WO2016104231A1 - 半田処理装置 - Google Patents

半田処理装置 Download PDF

Info

Publication number
WO2016104231A1
WO2016104231A1 PCT/JP2015/084996 JP2015084996W WO2016104231A1 WO 2016104231 A1 WO2016104231 A1 WO 2016104231A1 JP 2015084996 W JP2015084996 W JP 2015084996W WO 2016104231 A1 WO2016104231 A1 WO 2016104231A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
processing apparatus
tray
soldering
head
Prior art date
Application number
PCT/JP2015/084996
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
満男 海老澤
Original Assignee
株式会社アンド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アンド filed Critical 株式会社アンド
Publication of WO2016104231A1 publication Critical patent/WO2016104231A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a solder processing apparatus having a solder ridge.
  • soldering using a soldering iron is performed for the process of joining the lead wire to the wiring pattern (land) on the substrate.
  • a solder processing apparatus provided with a solder ridge is used.
  • an object of the present invention is to provide a solder processing apparatus that can maintain good productivity in a soldering process while cleaning the tip.
  • the solder processing apparatus includes at least a first solder rod portion and a second solder rod portion as solder rod portions having a substantially cylindrical shape with a supply hole used for supplying solder to a substrate.
  • the second operation in which the cleaning process is performed is executed.
  • the cleaning process may be a process in which the residue is incinerated and removed by heating the tip.
  • the first solder flange portion and the second solder flange portion are between a lower position that is close to or in contact with the substrate and an upper position that is above the lower position. It may be movable, and the melting process may be performed at the lower position, and the cleaning process may be performed at the upper position.
  • the above-described configuration may be configured to include a tray that is disposed below the soldering iron portion at an upper position and receives the removed residue.
  • the above-described configuration further includes a saucer moving mechanism for moving the saucer, and the saucer moving mechanism is disposed under the second solder pad when the first operation is performed. It is good also as a structure which moves the said saucer so that it may be arrange
  • the above-described configuration includes a rack and pinion mechanism having racks fixed to each of the first solder hook part and the second solder hook part, and a pinion sandwiched between the racks,
  • the rack and pinion mechanism may be used to move the first solder hook part and the second solder hook part in the vertical direction.
  • the first solder flange and the second solder flange are connected to a belt, and by driving the belt, the first solder flange and the second solder flange are driven. It is good also as a structure which moves a soldering iron part to an up-down direction.
  • the first solder hook part, the second solder hook part, and the tray are connected to a belt, and by driving the belt, the first solder hook part and It is good also as a structure which moves the said saucer while moving a 2nd soldering iron part to an up-down direction.
  • the above-described configuration may include an air blowing unit that blows air into the supply hole to blow off the residue, and a collection unit that collects the blown residue. More specifically, the collection unit may include a suction unit that sucks the blown residue.
  • solder processing apparatus of the present invention it is possible to maintain good productivity in the soldering process while cleaning the tip.
  • FIG. 1 is an external view of a solder processing apparatus according to a first embodiment. It is explanatory drawing which shows the state which has arrange
  • FIG. 1 is an external view of a solder processing apparatus X according to the first embodiment
  • FIG. 2 is an explanatory view showing a state in which a substrate (wiring board) Bd is arranged under the solder processing apparatus X. is there.
  • a substrate wiring board
  • FIGS. 1 and 2 in the solder processing apparatus X, two heads (1 ⁇ / b> A, 1 ⁇ / b> B) arranged side by side are attached to the front surface of an upright flat plate-like wall body 11. .
  • Each head (1A, 1B) has basically the same configuration.
  • Each head (1A, 1B) is supplied with the thread solder W from above, and solders the lead wire Le to the land Ld of the substrate Bd using the tip 51 of the solder iron provided at the lower part. Operate.
  • substrate Bd is attached to the jig
