WO2013146330A1 - 光学素子およびその製造方法、光学系、撮像装置、光学機器および原盤 - Google Patents
光学素子およびその製造方法、光学系、撮像装置、光学機器および原盤 Download PDFInfo
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- WO2013146330A1 WO2013146330A1 PCT/JP2013/057321 JP2013057321W WO2013146330A1 WO 2013146330 A1 WO2013146330 A1 WO 2013146330A1 JP 2013057321 W JP2013057321 W JP 2013057321W WO 2013146330 A1 WO2013146330 A1 WO 2013146330A1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
- G02B5/0215—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures the surface having a regular structure
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/0257—Diffusing elements; Afocal elements characterised by the diffusing properties creating an anisotropic diffusion characteristic, i.e. distributing output differently in two perpendicular axes
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0273—Diffusing elements; Afocal elements characterized by the use
- G02B5/0294—Diffusing elements; Afocal elements characterized by the use adapted to provide an additional optical effect, e.g. anti-reflection or filter
Definitions
- the present technology relates to an optical element and a manufacturing method thereof, an optical system, an imaging device, an optical apparatus, and a master. Specifically, the present invention relates to an optical element having a subwavelength structure provided on the surface.
- Non-Patent Document 1 a subwavelength structure on the surface of an optical element
- the above-described antireflection technology is considered to be applied to the surfaces of various optical elements in order to have excellent antireflection characteristics.
- a technique for forming a subwavelength structure on the lens surface has been proposed (see, for example, Patent Document 1).
- an optical element such as a lens, a mirror, or a filter having a sub-wavelength structure formed on the surface
- a line is added to the captured image. -Like bright lines and scattering noise may occur.
- a first object of the present technology is to provide an optical element having an excellent optical adjustment function, a manufacturing method thereof, an optical system, an imaging device, an optical apparatus, and a master.
- a second object of the present technology is to provide an optical element capable of suppressing the generation of a linear bright line and scattered noise even when a bright spot is photographed, a manufacturing method thereof, an optical system, an imaging device, an optical apparatus, and a master disk Is to provide.
- the first technique is: An element body; A plurality of sub-wavelength structures provided on the surface of the element body, The subwavelength structure includes an energy beam curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition, The surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, The scattered light intensity distribution is an optical element having anisotropy.
- the second technology is Apply the energy ray curable resin composition to the surface of the element body, While rotating the rotating surface of the rotating master to the energy ray curable resin composition applied to the surface of the element body, the energy rays emitted from the energy beam source provided in the rotating master are passed through the rotating surface.
- Forming a plurality of sub-wavelength structures on the surface of the element body by irradiating and curing the energy ray curable resin composition The surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, This is a method for manufacturing an optical element in which the intensity distribution of scattered light has anisotropy.
- the third technology is An optical element; An imaging device having an imaging region for receiving light via an optical element, The optical element An element body; A plurality of sub-wavelength structures provided on the surface of the element body, The subwavelength structure includes an energy beam curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition, The surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, The intensity distribution of scattered light is an optical system having anisotropy.
- the fourth technology is An optical system including an optical element and an imaging element having an imaging region that receives light through the optical element;
- the optical element An element body;
- the subwavelength structure includes an energy beam curable resin composition,
- the element body is impermeable to energy rays for curing the energy ray curable resin composition,
- the surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light,
- This is an imaging device in which the intensity distribution of scattered light has anisotropy.
- the fifth technology is An optical system including an optical element and an imaging element having an imaging region that receives light through the optical element;
- the optical element An element body;
- the subwavelength structure includes an energy beam curable resin composition,
- the element body is impermeable to energy rays for curing the energy ray curable resin composition,
- the surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, This is an optical device in which the intensity distribution of scattered light has anisotropy.
- the sixth technology is Having a rotating surface provided with a plurality of sub-wavelength structures;
- the rotating surface is configured to transmit energy rays,
- the rotating surface provided with a plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light,
- the intensity distribution of the scattered light is a master having anisotropy.
- the energy ray curable resin composition refers to a composition containing the energy ray curable resin composition as a main component.
- various materials such as thermosetting resin, silicone resin, organic fine particles, inorganic fine particles, conductive polymer, metal powder, and pigment can be used.
- the present invention is not limited to these, and various materials can be used depending on the desired characteristics of the laminate.
- the impermeability with respect to the energy rays means an impermeability to the extent that it is difficult to cure the energy ray curable resin composition.
- the unit area is preferably a transfer area formed by rotating the rotating surface of the rotating master disk once.
- the rotating master it is preferable to use a roll master or a belt master.
- the rotating master is not limited to these as long as it has a rotating surface provided with an uneven shape.
- the structure array is preferably a regular array, an irregular array, or a combination thereof.
- the array of structures is preferably a one-dimensional array or a two-dimensional array.
- the shape of the element body has a film shape or plate shape having two main surfaces, a polyhedral shape having three or more main surfaces, a curved surface shape having a curved surface such as a spherical surface and a free-form surface, a flat surface and a spherical surface. It is preferable to use a polyhedral shape. It is preferable to form a shape layer on at least one of a plurality of main surfaces of these element bodies. It is preferable that the element body has at least one plane or curved surface, and the shape layer is formed on the plane or curved surface.
- the concave and convex shapes of the shape layers are connected without causing inconsistency between the unit regions, there is no deterioration in the characteristics of the laminated body due to the inconsistency between the unit regions or shape disturbance. Accordingly, a laminate having excellent characteristics and appearance can be obtained.
- the uneven shape is a lens or a pattern of a subwavelength structure, excellent optical characteristics can be obtained even between unit regions.
- the uneven shape is a design in which a predetermined pattern or the like is repeated, a design such as a pattern having no mismatched portion can be obtained.
- various elements can be used as the element body.
- the optical element has an incident surface on which light from a subject is incident and an output surface that emits light incident from the incident surface, and the sub-wavelength structure includes at least one of the incident surface and the output surface. It is preferable to be formed.
- This technology is suitable for application to optical devices. More specifically, it is suitable for application to an optical element having a sub-wavelength structure formed on the surface, an optical system including the optical element, and an imaging device or optical apparatus including the optical element or optical system.
- the optical element include, but are not limited to, a lens, a filter (for example, an ND filter), a transflective mirror, a dimming element, a prism, and a polarizing element.
- the imaging apparatus include a digital camera and a digital video camera, but are not limited thereto.
- the optical apparatus include, but are not limited to, a telescope, a microscope, an exposure apparatus, a measurement apparatus, an inspection apparatus, and an analysis apparatus.
- the intensity distribution of the scattered light has anisotropy, the generation of scattered light can be suppressed by selecting the direction in which the optical element is used.
- an optical element having an excellent optical adjustment function and less scattering can be realized.
- FIG. 1A is a plan view illustrating an example of a configuration of a stacked body according to the first embodiment of the present technology.
- FIG. 1B is an enlarged perspective view showing a part of the laminate shown in FIG. 1A.
- FIG. 1C is an enlarged plan view showing a part of the laminate shown in FIG. 1A.
- 1D is a cross-sectional view of the stacked body shown in FIG. 1C in the track extending direction.
- 2A to 2E are cross-sectional views illustrating first to fifth examples of the base body provided in the multilayer body according to the first embodiment of the present technology.
- FIG. 3 is a schematic diagram illustrating an example of the configuration of the transfer device according to the first embodiment of the present technology.
- FIG. 4 is a perspective view showing an example of the configuration of the roll master.
- FIG. 4B is an enlarged plan view showing a part of the roll master shown in FIG. 4A.
- FIG. 5 is a schematic diagram showing an example of the configuration of the roll master exposure apparatus.
- 6A to 6D are process diagrams for explaining an example of the manufacturing method of the laminated body according to the first embodiment of the present technology.
- FIG. 7A to FIG. 7E are process diagrams for explaining an example of the manufacturing method of the laminated body according to the first embodiment of the present technology.
- FIG. 8 is a schematic diagram illustrating an example of a configuration of a transfer device according to the second embodiment of the present technology.
- FIG. 9 is a schematic diagram illustrating an example of a configuration of a transfer device according to the third embodiment of the present technology.
- FIG. 10A is a plan view illustrating an example of a configuration of a stacked body according to the fourth embodiment of the present technology.
- 10B is an enlarged plan view illustrating a part of the stacked body illustrated in FIG. 10A.
- FIG. 11A is a cross-sectional view illustrating an example of a configuration of a stacked body according to the fifth embodiment of the present technology.
