JP6128232B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6128232B2 JP6128232B2 JP2015550228A JP2015550228A JP6128232B2 JP 6128232 B2 JP6128232 B2 JP 6128232B2 JP 2015550228 A JP2015550228 A JP 2015550228A JP 2015550228 A JP2015550228 A JP 2015550228A JP 6128232 B2 JP6128232 B2 JP 6128232B2
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- 239000004065 semiconductor Substances 0.000 title claims description 79
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000000227 grinding Methods 0.000 claims description 54
- 230000003014 reinforcing effect Effects 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 17
- 230000002787 reinforcement Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 73
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
図1は、本発明の実施の形態1に係る半導体装置の製造方法のフローチャートである。ここでは半導体装置として縦型半導体デバイスを製造する。
図9は、本発明の実施の形態2に係る半導体装置の製造方法を示す断面図である。まず、図9(a)に示すように、半導体ウェハ2の表面に保護テープ14を貼り付ける。続いて、図2に示すバックグラインド装置において薄化加工を行う。即ち、図9(b)に示すように、第1の研削砥石で半導体ウェハ2を研削して第1の凹部21を形成する。次に、図9(c)に示すように、第1の研削砥石より砥粒サイズが小さい第2の研削砥石で第1の凹部21内を研削して第2の凹部22を形成する。これによりデバイス領域17とリング状補強部18を形成する。
図10は、本発明の実施の形態3に係る半導体装置の製造方法を示す断面図である。まず、図10(a)に示すように、半導体ウェハ2の表面に保護テープ14を貼り付ける。続いて、図2に示すバックグラインド装置において薄化加工を行う。即ち、図10(b)に示すように、第1の研削砥石で半導体ウェハ2を研削して第1の凹部21を形成する。次に、図10(c)に示すように、第1の研削砥石より砥粒サイズが小さい第2の研削砥石で第1の凹部21内を研削して第2の凹部22を形成する。これによりデバイス領域17とリング状補強部18を形成する。
Claims (7)
- 半導体ウェハの中央部にデバイス領域を形成し、前記デバイス領域の外周に前記デバイス領域よりも厚いリング状補強部を形成する工程と、
前記デバイス領域と前記リング状補強部を形成した後に前記半導体ウェハにウェット処理を行う工程と、
前記ウェット処理を行った後に、前記半導体ウェハを回転させて乾燥させる工程とを備え、
前記半導体ウェハの中心位置と前記リング状補強部の中心位置が異なり、
前記半導体ウェハを回転させて乾燥させる際に、前記半導体ウェハの中心位置を回転中心とすることを特徴とする半導体装置の製造方法。 - 前記半導体ウェハの中心位置と前記リング状補強部の中心位置の相違は20μm以上であることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記半導体ウェハの中央部を研削することにより前記デバイス領域と前記リング状補強部を形成することを特徴とする請求項1又は2に記載の半導体装置の製造方法。
- 第1の研削砥石で前記半導体ウェハを研削して第1の凹部を形成し、前記第1の研削砥石より砥粒サイズが小さい第2の研削砥石で前記第1の凹部内を研削して第2の凹部を形成することにより前記デバイス領域と前記リング状補強部を形成することを特徴とする請求項3に記載の半導体装置の製造方法。
- 前記第1の凹部の中心位置は前記リング状補強部の中心位置であることを特徴とする請求項4に記載の半導体装置の製造方法。
- 前記第2の凹部の中心位置は前記リング状補強部の中心位置であることを特徴とする請求項4又は5に記載の半導体装置の製造方法。
- 前記リング状補強部の高さは300μm以上であることを特徴とする請求項1〜6の何れか1項に記載の半導体装置の製造方法。
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PCT/JP2013/081754 WO2015079489A1 (ja) | 2013-11-26 | 2013-11-26 | 半導体装置の製造方法 |
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JPWO2015079489A1 JPWO2015079489A1 (ja) | 2017-03-16 |
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US (1) | US9704813B2 (ja) |
JP (1) | JP6128232B2 (ja) |
KR (1) | KR101764082B1 (ja) |
CN (1) | CN105765701B (ja) |
DE (1) | DE112013007641B4 (ja) |
WO (1) | WO2015079489A1 (ja) |