  • Each head (1A, 1B) is movable in the vertical direction between a lower position close to or in contact with the substrate Bd and an upper position above the lower position. In the state shown in FIGS. 1 and 2, the head 1A is in the lower position and the head 1B is in the upper position.
  • each head (1A, 1B) as a solder feeding mechanism for supplying the thread solder W, a pair of feed rollers 61 for feeding the thread solder W and a guide tube for guiding the thread solder W fed by the feed roller 61 62.
  • the pair of feed rollers 61 sandwich the thread solder W and rotate to feed the thread solder W downward.
  • the feed roller 61 determines the length of the thread solder W to be sent out according to the rotation angle (number of rotations).
  • the guide tube 62 is a tube body that can be elastically deformed, and is disposed close to a portion of the feed roller 61 where the thread solder W is fed out. Further, the lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21.
  • the guide tube 62 is provided so as not to be pulled or stretched within a range in which the cutter upper blade 21 slides.
  • a cutter unit that cuts the thread solder W fed by the solder feeding mechanism into solder pieces of a predetermined length is provided below the solder feeding mechanism in each head (1A, 1B).
  • the cutter unit includes a cutter lower blade 22 and a cutter upper blade 21 that is disposed above the cutter lower blade 22 and is slidable in the front-rear direction.
  • the cutter unit is provided with an actuator 32 for driving the pusher pin in the vertical direction.
  • the cutter upper blade 21 is provided with a penetrating upper blade hole 211 into which the thread solder W fed by the solder feeding mechanism is inserted.
  • the lower edge of the upper blade hole 211 is formed in a cutting edge shape.
  • the cutter lower blade 22 includes a lower blade hole (not shown) that penetrates the thread solder W that penetrates the upper blade hole 211.
  • the upper edge portion of the lower blade hole is formed in a cutting blade shape.
  • soldering iron part is provided below the cutter unit in each head (1A, 1B).
  • the soldering iron part includes a tip 51 attached to the heater unit.
  • the heater block 42 has a cylindrical shape, and the heater 41 is wound around the outer peripheral surface.
  • the heater block 42 includes a recess for attaching the hook 51 to the lower end in the axial direction, and a solder supply hole penetrating from the center of the bottom of the recess to the opposite side.
  • the tip 51 has a cylindrical shape extending in the vertical direction (axial direction), and a supply hole extending in the axial direction is formed in the central portion of the tip 51.
  • the lower blade hole of the cutter lower blade 22 communicates with the solder supply hole of the heater block 42 and the supply hole of the flange 51.
  • the tip 51 is made of a material having high thermal conductivity.
  • the thermal conductivity is 100 W / m ⁇ K or more.
  • the material of the tip 51 is preferably an aluminum nitride, tungsten carbide, or boron nitride ceramic material.
  • the tip 51 is detachable from the heater block 42, and when installed, the upper part is inserted and disposed in the recess of the heater block 42, and the lower end protrudes downward from the heater block 42.
  • the solder pieces of thread solder cut by the cutter unit are supplied onto the substrate Bd below the tip 51 through the solder supply hole of the heater block 42 and the supply hole of the tip 51.
  • each head (1A, 1B) at the time of soldering has moved to a lower position where the tip of the tip 51 is close to or in contact with the substrate Bd, so that the solder pieces supplied onto the substrate Bd are appropriately transferred. Can be melted.
  • a receiving tray 71 that is movable in the left-right direction is provided in the lower part of the solder processing apparatus X.
  • the tray 71 is moved so that it is disposed directly below the tip 51 of the head 1A.
  • the tray 71 is disposed immediately below the tip 51 of the head 1B. .
  • the role of the saucer 7 will be described in detail again.
  • the solder processing apparatus X is provided with a control mechanism CS (not shown) that controls various operations so that the apparatus functions normally.
  • the control mechanism CS includes a logic circuit such as an MPU or CPU, and controls each part of the solder processing apparatus X.
  • a melting process for melting the solder supplied to the substrate Bd and a cleaning process for burning and removing the dross by heating the dross attached to the tip 51 are alternately performed in the head 1A and the head 1B. To be done. That is, while the melting process is performed at the tip 51 of the head 1A, the first process in which the cleaning process is performed on the tip 51 of the head 1B and the melting process is performed at the tip 51 of the head 1B. In the meantime, the second operation in which the cleaning process is performed on the tip 51 of the head 1A is executed.