- FIG. 11B is an enlarged plan view illustrating a part of the stacked body illustrated in FIG. 11A.
- FIG. 11C is a cross-sectional view of the stacked body illustrated in FIG. 11B.
- FIG. 11A is a plan view illustrating an example of a configuration of a stacked body according to the fourth embodiment of the present technology.
- FIG. 11B is an enlarged plan view illustrating a part of the stacked body illustrated in FIG. 11A.
- FIG. 12 is a perspective view illustrating an example of a configuration of a stacked body according to the sixth embodiment of the present technology.
- 13A to 13E are cross-sectional views illustrating first to fifth examples of the base body provided in the multilayer body according to the seventh embodiment of the present technology.
- 14A and 14B are cross-sectional views illustrating first and second examples of the base body provided in the multilayer body according to the eighth embodiment of the present technology, respectively.
- 15A and 15B are schematic diagrams for explaining the cause of the occurrence of bright line noise.
- FIG. 16 is a schematic diagram illustrating an example of a configuration of an imaging device according to the ninth embodiment of the present technology.
- FIG. 17A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to a ninth embodiment of the present technology.
- FIG. 17B is an enlarged plan view showing a part of the optical element with an antireflection function shown in FIG. 17A.
- FIG. 17C is a cross-sectional view of the track T in FIG. 17B.
- 18A to 18D are perspective views showing examples of the shape of the structure of the optical element with an antireflection function.
- FIG. 19A is a schematic diagram illustrating a part of the imaging optical system illustrated in FIG. 16 in an enlarged manner.
- FIG. 19B is a schematic diagram for explaining the definition of the numerical aperture NA of the imaging optical system shown in FIG. 19A.
- FIG. 20A is a schematic diagram beam L 0 is viewed from the incident side of the imaging optical system shown in FIG. 19A.
- FIG. 20B is an enlarged view illustrating a part of the optical element with an antireflection function included in the imaging optical system illustrated in FIG. 20A.
- FIG. 21A is a perspective view illustrating an example of a configuration of a roll master.
- FIG. 21B is an enlarged plan view showing a part of the roll master shown in FIG. 21A.
- FIG. 21C is a cross-sectional view of the track T in FIG. 21B.
- FIG. 22A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to the tenth embodiment of the present technology.
- FIG. 22A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to the tenth embodiment of the present technology.
- FIG. 22B is an enlarged plan view showing a part of the optical element with an antireflection function shown in FIG. 22A.
- 22C is a cross-sectional view taken along track T in FIG. 22B.
- FIG. 23A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to an eleventh embodiment of the present technology.
- FIG. 23B is an enlarged plan view showing a part of the optical element with an antireflection function shown in FIG. 23A.
- 23C is a cross-sectional view taken along track T in FIG. 23B.
- FIG. 24A is an enlarged plan view illustrating a part of the surface of the optical element with an antireflection function according to the twelfth embodiment of the present technology.
- FIG. 24A is an enlarged plan view illustrating a part of the surface of the optical element with an antireflection function according to the twelfth embodiment of the present technology.
- FIG. 24B is a schematic diagram for explaining the definition of the virtual track Ti.
- FIG. 25A is a schematic diagram for explaining the fluctuation range of the center position of the structure.
- FIG. 25B is a schematic diagram for explaining the variation ratio of the structure.
- FIG. 26A and FIG. 26B are schematic views illustrating a first example of an arrangement form of structures.
- FIG. 26C is a schematic diagram illustrating a second example of the arrangement form of the structures.
- FIG. 27A is an enlarged plan view illustrating a part of the surface of the optical element with an antireflection function according to the thirteenth embodiment of the present technology.
- FIG. 27B is a schematic diagram for explaining the fluctuation range of the arrangement pitch of the structures.
- FIG. 28 is a schematic diagram illustrating an example of a configuration of an imaging device according to a fourteenth embodiment of the present technology.
- FIG. 29 is a schematic diagram illustrating an example of a configuration of an imaging device according to a fifteenth embodiment of the present technology.
- 30A to 30D are cross-sectional views illustrating a configuration example of the ND filter.
- FIG. 31A is a diagram showing a transmission spectrum of the ND filter of Example 1 and Comparative Example 1.
- FIG. FIG. 31B is a diagram showing the reflection spectra of the ND filters of Example 1 and Comparative Example 1.
- FIG. 32A is a diagram showing a simulation result of Test Example 1-1.
- FIG. 32B is a diagram illustrating a simulation result of Test Example 1-2.
- FIG. 33A is a diagram illustrating a simulation result of Test Example 2-1.
- FIG. 33B is a graph showing an intensity distribution as a simulation result of Test Example 2-1.
- FIG. 34A is a diagram illustrating a simulation result of Test Example 2-2.
- FIG. 34B is a graph showing an intensity distribution which is a simulation result of Test Example 2-2.
- FIG. 35A is a diagram illustrating a simulation result of Test Example 2-3.
- FIG. 35B is a graph showing an intensity distribution which is a simulation result of Test Example 2-3.
- First embodiment an example of a laminate in which a plurality of structures are two-dimensionally arranged on one main surface of a substrate
- Second Embodiment Example of Transfer Device that Transports Laminated Body by Stage
- Third Embodiment Example of a transfer device provided with an annular belt master
- Fourth embodiment an example of a laminate in which a plurality of structures are meandered on one main surface of a base
- Fifth embodiment an example of a laminate in which a plurality of structures are randomly arranged on one main surface of a substrate 6).
- Sixth embodiment an example of a laminate in which a plurality of structures are arranged one-dimensionally on one main surface of a base
- Seventh Embodiment (Example in which a plurality of structures are two-dimensionally arranged on both main surfaces of a base) 8).
- Eighth embodiment (an example of a laminate in which a plurality of impermeable structures are two-dimensionally arranged) 9.
- Ninth embodiment (an example of an optical system in which scattered light reaching the imaging region is reduced and an imaging apparatus including the same) 10.
- Tenth Embodiment Example in which structures are arranged in a tetragonal lattice shape or a quasi-tetragonal lattice shape) 11.
- FIG. 1A is a plan view illustrating an example of a configuration of a stacked body according to the first embodiment of the present technology.
- FIG. 1B is an enlarged perspective view showing a part of the laminate shown in FIG. 1A.
- FIG. 1C is an enlarged plan view showing a part of the laminate shown in FIG. 1A.
- 1D is a cross-sectional view of the stacked body shown in FIG. 1C in the track extending direction.
- the laminate includes a substrate 1 having a first main surface and a second main surface, and a shape layer 2 having an uneven shape formed on one of these main surfaces. Below, the 1st surface in which the shape layer 2 is formed is suitably called a surface, and the 2nd surface on the opposite side is suitably called a back surface.
- Laminates are for surface elements, design bodies, molding elements such as mechanical elements and medical elements, antireflection elements, polarizing elements, periodic optical elements, diffractive elements, imaging elements and waveguide elements, and other optical elements. It is suitable for application.
- the laminated body has various light quantity adjustment filters such as ND (Neutral Density) filters, sharp cut filters and interference filters, polarizing plates, front panels of mobile phones and automobile instrument panels, and texture processing of mobile phones and the like. It is suitable for application to resin molded products and glass molded products.
- the laminated body has, for example, a belt-like shape and is wound into a roll shape to form a so-called original fabric.
- the laminate is preferably flexible. This is because the belt-like laminate can be wound into a roll to form an original fabric, and the transportability and handling properties are improved.
- the laminate for example, has at least one cycle or more of the transcribed region (unit region) T E.
- the one-cycle transfer region TE is a region transferred by one rotation of a roll master described later. That is, the length of the transfer area T E of one cycle is equivalent to the length of the peripheral surface of the roll master.
- two transfer regions T E is connected seamlessly. This is because a laminate having excellent characteristics and appearance can be obtained.
- inconsistency means that the physical configuration such as the uneven shape by the structure 21 is discontinuous. Specific examples of the inconsistency, for example, overlap between the periodicity of the disturbance of predetermined concavo-convex pattern having the transfer area T E or adjacent unit region, the gap, or the like untransferred portion.
- the material of the substrate 1 is not particularly limited and can be appropriately selected depending on the application.
- a plastic material, a glass material, a metal material, and a metal compound material for example, ceramics, magnetic material, semiconductor, etc.
- a metal compound material for example, ceramics, magnetic material, semiconductor, etc.
