JP6123266B2 - 封止構造、電子デバイス、電子機器、及び移動体 - Google Patents

封止構造、電子デバイス、電子機器、及び移動体 Download PDF

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Publication number
JP6123266B2
JP6123266B2 JP2012272041A JP2012272041A JP6123266B2 JP 6123266 B2 JP6123266 B2 JP 6123266B2 JP 2012272041 A JP2012272041 A JP 2012272041A JP 2012272041 A JP2012272041 A JP 2012272041A JP 6123266 B2 JP6123266 B2 JP 6123266B2
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substrate
sealing member
protrusion
hole
sealing structure
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JP2014120499A (ja
JP2014120499A5 (enExample
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前田　佳男
佳男 前田
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Seiko Epson Corp
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Seiko Epson Corp
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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012272041A 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体 Expired - Fee Related JP6123266B2 (ja)

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JP2012272041A JP6123266B2 (ja) 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体

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JP2012272041A JP6123266B2 (ja) 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体

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JP2014120499A JP2014120499A (ja) 2014-06-30
JP2014120499A5 JP2014120499A5 (enExample) 2015-12-17
JP6123266B2 true JP6123266B2 (ja) 2017-05-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016033504A (ja) * 2014-07-31 2016-03-10 セイコーエプソン株式会社 物理量センサー、電子機器および移動体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7830948B2 (ja) * 2022-01-11 2026-03-17 セイコーエプソン株式会社 慣性センサー、慣性センサーの製造方法および慣性計測装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096597A (ja) * 2005-09-28 2007-04-12 Seiko Epson Corp 弾性表面波デバイスおよびその製造方法
JP4872619B2 (ja) * 2006-11-16 2012-02-08 三菱電機株式会社 基板間接続構造の製造方法
JP2009224387A (ja) * 2008-03-13 2009-10-01 Toyota Motor Corp 半導体装置とその製造方法
JP2010093674A (ja) * 2008-10-10 2010-04-22 Epson Toyocom Corp 圧電デバイス及び圧電基板の製造方法
JP5365851B2 (ja) * 2009-05-11 2013-12-11 セイコーエプソン株式会社 電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016033504A (ja) * 2014-07-31 2016-03-10 セイコーエプソン株式会社 物理量センサー、電子機器および移動体

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