  • the melting process is a process for realizing soldering. More specifically, the solder piece cut from the thread solder W is supplied onto the substrate Bd (and remains in the supply hole of the tip 51). In this state, the solder pieces are heated and melted using the heater 41. At this time, the heater 41 is controlled so that the tip 51 is about 400 ° C., for example, at a temperature setting of 550 ° C. so that the solder piece melts. On the other hand, in the cleaning process, the tip 51 is heated for several minutes at a temperature of, for example, 450 ° C. or higher using the heater 41 so that the dross attached to the tip 51 is incinerated. The temperature of the tip 51 is normally set higher at the temperature during the cleaning process than at the melting process.
  • the head 1A When the first operation is performed, the head 1A is in the lower position and the head 1B is in the upper position.
  • the second operation When the second operation is performed, the head 1A is in the upper position and the head 1B is in the lower position. Therefore, since each head (1A, 1B) is in a lower position close to or in contact with the substrate Bd when performing the melting process, the melting process can be appropriately performed. Further, when the cleaning process is performed, it is at an upper position relatively far from the substrate Bd, so that the influence of heating or the like in the cleaning process can be prevented from reaching the substrate Bd as much as possible.
  • the tip temperature of one head is set to the cleaning processing temperature, and the tip temperature of the other head is set to the melting processing temperature.
  • the energization of the heater 41 is stopped, and the temperature of the tip 51 is lowered to the melting process temperature by natural heat radiation to prepare for the next melting process.
  • compressed air that blows off the dross may be used in order to quickly reduce the temperature.
  • the cleaning temperature can be changed according to the required cleaning time. That is, when the cleaning process time is shortened, the cleaning process temperature can be set high, and the cleaning process temperature can be set low if the cleaning process time is sufficient.
  • the replacement timing of the heads 1A and 1B that is, the timing of the cleaning process of the tip 51 may be appropriately determined depending on the number of times of the melting process and the amount of solder used. For example, when the number of melting processes or the amount of solder used reaches a predetermined value, the cleaning process of the tip 51 is performed. Alternatively, the cleaning process may be performed simply for a preset time.
  • the tray 7 is arranged below each head (1A, 1B) at the upper position. Therefore, when each head (1A, 1B) is cleaned, the dross that is peeled off from the tip 51 is received by the receiving tray 7, so that it is prevented from adhering to the substrate Bd.
  • the tray moving mechanism has a configuration in which a tray 71 is provided at one end of a support member 72 extending in the front-rear direction, and the other end of the support member 72 is slidably attached to the wall body 11. It has become. And the support member 72 slides in the left-right direction along the wall 11, and the saucer 7 moves in the left-right direction. The movement of the tray 7 is performed so as not to interfere with the vertical movement of each head (1A, 1B).
  • FIG. 4 is a cross-sectional view of the solder processing apparatus X in a state where the melting process is performed by the head 1A and the cleaning process is performed by the head 1B.
  • the tip 51 is brought close to or in contact with the substrate Bd and the melting process is performed.
  • the cleaning process is executed in a state where the tray 71 is disposed below.
  • FIG. 5 shows a cross-sectional view of the solder processing apparatus X in a state where the melting process is performed by the head 1B and the cleaning process is performed by the head 1A.
  • the tip 51 is brought close to or in contact with the substrate Bd and the melting process is performed.
  • the cleaning process is executed in a state where the tray 71 is disposed below.
  • the specific form of a saucer moving mechanism is not restricted to what was mentioned above,
  • the saucer 71 may become a form which moves so that an arc may be drawn.
  • the tray moving mechanism shown in FIG. 6 the tray 71 is provided at one end of the support member 72 extending in one direction, and the other end of the support member 72 is rotatably attached to the wall body 11. ing.