- plastic material examples include triacetyl cellulose, polyvinyl alcohol, cyclic olefin polymer, cyclic olefin copolymer, polycarbonate, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyethylene terephthalate, polyethylene naphthalate, methacrylic resin, nylon, polyacetal, Fluorine resin, phenol resin, polyurethane, epoxy resin, polyimide resin, polyamide resin, melamine resin, polyether ether ketone, polysulfone, polyether sulfone, polyphenylene sulfide, polyarylate, polyetherimide, polyamideimide, methyl methacrylate (both) A polymer etc. are mentioned.
- glass material examples include soda lime glass, lead glass, hard glass, quartz glass, and liquid crystal glass.
- metal material and the metal compound material include silicon, silicon oxide, sapphire, calcium fluoride, magnesium fluoride, barium fluoride, lithium fluoride, zinc selenide, and potassium bromide.
- the shape of the substrate 1 examples include a sheet shape, a plate shape, and a block shape, but are not particularly limited to these shapes.
- the sheet is defined as including a film.
- Substrate 1 has a belt-like shape as a whole, toward the longitudinal direction of the base body 1, it is preferable that the transfer region T E is continuously formed as a unit area.
- the shape of the front surface and the back surface of the substrate for example, either a flat surface or a curved surface can be used. Either the front surface or the back surface can be a flat surface or a curved surface. It is also possible.
- the substrate 1 is impermeable to energy rays for curing the energy ray curable resin composition for forming the shape layer 2.
- the energy beam indicates an energy beam for curing the energy beam curable resin composition for forming the shape layer 2.
- a decoration layer or a functional layer may be formed on the surface of the substrate 1 by printing, coating, vacuum film formation, or the like.
- the substrate 1 has a single layer structure or a laminated structure.
- the laminated structure is a laminated structure in which two or more layers are laminated, and at least one layer in the laminated structure is an impermeable layer that is impermeable to energy rays.
- the method for forming the laminate include a method of directly bonding the layers by fusion or surface treatment, and a method of bonding the layers through a bonding layer such as an adhesive layer or an adhesive layer.
- the bonding layer may include a material such as a pigment that absorbs energy rays.
- the substrate 1 when the substrate 1 has a laminated structure, a non-transparent layer that is impermeable to energy rays and a transmissive layer that is permeable to energy rays may be combined. Further, when the substrate 1 includes two or more impermeable layers, they may have different absorption characteristics.
- the substrate 1 may be an element body such as an optical element.
- a transparent organic film such as an acrylic resin coating material, a transparent metal film, an inorganic film, a metal compound film, or a laminate thereof can be used, but is not particularly limited. Absent.
- an organic film such as an acrylic resin coating material containing a pigment, a metal film, a metal compound film, or a laminate thereof can be used, but it is not particularly limited.
- a light-absorbing material such as carbon black can be used.
- 2A to 2E are cross-sectional views showing first to fifth examples of the substrate, respectively.
- the substrate 1 has a single-layer structure, and the entire substrate is an impermeable layer that is impermeable to energy rays.
- the substrate 1 has a two-layer structure, and includes a non-transparent layer 11a that is impermeable to energy rays, and a transmissive layer 11b that is permeable to energy rays.
- the impermeable layer 11a is disposed on the back side, and the transmissive layer 11b is disposed on the front side.
- the substrate 1 has a two-layer structure, and includes a non-transparent layer 11a that is impermeable to energy rays, and a transmissive layer 11b that is permeable to energy rays.
- the impermeable layer 11a is disposed on the front surface side
- the transmissive layer 11b is disposed on the back surface side.
- the substrate 1 has a three-layer structure and is permeable to energy rays, and is formed on both main surfaces of the transmissive layer 11b. And impervious layers 11a and 11a. One impermeable layer 11a is disposed on the back surface side, and the other impermeable layer 11a is disposed on the front surface side.
- the substrate 1 has a three-layer structure and has an impermeable layer 11a that is impermeable to energy rays, and energy rays formed on both main surfaces of the impermeable layer 11a.
- Transparent layers 11b and 11b having transparency.
- One transmissive layer 11b is disposed on the back surface side, and the other transmissive layer 11b is disposed on the front surface side.
- Shaped layer 2 has a surface transfer region T E is continuously formed with a predetermined concavo-convex pattern.
- the shape layer 2 is, for example, a layer in which a plurality of structures 21 are two-dimensionally arranged, and a base layer 22 may be provided between the plurality of structures 21 and the base 1 as necessary.
- the base layer 22 is a layer integrally formed with the structure 21 on the bottom surface side of the structure 21, and is formed by curing the same energy ray curable resin composition as the structure 21.
- the thickness of the base layer 22 is not particularly limited, and can be appropriately selected as necessary.
- the plurality of structures 21 are arranged so as to form a plurality of rows of tracks T on the surface of the base 1, for example.
- the plurality of structures 21 arranged to form a plurality of examples of tracks may form a regular predetermined arrangement pattern, for example.
- a lattice pattern can be used as the arrangement pattern.
- the lattice pattern is at least one of a hexagonal lattice pattern, a quasi-hexagonal lattice pattern, a tetragonal lattice pattern, and a quasi-tetragonal lattice pattern, for example.
- the height of the structure 21 may be changed regularly or irregularly on the surface of the substrate 1.
- the structure 21 may have a convex or concave shape with respect to the surface of the substrate 1, and both the convex and concave structures 21 may exist on the surface of the substrate 1.
- Specific examples of the shape of the structure 21 include a cone shape, a columnar shape, a needle shape, a hemispherical shape, a semi-elliptical spherical shape, and a polygonal shape. However, the shape is not limited to these shapes. You may make it employ
- Examples of the cone shape include a cone shape with a sharp top, a cone shape with a flat top, and a cone shape with a convex or concave curved surface at the top, but are not limited to these shapes. is not.
- the cone-shaped cone surface may be curved concavely or convexly.
- the structure 21 has an elliptical cone shape having a convex curved surface at the top, or an elliptical frustum with a flat top. It is preferable to adopt a shape and make the major axis direction of the ellipse forming the bottom face coincide with the extending direction of the track.
- the pitch of the structures 21 is appropriately selected depending on the type of the laminated body.
- the structure 21 has a short arrangement pitch equal to or less than the wavelength band of light for the purpose of reducing reflection,
- the two-dimensional arrangement is periodically performed at an arrangement pitch that is approximately equal to the wavelength of visible light.
- the wavelength band of light for the purpose of reducing reflection is, for example, the wavelength band of ultraviolet light, the wavelength band of visible light, or the wavelength band of infrared light.
- the wavelength band of ultraviolet light means a wavelength band of 10 nm to 400 nm
- the wavelength band of visible light means a wavelength band of 400 nm to 830 nm
- the wavelength band of infrared light means a wavelength band of 830 nm to 1 mm.
- the shape layer 2 is formed by curing the energy beam curable resin composition.
- the shape layer 2 is preferably formed by advancing a curing reaction such as polymerization of the energy ray-curable resin composition applied on the substrate 1 from the side opposite to the substrate 1. This is because a substrate 1 that is impermeable to energy rays can be used. Between the transfer region T E is preferably connected without causing hardening of the mismatch of the energy ray curable resin composition.
- the mismatch in the degree of cure of the energy beam curable resin composition is, for example, a difference in the degree of polymerization.
- the energy ray curable resin composition is a resin composition that can be cured by irradiation with energy rays.
- Energy rays are polymerization reactions of radicals such as electron beams, ultraviolet rays, infrared rays, laser beams, visible rays, ionizing radiation (X rays, ⁇ rays, ⁇ rays, ⁇ rays, etc.), microwaves, high frequencies, cations, anions, etc. Shows energy lines that can trigger.
- the energy ray curable resin composition may be used by mixing with other resins as necessary, for example, by mixing with other curable resins such as thermosetting resins.
- the energy ray curable resin composition may be an organic-inorganic hybrid material. Moreover, you may make it mix and use 2 or more types of energy beam curable resin compositions.
- As the energy ray curable resin composition it is preferable to use an ultraviolet curable resin that is cured by ultraviolet rays.
- the ultraviolet curable resin is composed of, for example, a monofunctional monomer, a bifunctional monomer, a polyfunctional monomer, an initiator, and the like.
- Monofunctional monomers include, for example, carboxylic acids (acrylic acid), hydroxys (2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate), alkyl, alicyclics (isobutyl acrylate, t-butyl acrylate) , Isooctyl acrylate, lauryl acrylate, stearyl acrylate, isobornyl acrylate, cyclohexyl acrylate), other functional monomers (2-methoxyethyl acrylate, methoxyethylene crycol acrylate, 2-ethoxyethyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, Ethyl carbitol acrylate, phenoxyethyl acrylate
- bifunctional monomer examples include tri (propylene glycol) diacrylate, trimethylol propane diallyl ether, urethane acrylate, and the like.
