JP6107131B2 - ナノ構造体及びその作製方法 - Google Patents
ナノ構造体及びその作製方法 Download PDFInfo
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- JP6107131B2 JP6107131B2 JP2012285976A JP2012285976A JP6107131B2 JP 6107131 B2 JP6107131 B2 JP 6107131B2 JP 2012285976 A JP2012285976 A JP 2012285976A JP 2012285976 A JP2012285976 A JP 2012285976A JP 6107131 B2 JP6107131 B2 JP 6107131B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 9
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- 239000000463 material Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
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- 238000010586 diagram Methods 0.000 description 8
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- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
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- 239000005020 polyethylene terephthalate Substances 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2833/00—Use of polymers of unsaturated acids or derivatives thereof as mould material
- B29K2833/04—Polymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Surface Treatment Of Optical Elements (AREA)
Description
原盤の表面にレジスト層を形成する工程、
原盤上のレジスト層にレーザ光をパルス照射しつつ照射位置を移動させることにより、露光部からなるスポット状潜像の露光方向の所定ピッチの配列を含む潜像のトラックが多数列配置されてなる潜像パターンを形成する工程、
潜像を現像してレジストパターンを形成する工程、
レジストパターンをマスクとして原盤をエッチング処理することにより原盤の表面に凹凸パターンを形成する工程、及び
原盤の表面凹凸を樹脂材料に転写する工程
を有し、
前記潜像パターンを形成する工程において、潜像のトラックに緩衝領域として設けるレーザ光非照射部分の幅、又は緩衝領域として設けるレーザ光非照射部分が潜像の複数のトラックの配列方向に配列する長さを、作製後のナノ構造体においてシームが視認されないように設定するナノ構造体の作製方法を提供する。
本発明のナノ構造体では、例えば、図1に示す一実施例のナノ構造体1のように、基体2の表面の凸部により形成された構造体3が微細な所定ピッチP1で多数配置されている。より詳細には、構造体3の微細な所定ピッチP1の配列を含むトラックT1、T2、T3、…が、所定のトラックピッチTpで多数配列したものとなっている。
を行うことで作製することができる。
実施例1〜4、比較例1および2
図2に示したロール原盤露光装置10であって、ロール原盤11を使用し、化学増幅型レジストを使用し、露光条件を表1のように変えることにより図5A〜図5Dに示すタイプA、B、C、Dの潜像パターンを形成した。
なお、図中、Tは露光方向を示している。
比較例1および2の潜像パターン(図5C)では、BAの潜像の中心間距離は、1トラックおきに露光方向ピッチP1よりも長くなっており、表1には、このP1よりも長い潜像の中心間距離を記載した。
判定基準は、○:シームが視認されない、△:シームがかすかに視認される、×:シームが視認される、とした。
2 基体
3 構造体
10 ロール原盤露光装置
11 ロール原盤
12 レジスト層
13 レーザ光源
14 電気光学素子(EOM)
15 ミラー
16 フォトダイオード
17 変調光学系(OM)
18 集光レンズ
19 音響光学素子(AOM)
20 レンズ
21 フォーマッター
22 ドライバ
23 ミラー
24 移動テーブル
25 ビームエクスパンダ
26 対物レンズ
27 スピンドルモータ
28 ターンテーブル
L レーザ光
P1 ピッチ(露光方向)
P2 斜めピッチ
T1、T2、T3 トラック
Tp トラックピッチ又は送りピッチ
Claims (3)
- 基体表面の凸部又は凹部により形成された構造体の所定ピッチの配列を含むトラックが多数列配置されてなるナノ構造体であって、所定ピッチに構造体が存在しない部分がトラックの配列方向に配列した帯状部分(以下、シームという)を有し、各トラックにおいて、シームを挟む一対の構造体の中心間距離が前記所定ピッチよりも長く且つ前記所定ピッチの1.52倍以下であるナノ構造体。
- 構造体の配置パターンが、六方格子または準六方格子パターンである請求項1記載のナノ構造体。
- 請求項1記載のナノ構造体の作製方法であって、
原盤の表面にレジスト層を形成する工程、
原盤上のレジスト層にレーザ光をパルス照射しつつ照射位置を移動させることにより、露光部からなるスポット状潜像の露光方向の所定ピッチの配列を含む潜像のトラックが多数列配置されてなる潜像パターンを形成する工程、
潜像を現像してレジストパターンを形成する工程、
レジストパターンをマスクとして原盤をエッチング処理することにより原盤の表面に凹凸パターンを形成する工程、及び
原盤の表面凹凸を樹脂材料に転写する工程
を有し、
前記潜像パターンを形成する工程において、各潜像のトラックに緩衝領域としてレーザ光非照射部分を設定し、このレーザ光非照射部分を挟む一対のスポット状潜像の中心間距離を、スポット状潜像の所定ピッチよりも長く且つ1.52倍以下とするナノ構造体の作製方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012285976A JP6107131B2 (ja) | 2012-12-27 | 2012-12-27 | ナノ構造体及びその作製方法 |
PCT/JP2013/084060 WO2014103868A1 (ja) | 2012-12-27 | 2013-12-19 | ナノ構造体及びその作製方法 |
CN201380068572.7A CN104903073B (zh) | 2012-12-27 | 2013-12-19 | 纳米结构体及其制作方法 |
US14/441,866 US9975291B2 (en) | 2012-12-27 | 2013-12-19 | Nanostructure and method of manufacturing the same |
Applications Claiming Priority (1)
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JP2012285976A JP6107131B2 (ja) | 2012-12-27 | 2012-12-27 | ナノ構造体及びその作製方法 |
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JP2014124939A JP2014124939A (ja) | 2014-07-07 |
JP6107131B2 true JP6107131B2 (ja) | 2017-04-05 |
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US (1) | US9975291B2 (ja) |
JP (1) | JP6107131B2 (ja) |
CN (1) | CN104903073B (ja) |
WO (1) | WO2014103868A1 (ja) |
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JP5895335B2 (ja) * | 2010-10-22 | 2016-03-30 | ソニー株式会社 | 積層体、成型素子、および光学素子 |
CN102441989A (zh) * | 2010-09-17 | 2012-05-09 | 索尼公司 | 层叠体及其制造方法、转印装置、成型元件以及光学元件 |
KR101470959B1 (ko) * | 2011-06-03 | 2014-12-10 | 파나소닉 주식회사 | 미세구조체의 제조방법 및 미세구조 금형 |
JP2013000961A (ja) * | 2011-06-16 | 2013-01-07 | Panasonic Corp | ロール金型の製造方法と光学フィルムの製造方法、並びに、ロール金型と光学フィルム |
JP5689533B2 (ja) * | 2011-08-31 | 2015-03-25 | 旭化成イーマテリアルズ株式会社 | 光学用基材、半導体発光素子、インプリント用モールドおよび露光方法 |
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