  • a process for blowing compressed air from the upper side to the supply hole of the tip 51 and blowing off the dross attached to the tip 51 may be provided. Such a process will be described below with reference to FIGS.
  • FIG. 7A shows a form of a process in which the casing 81 is installed below the tip 51 and the dross attached to the tip 51 is blown away and the dross is collected by the casing 81.
  • the housing 81 includes a guide member 82 for guiding the dross blown from the tip 51 into the housing 81, a through hole 83 penetrating to the outside, and a space having the guide member 82.
  • a filter 84 is provided so as to partition a space with the through hole 83. According to this aspect, it is possible to collect the dross blown off by the compressed air in the housing 81.
  • FIG. 7B shows a form in which a fan (suction means) 85 is provided in the casing 81 (a space between the through hole 83 and the filter 84).
  • a fan suction means
  • the compressed air is blown into the tip 51 and at the same time the fan 85 is rotated, thereby causing an air flow from the inside of the casing 81 to the outside through the through hole 83 and into the casing 81.
  • Dross can be actively sucked. Thereby, it is possible to collect the blown-out dross in the housing 81 more reliably.
  • FIG. 8 (a) and 8 (b) show an example in which the guide member 82 is modified so that dross attached to the end face of the tip 51 can be more easily removed in the form shown in FIG. 7 (b). Yes.
  • the end face of the heel 51 contacts with a part of the guide member 82.
  • the outer edge of the end face of the heel 51 Is in contact with a part of the guide member 82.
  • FIG. 9 shows an example in which the guide member 82 is deformed so as to make it easier to remove dross attached to the end face of the tip 51 in the form shown in FIG. 7B.
  • the guide member 82 is partially uneven, and the end surface of the tip 51 can be rubbed against the unevenness.
  • corrugation may be brush shape.
  • a rack and pinion mechanism as shown in FIG. 10 may be used as a mechanism for moving each head (1A, 1B) in the vertical direction.
  • the rack and pinion mechanism shown in the figure includes a rack 15a fixed to the head 1A, a rack 15b fixed to the head 1B, and a pinion 16 sandwiched between these racks. According to the rack and pinion mechanism, the heads (1A, 1B) can be moved alternately to the upper position and the lower position by rotationally driving the pinion 16.
  • the second embodiment is basically the same as the first embodiment except for a mechanism for moving each head (1A, 1B) and the tray 71.
  • emphasis is placed on the description of the points different from the first embodiment, and description of common points may be omitted.
  • FIG. 11 is an external view of the solder processing apparatus X according to the second embodiment.
  • the main part of the drive mechanism 90 which moves each head (1A, 1B) and the saucer 71 is shown in the broken-line frame in this figure.
  • the drive mechanism 90 is installed on the rear side of the wall body 11.
  • the drive mechanism 90 connects the belt 91, four supports (92 a to 92 d) that support the belt 91 in a rotationally movable manner, a connecting member 93 a that connects the head 1 A to the belt 91, and the head 1 B to the belt 91.
  • a connecting member 93b is provided.
  • Each support (92a to 92d) is disposed so as to form four corners of a rectangle.
  • the belt 91 extends in the vertical direction between the support body 92b and the support body 92c, and the connecting member 93a is fixed thereto. Between the support body 92c and the support body 92d, the belt 91 extends in the left-right direction, and the support member 72 is fixed thereto. Between the support body 92d and the support body 92a, the belt 91 extends in the vertical direction, and a connecting member 93b is fixed thereto.
  • the drive mechanism 90 of the present embodiment by driving the belt 91, the heads (1A, 1B) are moved in the vertical direction, and the tray 71 is disposed so as to be disposed under the head at the upper position. It can be moved.
  • the drive mechanism 90 is adjusted so that the moving tray 71 does not interfere with the vertical movement of each head (1A, 1B).
  • stoppers 95a and 95b for restricting the movable range of the connecting member 93b are provided on the left side surface of the wall body 11, and a magnet 96 for attracting the connecting member 93b is provided on each of the stoppers 95a and 95b. is set up. Thereby, each head (1A, 1B) can be prevented from moving beyond an allowable range, and the function of positioning each head (1A, 1B) can be achieved.
  • each head (1A, 1B) is belted using the belt 91, and the belt 91 is driven to move each head (1A, 1B) up and down like a seesaw. It is like that.