- polyfunctional monomer examples include trimethylolpropane triacrylate, dipentaerythritol penta and hexaacrylate, and ditrimethylolpropane tetraacrylate.
- the initiator examples include 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and the like. Can be mentioned.
- the material for the shape layer 2 in addition to the energy ray curable resin composition described above, a material capable of obtaining an inorganic film after baking, such as heat-resistant perhydropolysilazane, a silicon resin material, or the like can be used. It is.
- the energy beam curable resin composition may contain a filler, a functional additive, a solvent, an inorganic material, a pigment, an antistatic agent, a sensitizing dye, and the like, if necessary.
- a filler for example, both inorganic fine particles and organic fine particles can be used.
- the inorganic fine particles include metal oxide fine particles such as SiO 2 , TiO 2 , ZrO 2 , SnO 2 , and Al 2 O 3 .
- the functional additive include a leveling agent, a surface conditioner, an absorbent, and an antifoaming agent.
- FIG. 3 is a schematic diagram illustrating an example of the configuration of the transfer device according to the first embodiment of the present technology.
- the transfer apparatus includes a roll master 101, a substrate supply roll 111, a take-up roll 112, guide rolls 113 and 114, a nip roll 115, a peeling roll 116, a coating apparatus 117, and an energy beam source 110.
- a substrate 1 such as a sheet is wound on the substrate supply roll 111 in a roll shape, and is arranged so that the substrate 1 can be continuously fed through the guide roll 113.
- the take-up roll 112 is arranged so that the laminated body having the shape layer 2 having the concavo-convex shape transferred thereto by this transfer device can be taken up.
- the guide rolls 113 and 114 are arranged on a conveyance path in the transfer unit so that the belt-like substrate 1 and the belt-like laminate can be conveyed.
- the nip roll 115 is arranged so that the substrate 1 fed from the substrate supply roll 111 and coated with the energy ray curable resin composition can be nipped with the roll master 101.
- the roll master 101 has a transfer surface for forming the shape layer 2, and includes one or a plurality of energy beam sources 110 therein. Details of the roll master 101 will be described later.
- the peeling roll 116 is disposed so that the shape layer 2 obtained by curing the energy beam curable resin composition 118 can be peeled from the transfer surface of the roll master 101.
- the material of the substrate supply roll 111, the take-up roll 112, the guide rolls 113 and 114, the nip roll 115, and the peeling roll 116 is not particularly limited, and a metal such as stainless steel, rubber, or silicone depending on the desired roll characteristics Etc. can be appropriately selected and used.
- a coating device 117 for example, a device including coating means such as a coater can be used.
- a coater such as a gravure, a wire bar, and a die can be appropriately used in consideration of physical properties of the energy ray curable resin composition to be applied.
- FIG. 4A is a perspective view illustrating an example of a configuration of a roll master.
- FIG. 4B is an enlarged plan view showing a part of the roll master shown in FIG. 4A.
- the roll master 101 is, for example, a master having a cylindrical shape, and has a transfer surface Sp formed on the surface thereof and a back surface Si that is an inner peripheral surface formed on the inner side opposite to the transfer surface Sp.
- a cylindrical hollow portion formed of the back surface Si is formed in the roll master 101, and one or a plurality of energy ray sources 110 are provided in the hollow portion.
- a plurality of concave or convex structures 102 are formed on the transfer surface Sp, and the shape of these structures 102 is transferred to the energy beam curable resin composition applied on the substrate 1.
- the shape layer 2 of the laminate is formed. That is, on the transfer surface Sp, a pattern is formed by inverting the concavo-convex shape of the shape layer 2 of the laminate.
- the roll master 101 is transparent to the energy rays emitted from the energy ray source 110, and is configured to be able to emit the energy rays emitted from the energy ray source 110 and incident on the back surface Si from the transfer surface Sp. Yes.
- the energy ray curable resin composition 118 applied on the substrate 1 is cured by the energy rays emitted from the transfer surface Sp.
- the material of the roll master 101 is not particularly limited as long as it is permeable to energy rays.
- a material having transparency to ultraviolet rays glass, quartz, transparent resin, organic-inorganic hybrid material, or the like is preferably used.
- the transparent resin include polymethyl methacrylate (PMMA) and polycarbonate (PC).
- Examples of the organic / inorganic hybrid material include polydimethylsiloxane (PDMS).
- a transparent metal film, metal compound film, or organic film may be formed on at least one of the transfer surface Sp and the back surface Si of the roll master 101.
- One or a plurality of energy beam sources 110 are supported in the hollow portion of the roll master 101 so that energy beams can be irradiated toward the energy beam curable resin composition 118 applied on the substrate 1.
- these energy ray sources 110 are preferably arranged to form one row or two or more rows.
- the energy ray source can emit energy rays such as electron beam, ultraviolet ray, infrared ray, laser beam, visible ray, ionizing radiation (X ray, ⁇ ray, ⁇ ray, ⁇ ray, etc.), microwave or high frequency.
- energy rays such as electron beam, ultraviolet ray, infrared ray, laser beam, visible ray, ionizing radiation (X ray, ⁇ ray, ⁇ ray, ⁇ ray, etc.), microwave or high frequency.
- a point light source or a linear light source can be used, but it is not particularly limited, and a point light source and a linear light source may be used in combination.
- a point light source is used as the energy ray source, it is preferable to configure the line light source by arranging a plurality of point light sources in a straight line.
- the linear light source is preferably arranged in parallel with the rotation axis of the roll master 101.
- Examples of energy ray sources that emit ultraviolet rays include low-pressure mercury lamps, high-pressure mercury lamps, short arc discharge lamps, ultraviolet light-emitting diodes, semiconductor lasers, fluorescent lamps, organic electroluminescence, inorganic electroluminescence, light-emitting diodes, and optical fibers. Although it is mentioned, it is not particularly limited to these.
- a slit may be further provided in the roll master 101, and the energy ray curable resin composition 118 may be irradiated with energy rays emitted from the energy ray source 110 through the slit. At this time, the energy ray curable resin composition 118 may be cured by heat generated by absorbing the energy rays.
- FIG. 5 is a schematic view showing an example of the configuration of a roll master exposure apparatus for producing a roll master.
- This roll master exposure apparatus is configured based on an optical disk recording apparatus.
- the laser light 104 emitted from the laser light source 31 travels straight as a parallel beam and enters an electro-optic element (EOM: Electro Optical Modulator) 32.
- EOM Electro Optical Modulator
- the mirror 33 is composed of a polarization beam splitter and has a function of reflecting one polarization component and transmitting the other polarization component.
- the polarization component transmitted through the mirror 33 is received by the photodiode 34, and the electro-optic element 32 is controlled based on the received light signal to perform phase modulation of the laser beam 104.
- the laser light 104 is collected by an acousto-optic modulator (AOM) 37 made of glass (SiO 2 ) or the like by a condenser lens 36.
- AOM acousto-optic modulator
- the laser beam 104 is intensity-modulated by the acoustooptic device 37 and diverges, and then converted into a parallel beam by the lens 38.
- the laser beam 104 emitted from the modulation optical system 35 is reflected by the mirror 41 and guided horizontally and parallel onto the moving optical table 42.
- the moving optical table 42 includes a beam expander 43 and an objective lens 44.
- the laser beam 104 guided to the moving optical table 42 is shaped into a desired beam shape by the beam expander 43 and then irradiated to the resist layer on the roll master 101 via the objective lens 44.
- the roll master 101 is placed on the turntable 46 connected to the spindle motor 45. Then, while rotating the roll master 101 and moving the laser light 104 in the height direction of the roll master 101, the resist layer is exposed to the laser light 104 intermittently, thereby performing the resist layer exposure process.
- the formed latent image has a substantially elliptical shape having a major axis in the circumferential direction.
- the laser beam 104 is moved by moving the moving optical table 42 in the arrow R direction.
- the exposure apparatus includes, for example, a control mechanism 47 for forming a latent image corresponding to a two-dimensional pattern such as a hexagonal lattice or a quasi-hexagonal lattice shown in FIG. 1C on the resist layer.
- the control mechanism 47 includes a formatter 39 and a driver 40.
- the formatter 39 includes a polarity reversal part, and this polarity reversal part controls the irradiation timing of the laser beam 104 to the resist layer.
- the driver 40 receives the output from the polarity inversion unit and controls the acoustooptic device 37.
