2 (en) * | 2016-10-28 | 2023-07-04 | And Co., Ltd. | Method of determining state of iron tip |
| JP6766314B2 (ja) * | 2016-10-28 | 2020-10-14 | 株式会社アンド | 鏝先の状態判定方法 |
| JP6759992B2 (ja) | 2016-11-08 | 2020-09-23 | 株式会社デンソー | 電子制御装置の製造方法 |
| JP6764394B2 (ja) | 2017-10-02 | 2020-09-30 | 白光株式会社 | 半田付け装置 |
| JP7286372B2 (ja) * | 2019-03-29 | 2023-06-05 | 株式会社パラット | 半田付け装置、および半田付け装置用ノズル |
| JP2023093041A (ja) * | 2021-12-22 | 2023-07-04 | 株式会社パラット | 半田付け装置、および半田付け方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104412B2 (ja) * | 1985-06-11 | 1994-12-21 | いすゞ自動車株式会社 | 燃焼器のスクリ−ニング装置 |
| JPH0613736A (ja) * | 1992-06-29 | 1994-01-21 | Fujitsu Ltd | リフロボンディング装置 |
| JPH0679452A (ja) * | 1992-09-01 | 1994-03-22 | Ikeda Electric Co Ltd | 煙害防止ハンダゴテ |
| JP3800703B2 (ja) * | 1997-02-03 | 2006-07-26 | 富士写真フイルム株式会社 | はんだ付け装置 |
| WO2008023461A1 (fr) * | 2006-08-21 | 2008-02-28 | Mitsuo Ebisawa | fer à braser, procédé de fabrication d'UN appareil électronique en utilisant celui-ci, et équipement de fabrication |
| JP2014146630A (ja) * | 2013-01-28 | 2014-08-14 | Fuji Electric Co Ltd | 半導体装置の製造方法及びはんだごて |
-
2014
- 2014-12-27 JP JP2014266868A patent/JP6128609B2/ja active Active
-
2015
- 2015-12-15 WO PCT/JP2015/084996 patent/WO2016104231A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016124004A (ja) | 2016-07-11 |
| WO2016104231A1 (ja) | 2016-06-30 |
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