  • the tray 71 also moves to the left and right in conjunction with the belt 91 and receives dross falling during the cleaning process.
  • each stopper 95a, 95b can be utilized also for the position detection of each head (1A, 1B).
  • the third embodiment is basically the same as the first embodiment except for a mechanism for moving each head (1A, 1B) and the tray 71.
  • emphasis is placed on the description of the points different from the first embodiment, and description of common points may be omitted.
  • FIG. 12 is an external view of the solder processing apparatus X according to the third embodiment.
  • the main part of the drive mechanism 90 which moves each head (1A, 1B) and the saucer 71 is shown in the broken-line frame in this figure.
  • the drive mechanism 90 is installed on the rear side of the wall body 11.
  • the drive mechanism 90 connects the belt 91, the two supports (92e, 92f) that support the belt 91 in a rotationally movable manner, the connecting member 93a that connects the head 1A to the belt 91, and the head 1B to the belt 91.
  • a connecting member 93b is provided.
  • Each support (92e, 92f) is formed larger than the support (92a to 92d) in the second embodiment, and the support 92f is disposed below the support 92e. Between the right side of the support body 92e and the right side of the support body 92f, the belt 91 extends in the vertical direction, and a connecting member 93a is fixed thereto.
  • the belt 91 extends in the vertical direction, and a connecting member 93b is fixed thereto.
  • a support member 72 is fixed at a position near the outer periphery on the front surface of the support body 92f.
  • each head (1A, 1B) can be moved in the vertical direction by driving the belt 91. Further, with the rotation of the support 92f at this time, the tray 71 can be moved so as to be disposed under the head at the upper position.
  • the drive mechanism 90 is adjusted so that the moving tray 71 does not interfere with the vertical movement of each head (1A, 1B). In the present embodiment, since the tray 71 also moves so as to descend when one head is lowered, it is easy to adjust so as not to interfere. Furthermore, in the saucer 71 in this embodiment, the hollow for receiving dross is provided in the both sides of the front and back.
  • stoppers 95a and 95b for restricting the movable range of the connecting member 93b are provided on the left side surface of the wall body 11, and a magnet 96 for attracting the connecting member 93b is provided on each of the stoppers 95a and 95b. is set up. Thereby, each head (1A, 1B) can be prevented from moving beyond an allowable range, and the function of positioning each head (1A, 1B) can be achieved.
  • the drive mechanism 90 of this embodiment is suitable for the process which arrange
  • the dross (“Dross A” in FIG. 14) that has fallen from the tip 51 of the head 1A to the tray 71 falls from the tray 71 to the dust box 99 while the support 92f rotates clockwise.
  • the dross (“Dross B” in FIG. 14) that has fallen from the tip 51 of the head 1B to the tray 71 falls from the tray 71 to the dust box 99 while the support 92f rotates counterclockwise.
  • the dross can be easily collected into the dust box 99 by utilizing the change in the orientation of the tray 71 with the rotation of the support 92f.
  • the solder processing apparatus X includes at least a head as a solder flange (head) having a substantially cylindrical tip 51 having a supply hole used for supplying a solder piece to the substrate Bd. 1A and a head 1B, which are configured to perform a melting process for melting the supplied solder piece and a cleaning process for removing dross attached to the tip 51.
  • the solder processing apparatus X performs the first operation in which the cleaning process is performed on the head 1B while the melting process is performed in the head 1A and the head 1A while the melting process is performed in the head 1B. Then, the second operation in which the cleaning process is performed is executed. Therefore, according to the solder processing apparatus X, the line tact time is not increased for the cleaning process, and the productivity of the soldering process can be satisfactorily maintained while cleaning the tip.
  • the number of heads provided in the solder processing apparatus X is two, but three or more heads may be provided. Even in this case, the present invention can be applied by performing the cleaning process on other heads while the melting process is performed on some of the heads.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2015/084996 2014-12-27 2015-12-15 半田処理装置 WO2016104231A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014266868A JP6128609B2 (ja) 2014-12-27 2014-12-27 半田処理装置
JP2014-266868 2014-12-27