- a signal is generated by synchronizing the polarity inversion formatter signal and the rotary controller of the recording apparatus for each track so that the two-dimensional pattern is spatially linked, and the intensity is modulated by the acousto-optic element 37.
- a hexagonal lattice pattern or a quasi-hexagonal lattice pattern can be recorded by patterning at a constant angular velocity (CAV) with an appropriate rotation speed, an appropriate modulation frequency, and an appropriate feed pitch.
- CAV constant angular velocity
- the feed pitch may be set to 251 nm (Pythagorean law).
- the frequency of the polarity inversion formatter signal is changed according to the number of rotations of the roll (for example, 1800 rpm, 900 rpm, 450 rpm, 225 rpm).
- the frequency of the polarity inversion formatter signal facing the roll rotation speeds of 1800 rpm, 900 rpm, 450 rpm, and 225 rpm is 37.70 MHz, 18.85 MHz, 9.34 MHz, and 4.71 MHz, respectively.
- a quasi-hexagonal lattice pattern with a uniform spatial frequency (circumferential 315 nm period, circumferential direction approximately 60 degrees direction (approximately ⁇ 60 degrees direction) 300 nm period) in a desired recording area is obtained by moving far ultraviolet laser light on the moving optical table 42.
- the beam expander (BEX) 33 enlarges the beam diameter to 5 times, and irradiates the resist layer on the roll master 101 through the objective lens 44 having a numerical aperture (NA) of 0.9 to form a fine latent image. Can be obtained.
- NA numerical aperture
- FIGS. 6A to 7E are process diagrams for explaining an example of a manufacturing method of the laminated body according to the first embodiment of the present technology.
- a cylindrical roll master 101 is prepared.
- a resist layer 103 is formed on the surface of the roll master 101.
- a material of the resist layer 103 for example, either an organic resist or an inorganic resist may be used.
- the organic resist for example, a novolac resist, a chemically amplified resist, or the like can be used.
- an inorganic type resist the metal compound which consists of 1 type, or 2 or more types of transition metals can be used, for example.
- a laser beam (exposure beam) 104 is irradiated onto the resist layer 103 formed on the surface of the roll master 101. Specifically, it is placed on the turntable 46 of the roll master exposure apparatus shown in FIG. 5, the roll master 101 is rotated, and the resist layer 103 is irradiated with a laser beam (exposure beam) 104. At this time, the laser beam 104 is intermittently irradiated while moving the laser beam 104 in the height direction of the roll master 101 (a direction parallel to the central axis of the cylindrical or cylindrical roll master 101). Layer 103 is exposed over the entire surface. As a result, a latent image 105 corresponding to the locus of the laser beam 104 is formed over the entire surface of the resist layer 103 at a pitch similar to the visible light wavelength.
- the latent image 105 is arranged to form a plurality of rows of tracks on the surface of the master, and forms a hexagonal lattice pattern or a quasi-hexagonal lattice pattern.
- the latent image 105 has, for example, an elliptical shape having a major axis direction in the track extending direction.
- the surface of the roll master 101 is etched using the pattern (resist pattern) of the resist layer 103 formed on the roll master 101 as a mask.
- the etching for example, dry etching or wet etching can be used.
- one or a plurality of energy beam sources 110 are arranged in the accommodation space (hollow part) in the roll master 101.
- the energy beam source 110 is preferably arranged in parallel with the width direction Dw of the roll master 101 or the axial direction of the rotary shaft 1.
- the energy beam curable resin composition 118 is applied or printed on the long base 1 or the roll master 101.
- the coating method is not particularly limited, and for example, potting on a substrate or master, a spin coating method, a gravure coating method, a die coating method, a bar coating method, or the like can be used.
- a relief printing method for example, a relief printing method, an offset printing method, a gravure printing method, an intaglio printing method, a rubber plate printing method, a screen printing method and the like can be used.
- heat treatment such as solvent removal or pre-baking is performed as necessary.
- the transfer surface Sp is brought into close contact with the energy ray curable resin composition 118, and the energy emitted from the energy beam source 110 in the roll master 101.
- a line is irradiated to the energy ray curable resin composition 118 from the transfer surface Sp side of the roll master 101.
- the energy beam curable resin composition 118 is cured, and the shape layer 2 is formed.
- the curing reaction of the energy beam curable resin composition 118 proceeds sequentially from the transfer surface Sp side of the roll master 101 to the surface side of the substrate 1, and is applied or printed.
- the shape layer 2 is formed by hardening the entire object 118.
- the presence or absence of the base layer 22 or the thickness of the base layer 22 can be selected, for example, by adjusting the pressure of the roll master 101 against the surface of the substrate 1.
- the shape layer 2 formed on the substrate 1 is peeled off from the transfer surface Sp of the roll master 101.
- substrate 1 is obtained.
- the concavo-convex shape is transferred with the longitudinal direction of the belt-like substrate 1 as the rotational advance direction of the roll master 101.
- the transfer process using the transfer apparatus shown in FIG. 3 will be specifically described.
- the long substrate 1 is delivered from the substrate supply roll 111, and the delivered substrate 1 passes under the coating device 117.
- the energy beam curable resin composition 118 is applied by the coating device 117 onto the substrate 1 that passes under the coating device 117.
- the substrate 1 to which the energy ray curable resin composition 118 is applied is conveyed toward the roll master 101 through the guide roll 113.
- the carried substrate 1 is sandwiched between the roll master 101 and the nip roll 115 so that air bubbles do not enter between the substrate 1 and the energy beam curable resin composition 118.
- the energy beam curable resin composition 118 is brought into close contact with the transfer surface Sp of the roll master 101, the substrate 1 is transported along the transfer surface Sp of the roll master 101, and from one or more energy beam sources 110.
- the irradiated energy beam is irradiated to the energy beam curable resin composition 118 via the transfer surface Sp of the roll master 101.
- the energy ray curable resin composition 118 is cured, and the shape layer 2 is formed.
- the shape layer 2 is peeled off from the transfer surface Sp of the roll master 101 by the peeling roll 116 to obtain a long laminate.
- the obtained laminate is conveyed toward the take-up roll 112 through the guide roll 114, and the long laminate is taken up by the take-up roll 112. Thereby, the raw material by which the elongate laminated body was wound is obtained.
- FIG. 8 is a schematic diagram illustrating an example of a configuration of a transfer device according to the second embodiment of the present technology.
- the transfer device includes a roll master 101, a coating device 117, and a transport stage 121.
- the same portions as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the transfer stage 121 is configured to be able to transfer the substrate 1 placed on the transfer stage 121 in the direction of arrow a.
- the energy beam curable resin composition 118 is applied by the coating device 117 onto the substrate 1 that passes under the coating device 117.
- the substrate 1 on which the energy ray curable resin composition 118 is applied is conveyed toward the roll master 101.
- the energy ray curable resin composition 118 is conveyed while being in close contact with the transfer surface Sp of the roll master 101, and energy rays emitted from one or a plurality of energy ray sources 110 provided in the roll master 101 are used.
- the energy ray curable resin composition 118 is irradiated through the transfer surface Sp of the roll master 101.
- the energy ray curable resin composition 118 is cured, and the shape layer 2 is formed.
- the shape layer 2 is peeled from the transfer surface Sp of the roll master 101 by transporting the transport stage in the direction of arrow a. Thereby, a long laminated body is obtained. Next, if necessary, the obtained laminate is cut into a predetermined size or shape.
- the target laminated body is obtained by the above.
- FIG. 9 is a schematic diagram illustrating an example of a configuration of a transfer device according to the third embodiment of the present technology.
- This transfer device includes rolls 131, 132, 134, 135, an emboss belt 133 as a belt master, a flat belt 136, one or a plurality of energy beam sources 110, and a coating device 117.
- symbol is attached
- the embossed belt 133 is an example of a belt master, has an annular shape, and a plurality of structures 102 are two-dimensionally arranged on the outer peripheral surface thereof, for example.
- the embossed belt 133 is permeable to energy rays.
- the flat belt 136 has an annular shape, and its outer peripheral surface is a flat surface. A gap about the thickness of the substrate 1 is formed between the emboss belt 133 and the flat belt 136, and the substrate 1 coated with the energy ray curable resin composition 118 can run between these belts. It has become.
- the roll 131 and the roll 132 are arranged apart from each other, and the embossed belt 133 is supported by the inner peripheral surface of the roll 131 and the roll 132, and the embossed belt 133 is held in a long and narrow oval shape. Yes.
