JP2014120499A5 - - Google Patents

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Publication number
JP2014120499A5
JP2014120499A5 JP2012272041A JP2012272041A JP2014120499A5 JP 2014120499 A5 JP2014120499 A5 JP 2014120499A5 JP 2012272041 A JP2012272041 A JP 2012272041A JP 2012272041 A JP2012272041 A JP 2012272041A JP 2014120499 A5 JP2014120499 A5 JP 2014120499A5
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JP
Japan
Prior art keywords
substrate
sealing structure
protrusion
hole
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012272041A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014120499A (ja
JP6123266B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012272041A priority Critical patent/JP6123266B2/ja
Priority claimed from JP2012272041A external-priority patent/JP6123266B2/ja
Publication of JP2014120499A publication Critical patent/JP2014120499A/ja
Publication of JP2014120499A5 publication Critical patent/JP2014120499A5/ja
Application granted granted Critical
Publication of JP6123266B2 publication Critical patent/JP6123266B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012272041A 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体 Expired - Fee Related JP6123266B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012272041A JP6123266B2 (ja) 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012272041A JP6123266B2 (ja) 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体

Publications (3)

Publication Number Publication Date
JP2014120499A JP2014120499A (ja) 2014-06-30
JP2014120499A5 true JP2014120499A5 (enExample) 2015-12-17
JP6123266B2 JP6123266B2 (ja) 2017-05-10

Family

ID=51175121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012272041A Expired - Fee Related JP6123266B2 (ja) 2012-12-13 2012-12-13 封止構造、電子デバイス、電子機器、及び移動体

Country Status (1)

Country Link
JP (1) JP6123266B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6369200B2 (ja) * 2014-07-31 2018-08-08 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP7830948B2 (ja) * 2022-01-11 2026-03-17 セイコーエプソン株式会社 慣性センサー、慣性センサーの製造方法および慣性計測装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096597A (ja) * 2005-09-28 2007-04-12 Seiko Epson Corp 弾性表面波デバイスおよびその製造方法
JP4872619B2 (ja) * 2006-11-16 2012-02-08 三菱電機株式会社 基板間接続構造の製造方法
JP2009224387A (ja) * 2008-03-13 2009-10-01 Toyota Motor Corp 半導体装置とその製造方法
JP2010093674A (ja) * 2008-10-10 2010-04-22 Epson Toyocom Corp 圧電デバイス及び圧電基板の製造方法
JP5365851B2 (ja) * 2009-05-11 2013-12-11 セイコーエプソン株式会社 電子部品

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