Publications (1)

Publication Number Publication Date
WO2016104231A1 true WO2016104231A1 (ja) 2016-06-30

Family

ID=56150256

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/084996 WO2016104231A1 (ja) 2014-12-27 2015-12-15 半田処理装置

Country Status (2)

Country Link
JP (1) JP6128609B2 (enrdf_load_stackoverflow)
WO (1) WO2016104231A1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018079515A1 (ja) * 2016-10-28 2018-05-03 株式会社アンド 鏝先の状態判定方法
JP2018069288A (ja) * 2016-10-28 2018-05-10 株式会社アンド 鏝先の状態判定方法
JP2018083225A (ja) * 2016-11-27 2018-05-31 株式会社アンド 鏝先の状態判定方法
JP2018086668A (ja) * 2016-11-29 2018-06-07 株式会社アンド 半田孔の汚れ状態判定方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6366561B2 (ja) * 2015-11-09 2018-08-01 株式会社パラット 半田付け装置、および半田付け方法
JP6759992B2 (ja) 2016-11-08 2020-09-23 株式会社デンソー 電子制御装置の製造方法
JP6764394B2 (ja) 2017-10-02 2020-09-30 白光株式会社 半田付け装置
JP7286372B2 (ja) * 2019-03-29 2023-06-05 株式会社パラット 半田付け装置、および半田付け装置用ノズル
JP2023093041A (ja) * 2021-12-22 2023-07-04 株式会社パラット 半田付け装置、および半田付け方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613736A (ja) * 1992-06-29 1994-01-21 Fujitsu Ltd リフロボンディング装置
JPH0679452A (ja) * 1992-09-01 1994-03-22 Ikeda Electric Co Ltd 煙害防止ハンダゴテ
JPH10216931A (ja) * 1997-02-03 1998-08-18 Fuji Photo Film Co Ltd はんだ付け方法及び装置
WO2008023461A1 (fr) * 2006-08-21 2008-02-28 Mitsuo Ebisawa fer à braser, procédé de fabrication d'UN appareil électronique en utilisant celui-ci, et équipement de fabrication
JP2014146630A (ja) * 2013-01-28 2014-08-14 Fuji Electric Co Ltd 半導体装置の製造方法及びはんだごて

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104412B2 (ja) * 1985-06-11 1994-12-21 いすゞ自動車株式会社 燃焼器のスクリ−ニング装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613736A (ja) * 1992-06-29 1994-01-21 Fujitsu Ltd リフロボンディング装置
JPH0679452A (ja) * 1992-09-01 1994-03-22 Ikeda Electric Co Ltd 煙害防止ハンダゴテ
JPH10216931A (ja) * 1997-02-03 1998-08-18 Fuji Photo Film Co Ltd はんだ付け方法及び装置
WO2008023461A1 (fr) * 2006-08-21 2008-02-28 Mitsuo Ebisawa fer à braser, procédé de fabrication d'UN appareil électronique en utilisant celui-ci, et équipement de fabrication
JP2014146630A (ja) * 2013-01-28 2014-08-14 Fuji Electric Co Ltd 半導体装置の製造方法及びはんだごて

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018079515A1 (ja) * 2016-10-28 2018-05-03 株式会社アンド 鏝先の状態判定方法
JP2018069288A (ja) * 2016-10-28 2018-05-10 株式会社アンド 鏝先の状態判定方法
JP2018083225A (ja) * 2016-11-27 2018-05-31 株式会社アンド 鏝先の状態判定方法
JP2018086668A (ja) * 2016-11-29 2018-06-07 株式会社アンド 半田孔の汚れ状態判定方法

Also Published As

Publication number Publication date
JP2016124004A (ja) 2016-07-11
JP6128609B2 (ja) 2017-05-17

Similar Documents

Publication Publication Date Title
JP6128609B2 (ja) 半田処理装置
JP5312584B2 (ja) 噴流半田付け装置および半田付け方法
US9925618B2 (en) Laser processing apparatus
JP6366561B2 (ja) 半田付け装置、および半田付け方法
JP2016124004A5 (enrdf_load_stackoverflow)
JP6388327B2 (ja) クリーニング装置及び半田付けシステム
JP2016058469A (ja) 挿入ヘッド、部品挿入装置及び部品実装ライン
JP6227992B2 (ja) 半田付け装置および方法
JP6226028B1 (ja) 噴流はんだ槽及び噴流はんだ付け装置
JP5271111B2 (ja) 半田付け装置
JP2016058468A (ja) 挿入ヘッド、部品挿入装置及び部品実装ライン
EP3122167B1 (en) Panel device and work machine
JP4375907B2 (ja) 作業方法と装置
TWM528520U (zh) 晶圓去蠟改良結構
JP2017121642A (ja) 半田処理装置
JP2007258285A (ja) 電子部品の取外し装置
JP2018029159A (ja) プリント基板用リワーク方法及びプリント基板用リワーク治具
JP7080044B2 (ja) 部品装着装置、及び生産方法
JPWO2017077591A1 (ja) 表示装置
JP2017006937A (ja) 半田処理装置
JP2016215220A (ja) 半田処理装置
JP6832450B2 (ja) 演算装置
JP2017039155A (ja) リフローはんだ付け装置および加熱部材
CN112296359B (zh) 一种打印设备及打印方法
KR20190099791A (ko) 자동 이송형 납땜장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15872800

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15872800

Country of ref document: EP

Kind code of ref document: A1