- the embossing belt 133 is driven to rotate by rotating the roll 131 and the roll 132 disposed inside the embossing belt 133.
- the roll 134 and the roll 135 are disposed to face the roll 131 and the roll 132, respectively.
- the flat belt 136 is supported by the inner peripheral surface of the roll 134 and the roll 135, and the flat belt 136 is held in a shape of an elongated ellipse or the like.
- the flat belt 136 is driven to rotate by rotating the roll 134 and the roll 135 disposed inside the flat belt 136.
- One or a plurality of energy ray sources 110 are arranged inside the emboss belt 133.
- One or a plurality of energy ray sources 110 are held so as to be able to irradiate energy rays to the base 1 that travels between the emboss belt 133 and the flat belt 136.
- the energy ray source 110 such as a linear light source is preferably arranged in parallel with the width direction of the emboss belt 133.
- the arrangement position of the energy beam source 110 is not particularly limited as long as it is within the space formed by the inner peripheral surface of the emboss belt 133.
- it may be arranged inside at least one of the roll 131 and the roll 132. In this case, it is preferable to form the roll 131 and the roll 132 with a material that is permeable to energy rays.
- the energy beam curable resin composition 118 is applied by the coating device 117 onto the substrate 1 that passes under the coating device 117.
- the substrate 1 coated with the energy ray curable resin composition 118 is carried into the gap between the rotating emboss belt 133 and the flat belt 136 from the rolls 131 and 134 side.
- the transfer surface of the emboss belt 133 and the energy ray curable resin composition 118 are in close contact with each other.
- the energy ray curable resin composition 118 is irradiated via the embossed belt 133 with the energy rays emitted from the energy ray source 110 while maintaining this close contact state.
- the energy beam curable resin composition 118 is cured, and the shape layer 2 is formed on the substrate 1.
- the embossed belt 133 is peeled from the shape layer 2. Thereby, the target laminated body is obtained.
- FIG. 10A is a plan view illustrating an example of a configuration of a stacked body according to the fourth embodiment of the present technology.
- 10B is an enlarged plan view illustrating a part of the stacked body illustrated in FIG. 10A.
- the laminated body according to the fourth embodiment is different from the laminated body according to the first embodiment in that the structures 21 are arranged on a meandering track (hereinafter referred to as a wobble track).
- the wobbles of the tracks on the base 1 are preferably synchronized. That is, the wobble is preferably a synchronized wobble.
- the unit lattice shape such as a hexagonal lattice or a quasi-hexagonal lattice can be maintained, and the filling rate can be kept high.
- the wobble track waveform include a sine wave and a triangular wave, but are not limited thereto.
- the wobble track waveform is not limited to a periodic waveform, and may be a non-periodic waveform.
- the fourth embodiment is the same as the first embodiment except for the above.
- FIG. 11A is a cross-sectional view illustrating an example of a configuration of a stacked body according to the fifth embodiment of the present technology.
- FIG. 11B is an enlarged plan view illustrating a part of the stacked body illustrated in FIG. 11A.
- FIG. 11C is a cross-sectional view of the stacked body illustrated in FIG. 11B.
- the laminated body according to the fourth embodiment is different from the first embodiment in that a plurality of structures 21 are two-dimensionally arranged randomly (irregularly). Further, the size and / or height of the structure 21 may be changed randomly.
- the fifth embodiment is the same as the first embodiment except for the above.
- FIG. 12 is a perspective view illustrating an example of a configuration of a stacked body according to the sixth embodiment of the present technology.
- the laminate according to the sixth embodiment has a columnar structure 21 that extends in one direction on the surface of the substrate, and the structure 21 is arranged one-dimensionally on the substrate 1. This is different from that of the first embodiment.
- Examples of the cross-sectional shape of the structure 21 include a triangular shape, a triangular shape with a curvature R at the top, a polygonal shape, a semicircular shape, a semi-elliptical shape, a parabolic shape, and a toroidal shape, but are particularly limited. It is not something. Further, the structure 21 may be extended in one direction while being wobbled.
- the sixth embodiment is the same as the first embodiment except for the above.
- FIG. 13A to 13E are cross-sectional views illustrating first to fifth examples of the base body provided in the multilayer body according to the seventh embodiment of the present technology.
- the laminated body according to the seventh embodiment is different from the laminated body according to the first embodiment in that a plurality of structures 21 are two-dimensionally arranged on both main surfaces of the substrate 1.
- each of the laminated bodies of the first to fifth examples is different from the first embodiment described above except that the plurality of structures 21 are two-dimensionally arranged on both main surfaces of the base 1. It is the same as that of the 1st-5th example of the laminated body which concerns on (refer FIG. 2).
- the laminate according to the seventh embodiment can be produced, for example, as follows. First, the energy ray-curable resin composition is applied to both sides of the substrate 1 having a belt shape while it is being conveyed. Next, the transfer surface of a rotating master (for example, a roll master or a belt master) disposed on both sides of the substrate 1 is brought into close contact with the energy ray curable resin composition, and energy rays are emitted from an energy ray source in the rotating master. Irradiate the energy ray curable resin composition. Thereby, the energy beam curable resin composition is cured and the structure 21 is formed. Two rotating masters may be arranged so as to face each other via the base 1, and the shape may be transferred to the energy beam curable resin composition while the base 1 is nipped between the two masters.
- the seventh embodiment is the same as the first embodiment except for the above.
- FIG. 14A is a cross-sectional view illustrating a first example of a base body included in a multilayer body according to an eighth embodiment of the present technology.
- FIG. 14B is a cross-sectional view illustrating a second example of the base body provided in the multilayer body according to the eighth embodiment of the present technology.
- the laminated body according to the eighth embodiment is different from the laminated body according to the first embodiment or the seventh embodiment in that the structure 21 is impermeable to energy rays. Yes.
- Such an impermeable structure 21 can be formed, for example, by adding a material such as a pigment that absorbs energy rays to the energy ray curable resin composition.
- other than the above is the same as in the first embodiment.
- the ninth embodiment has been devised based on the results of the following studies.
- the present engineers have used a linear bright line for an imaging optical system including a transflective mirror (optical element) 601 having a sub-wavelength structure formed on an incident surface and an imaging element 602.
- light L from a light source such as a bright spot enters the incident surface of the semi-transmissive mirror 601
- scattered light Ls is generated, and the generated scattered light Ls reaches the imaging region (light receiving region) of the image sensor 602. Then, it went to find out that the white scattered light Ls appears as a bright line noise in the image image
- the present engineers have intensively studied the cause of the generation of the scattered light Ls by the transflective mirror 601.
- the variation in the arrangement pitch Tp of the sub-wavelength structure is the cause of the generation of the scattered light Ls. That is, when a master is manufactured using a photolithography technique, the arrangement pitch Tp of the sub-wavelength structures 603 varies as shown in FIG. 15B due to a problem with the accuracy of the feed pitch during exposure.
- the arrangement pitch Tp varies as described above, a section in which the arrangement pitch Tp becomes larger than the ideal arrangement pitch Tp is generated.
- light L from a light source such as a bright spot is irradiated on such a section where the arrangement pitch Tp is large, scattered light Ls is generated.
- the present engineers have conducted intensive studies to suppress the generation of the bright line noise in consideration of the cause of the generation of the bright line noise described above.
- the component of the scattered light Ls reaching the imaging region is made smaller than the component of the scattered light Ls reaching the outside of the imaging region, thereby generating bright line noise. It came to discover that it can be suppressed.
- FIG. 16 is a schematic diagram illustrating an example of a configuration of an imaging device according to the ninth embodiment of the present technology.
- the imaging apparatus 300 according to the ninth embodiment is a so-called digital camera (digital still camera), and includes a housing 301, a lens barrel 303, a housing 301, and a lens barrel 303. And an imaging optical system 302 provided therein.
- the imaging optical system 302 includes a lens 311, an optical element 201 with an antireflection function, an imaging element 312, and an autofocus sensor 313.
- the housing 301 and the lens barrel 303 may be configured to be detachable.
- the lens 311 condenses the light L from the subject toward the image sensor 312.
- the optical element 201 with an antireflection function reflects part of the light L collected by the lens 311 toward the autofocus sensor 313, while transmitting the rest of the light L toward the image sensor 312.
- the imaging element 312 has a rectangular imaging area A 1 that receives light transmitted through the optical element 201 with an antireflection function, converts the light received in the imaging area A 1 into an electrical signal, and a signal processing circuit. Output to.
- the autofocus sensor 313 receives the light reflected by the optical element 201 with an antireflection function, converts the received light into an electrical signal, and outputs it to the control circuit.