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US10109475B2 (en) | 2016-07-29 | 2018-10-23 | Semiconductor Components Industries, Llc | Semiconductor wafer and method of reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark |
JP6723892B2 (ja) * | 2016-10-03 | 2020-07-15 | 株式会社ディスコ | ウエーハの加工方法 |
JP6742540B2 (ja) * | 2017-12-13 | 2020-08-19 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
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JP4185704B2 (ja) | 2002-05-15 | 2008-11-26 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP2007019379A (ja) | 2005-07-11 | 2007-01-25 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP4913517B2 (ja) * | 2006-09-26 | 2012-04-11 | 株式会社ディスコ | ウエーハの研削加工方法 |
JP4986568B2 (ja) * | 2006-10-11 | 2012-07-25 | 株式会社ディスコ | ウエーハの研削加工方法 |
JP2008124292A (ja) * | 2006-11-14 | 2008-05-29 | Disco Abrasive Syst Ltd | 加工装置のウエーハ位置調整治具 |
JP2008130808A (ja) * | 2006-11-21 | 2008-06-05 | Disco Abrasive Syst Ltd | 研削加工方法 |
JP2009004406A (ja) * | 2007-06-19 | 2009-01-08 | Disco Abrasive Syst Ltd | 基板の加工方法 |
JP2009010178A (ja) * | 2007-06-28 | 2009-01-15 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP5275611B2 (ja) * | 2007-10-23 | 2013-08-28 | 株式会社ディスコ | 加工装置 |
JP5081643B2 (ja) * | 2008-01-23 | 2012-11-28 | 株式会社ディスコ | ウエーハの加工方法 |
JP5012632B2 (ja) * | 2008-04-15 | 2012-08-29 | 富士電機株式会社 | 半導体装置の製造方法 |
JP2012009662A (ja) | 2010-06-25 | 2012-01-12 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
JP2012190930A (ja) | 2011-03-09 | 2012-10-04 | Disco Abrasive Syst Ltd | ウエーハ及びウエーハの搬送方法 |
JP5772092B2 (ja) * | 2011-03-11 | 2015-09-02 | 富士電機株式会社 | 半導体製造方法および半導体製造装置 |
JP2013012690A (ja) | 2011-06-30 | 2013-01-17 | Toshiba Corp | 半導体ウエハの加工方法及び加工装置、並びに、半導体ウエハ |
JP5981154B2 (ja) * | 2012-02-02 | 2016-08-31 | 三菱電機株式会社 | 半導体装置の製造方法 |
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- 2013-11-26 CN CN201380081222.4A patent/CN105765701B/zh active Active
- 2013-11-26 JP JP2015550228A patent/JP6128232B2/ja active Active
- 2013-11-26 DE DE112013007641.1T patent/DE112013007641B4/de active Active
- 2013-11-26 WO PCT/JP2013/081754 patent/WO2015079489A1/ja active Application Filing
- 2013-11-26 KR KR1020167013984A patent/KR101764082B1/ko active IP Right Grant
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Publication number | Publication date |
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KR101764082B1 (ko) | 2017-08-01 |
KR20160078422A (ko) | 2016-07-04 |
CN105765701A (zh) | 2016-07-13 |
DE112013007641B4 (de) | 2021-03-11 |
WO2015079489A1 (ja) | 2015-06-04 |
DE112013007641T5 (de) | 2016-08-11 |
US20160197046A1 (en) | 2016-07-07 |
CN105765701B (zh) | 2018-09-28 |
JPWO2015079489A1 (ja) | 2017-03-16 |
US9704813B2 (en) | 2017-07-11 |
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