- FIG. 17A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to a ninth embodiment of the present technology.
- FIG. 17B is an enlarged plan view showing a part of the optical element with an antireflection function shown in FIG. 17A.
- FIG. 17C is a cross-sectional view of the track T in FIG. 17B.
- the optical element 201 with an antireflection function includes a semi-transmissive mirror (element body) 202 having an incident surface and an output surface, and a plurality of structures 203 formed on the incident surface of the semi-transmissive mirror 202.
- the structure 203 and the transflective mirror 202 are formed separately or integrally.
- a base layer 204 may be further provided between the structure 203 and the semi-transmissive mirror 202 as necessary.
- the base layer 204 is a layer integrally formed with the structure 203 on the bottom surface side of the structure 203, and is formed by curing the same energy ray-curable resin composition as the structure 203.
- a shape layer 210 having an uneven shape is formed on the incident surface of the semi-transmissive mirror 202 by the structure 203.
- the shape layer 210 may further include a base layer 204 as necessary.
- the transflective mirror 202 and the structure 203 provided in the optical element 201 with an antireflection function will be described in order.
- the transflective mirror 202 is impermeable to energy rays (for example, ultraviolet rays) for curing the energy ray curable resin composition constituting the structure 203, for example.
- the transflective mirror 202 is a mirror that transmits part of incident light and reflects the rest.
- Examples of the shape of the transflective mirror 202 include a sheet shape and a plate shape, but are not particularly limited to these shapes.
- the sheet is defined as including a film.
- the structure 203 is a so-called sub-wavelength structure, for example, has a convex shape with respect to the incident surface of the semi-transmissive mirror 202 and is two-dimensionally arranged with respect to the incident surface of the semi-transmissive mirror 202. It is preferable that the structures 203 are periodically two-dimensionally arranged with a short arrangement pitch equal to or less than the wavelength band of light for the purpose of reducing reflection.
- the plurality of structures 203 have an arrangement form that forms a plurality of rows of tracks T on the surface of the transflective mirror 202.
- the track pitch Tp of the track T varies from track to track as shown in FIG. 17B due to problems during exposure in the master production process.
- the track refers to a portion where the structures 203 are connected in a row.
- As the shape of the track T a linear shape, an arc shape, or the like can be used, and the track T having these shapes may be wobbled (meandered). By wobbling the track T in this way, occurrence of unevenness in appearance can be suppressed.
- the wobble of each track T on the transflective mirror 202 is synchronized. That is, the wobble is preferably a synchronized wobble.
- the unit lattice shape of a hexagonal lattice or a quasi-hexagonal lattice can be maintained and the filling rate can be kept high.
- the waveform of the wobbled track T include a sine wave and a triangular wave.
- the waveform of the wobbled track T is not limited to a periodic waveform, and may be a non-periodic waveform.
- the wobble amplitude of the wobbled track T is selected to be about ⁇ 10 ⁇ m, for example.
- the surface of the transflective mirror 202 has one or more sections that scatter incident light from a light source such as a bright spot and generate scattered light.
- a light source such as a bright spot
- the track pitch Tp changes and becomes larger than the reference track pitch Tp.
- Such a section is generated due to a problem during exposure in the master production process, and it is difficult to suppress the generation of the section to a level at which generation of bright line noise is eliminated or a concern.
- the structure 203 is disposed at a position shifted by a half pitch between two adjacent tracks T, for example. Specifically, between two adjacent tracks T, the structure of the other track (eg, T2) is positioned at an intermediate position (position shifted by a half pitch) of the structure 203 arranged on one track (eg, T1). 203 is arranged. As a result, as shown in FIG. 17B, a hexagonal lattice pattern or a quasi-hexagonal lattice pattern in which the center of the structure 203 is located at each point a1 to a7 between adjacent three rows of tracks (T1 to T3) is formed. The structure 203 is disposed on the surface.
- the direction in which the rows of structures extend is the track direction (column direction) a
- the direction perpendicular to the track direction a in the plane of the transflective mirror 202 is the inter-track direction ( Column direction) b.
- the hexagonal lattice means a regular hexagonal lattice.
- the quasi-hexagonal lattice means a distorted regular hexagonal lattice unlike a regular hexagonal lattice.
- the quasi-hexagonal lattice means a hexagonal lattice obtained by stretching a regular hexagonal lattice in the linear arrangement direction (track direction). .
- the quasi-hexagonal lattice is a hexagonal lattice in which a regular hexagonal lattice is distorted by the meandering arrangement of the structures 203, or a regular hexagonal lattice is a linear shape.
- the arrangement pitch P1 (for example, the distance between a1 and a2) of the structures 203 in the same track is adjacent.
- the arrangement pitch of the structures 203 between the two tracks that is, the arrangement pitch P2 of the structures 203 in the ⁇ ⁇ direction (for example, the distance between a1 to a7 and a2 to a7) is longer than the track extending direction. Preferably it is.
- Specific shapes of the structure 203 include, for example, a cone shape, a column shape, a needle shape, a hemispherical shape, a semi-ellipsoidal shape, a polygonal shape, and the like, but are not limited to these shapes, Other shapes may be employed.
- Examples of the cone shape include a cone shape with a sharp top, a cone shape with a flat top, and a cone shape with a convex or concave curved surface at the top, but are not limited to these shapes. is not.
- Examples of the cone shape having a convex curved surface at the top include a quadric surface shape such as a parabolic shape. Further, the cone-shaped cone surface may be curved concavely or convexly.
- the shape of the structure 203 is an elliptical cone shape having a convex curved surface at the top, or an elliptical truncated cone with a flat top. It is preferable to adopt the shape and make the major axis direction of the ellipse forming the bottom surface thereof coincide with the extending direction of the track T.
- a cone shape having a gentle top slope and a gradually steep slope from the center to the bottom is preferable.
- the central portion has a steeper cone shape than the bottom and the top portion, or as shown in FIG. 18C, the top portion has a flat cone shape.
- a body shape is preferred.
- the structure 203 preferably has a curved surface portion 203a whose height gradually decreases from the top toward the bottom at the peripheral edge of the bottom. This is because, in the manufacturing process of the optical element 201 with antireflection function, the optical element 201 with antireflection function can be easily peeled from the master or the like.
- the curved surface portion 203a may be provided only on a part of the peripheral portion of the structure 203, but it is preferable to provide the curved portion 203a on the entire peripheral portion of the structure 203 from the viewpoint of improving the peeling characteristics.
- the protruding portion 205 is preferably provided between adjacent structures 203 as shown in FIGS. 18A to 18C.
- the elongated protrusion 205 may be provided on the entire periphery of the structure 203 or a part thereof.
- the elongated protrusion 205 may extend from the top of the structure 203 toward the lower portion, but is not limited thereto.
- Examples of the shape of the protruding portion 205 include a triangular cross section and a quadrangular cross section. However, the shape is not particularly limited to these shapes, and can be selected in consideration of ease of molding. Further, a part or all of the surface around the structure 203 may be roughened to form fine irregularities. Specifically, for example, the surface between adjacent structures 203 may be roughened to form fine irregularities. Further, a minute hole may be formed on the surface of the structure 203, for example, the top.
- each structure 203 has the same size, shape, and height.
- the shape of the structure 203 is not limited to this, and two structures 203 are formed on the substrate surface.
- a structure 203 having a size, shape, and height greater than or equal to that of the seed may be formed.
- the structures 203 are regularly (periodically) two-dimensionally arranged with a short arrangement pitch equal to or less than the wavelength band of light for the purpose of reducing reflection, for example.
- a two-dimensional wavefront may be formed on the surface of the semi-transmissive mirror 202 by two-dimensionally arranging the plurality of structures 203.
- the arrangement pitch means the arrangement pitch P1 and the arrangement pitch P2.
- the wavelength band of light for the purpose of reducing reflection is, for example, the wavelength band of ultraviolet light, the wavelength band of visible light, or the wavelength band of infrared light.
- the wavelength band of ultraviolet light is a wavelength band of 10 nm to 360 nm
- the wavelength band of visible light is a wavelength band of 360 nm to 830 nm
- the wavelength band of infrared light is a wavelength band of 830 nm to 1 mm.
- the arrangement pitch is preferably 175 nm or more and 350 nm or less. If the arrangement pitch is less than 175 nm, the structure 203 tends to be difficult to manufacture. On the other hand, when the arrangement pitch exceeds 350 nm, visible light tends to be diffracted.
- the height H1 of the structures 203 in the track extending direction is preferably smaller than the height H2 of the structures 203 in the row direction. That is, it is preferable that the heights H1 and H2 of the structure 203 satisfy the relationship of H1 ⁇ H2. If the structures 203 are arranged so as to satisfy the relationship of H1 ⁇ H2, it is necessary to increase the arrangement pitch P1 in the track extending direction, so that the filling rate of the structures 203 in the track extending direction decreases. is there. Thus, when the filling rate is lowered, the reflection characteristics are lowered.
- the height of the structure 203 is not particularly limited, and is appropriately set according to the wavelength region of light to be transmitted.
- the height is 236 nm to 450 nm, preferably 415 nm to 421 nm.
- the aspect ratio (height / arrangement pitch) of the structure 203 is preferably set in the range of 0.81 to 1.46, more preferably in the range of 0.94 to 1.28. If it is less than 0.81, the reflection characteristics and the transmission characteristics tend to be reduced, and if it exceeds 1.46, the peeling characteristics are lowered when the structure 203 is formed, and replicas tend not to be reproduced neatly. It is. Further, the aspect ratio of the structure 203 is preferably set in a range of 0.94 or more and 1.46 or less from the viewpoint of further improving reflection characteristics. The aspect ratio of the structure 203 is preferably set in the range of 0.81 to 1.28 from the viewpoint of further improving the transmission characteristics.
- the height distribution means that the structures 203 having two or more kinds of heights are provided on the surface of the transflective mirror 202.
- a structure 203 having a reference height and a structure 203 having a height different from the structure 203 may be provided on the surface of the transflective mirror 202.
- the structure 203 having a height different from the reference is provided, for example, periodically or non-periodically (randomly) on the surface of the semi-transmissive mirror 202.
- the direction of the periodicity for example, a track extending direction, a column direction, and the like can be given.
- the aspect ratio is defined by the following formula (1).
- Aspect ratio H / Pm (1)
- H height of the structure
- Pm average arrangement pitch (average period)
- the average arrangement pitch Pm is defined by the following equation (2).
- Average arrangement pitch Pm (P1 + P2 + P2) / 3 (2)
- P1 Arrangement pitch in the track extending direction (track extending direction cycle)
- the height H of the structures 203 is the height of the structures 203 in the column direction.
- the height of the structure 203 in the track extending direction (X direction) is smaller than the height in the column direction (Y direction), and the height of the structure 203 other than the track extending direction is the height in the column direction. Therefore, the height of the sub-wavelength structure is represented by the height in the column direction.
- the height H of the structure in the above formula (1) is the depth H of the structure.
- the ratio P1 / P2 is 1.00 ⁇ P1 / P2 ⁇ 1.1, Or it is preferable to satisfy
- fill the relationship of 1.00 ⁇ P1 / P2 ⁇ 1.1.
- the filling rate of the structures 203 on the substrate surface is within a range of 65% or more, preferably 73% or more, more preferably 86% or more, with 100% as the upper limit. By setting the filling rate within such a range, the antireflection characteristics can be improved. In order to improve the filling rate, it is preferable to impart distortion to the structures 203 by bonding or overlapping the lower portions of the adjacent structures 203 or adjusting the ellipticity of the bottom surface of the structures.
- the above-described filling rate calculation process is performed on 10 unit cells randomly selected from the taken SEM photographs. Then, the measured values are simply averaged (arithmetic average) to obtain the average filling rate, which is used as the filling rate of the structures 203 on the substrate surface.
- the filling rate when the structures 203 overlap or when there is a substructure such as the protrusion 205 between the structures 203 corresponds to a height corresponding to 5% of the height of the structures 203.
- the filling rate can be obtained by a method of determining the area ratio using as a threshold value.
- the structures 203 are connected so that their lower portions overlap each other. Specifically, a part or all of the lower portions of the adjacent structures 203 are preferably overlapped, and preferably overlapped in the track direction, the ⁇ direction, or both directions. Thus, the filling rate of the structures 203 can be improved by overlapping the lower portions of the structures 203. It is preferable that the structures overlap with each other at a portion equal to or less than 1 ⁇ 4 of the maximum value of the wavelength band of the light in the use environment with the optical path length considering the refractive index. This is because excellent antireflection characteristics can be obtained.
- the ratio of the diameter 2r to the arrangement pitch P1 ((2r / P1) ⁇ 100) is 85% or more, preferably 90% or more, more preferably 95% or more. This is because the filling rate of the structures 203 can be improved and the antireflection characteristics can be improved by setting the amount within such a range. If the ratio ((2r / P1) ⁇ 100) increases and the overlap of the structures 203 becomes too large, the antireflection characteristics tend to decrease. Therefore, the ratio ((2r / P1) ⁇ 100) is set so that the structures are joined at a portion of the optical path length considering the refractive index and not more than 1 ⁇ 4 of the maximum value of the wavelength band of the light in the usage environment. It is preferable to set an upper limit value.
- the arrangement pitch P1 is the arrangement pitch of the structures 203 in the track direction
- the diameter 2r is the diameter of the bottom surface of the structures in the track direction as shown in FIG. 17B.
- the diameter 2r is a diameter
- the diameter 2r is a long diameter.
- FIG. 19A is a schematic diagram illustrating a part of the imaging optical system illustrated in FIG. 16 in an enlarged manner.
- Figure 20A is a schematic diagram beam L 0 is viewed from the incident side of the imaging optical system shown in FIG. 19A.
- FIG. 20B is an enlarged view illustrating a part of the optical element with an antireflection function included in the imaging optical system illustrated in FIG. 20A.
- a light beam L 0 represents a principal light beam from the subject
- a light beam L min represents a light beam having the smallest incident angle with respect to the optical element 201 with antireflection function
- a light beam L max represents the optical element 201 with antireflection function. It represents a light beam having the largest incident angle.
- the rectangular X-axis direction parallel to the longitudinal sides of the imaging region A 1, the direction parallel to the short side is defined as a Y-axis direction.
- the Z-axis direction is defined in a direction perpendicular to the imaging surface of the imaging element 312.
- the incident surface of the optical element 201 with an antireflection function has one or more sections that scatter incident light and generate scattered light Ls.
- the sum of the components reaching the imaging area A 1 of the scattered light Ls is preferably smaller than the sum of the components reaching the area A 2 of the outer imaging region.
- the maximum value of the intensity distribution of the scattered light Ls in the imaging region A 1 is less than the maximum value of the intensity distribution of the scattered light Ls in the outer area A 2 of the imaging region A 1 Is preferred.
- the scattered light Ls hardly spreads in the X-axis direction and reaches a plane including the imaging surface of the imaging element 312. Therefore, the intensity distribution of the scattered light Ls mainly changes only in the Y-axis direction. That is, the intensity distribution of the scattered light Ls differs between the X-axis direction and the Y-axis direction and has anisotropy.
- the intensity distribution means an intensity distribution in the Y-axis direction.
- the ratio (Ib / Ia) of the total intensity Ib of the scattered light Ls scattered by the surface of the optical element 201 with antireflection function to the total intensity Ia of incident light incident on the surface of the optical element 201 with antireflection function is , Preferably less than 1/500, more preferably 1/5000 or less, and still more preferably 1/10 5 or less.
- the ratio (Ib / Ia) is set to less than 1/500, it is possible to suppress the generation of linear bright line noise.
- FIG. 19B is a schematic diagram for explaining the definition of the numerical aperture NA of the imaging optical system shown in FIG. 19A.
- the optical axes of the optical element 201 with antireflection function and the imaging element 312 are the optical axis l, and the direction of the scattered light Ls scattered on the incident surface of the optical element 201 with antireflection function is scattered.
- the angle formed by the direction s, the direction of the optical axis l, and the direction of the scattered light Ls is an angle ⁇
- the numerical aperture NA is nsin ⁇ (n: a medium (for example, air) between the optical element 201 with an antireflection function and the image sensor 312) Of the refractive index).
- the intensity distribution of the scattered light Ls having anisotropy varies depending on the numerical aperture NA.
- the intensity per unit solid angle of the intensity distribution of scattered light is preferably smaller in the range of numerical aperture NA ⁇ 0.8 than in the range of numerical aperture NA> 0.8. This is because it is possible to reduce the amount of scattered light Ls reaching the imaging area A 1 of the imaging device 312.
- the imaging area A 1 is, for example, two sets of opposed sides, i.e. has a rectangular shape having a pair of short sides and a pair of long sides.
- the track direction a of the structure 203 is parallel to the extending direction (X-axis direction) of the long side which is one of the two sets of sides. Accordingly, toward the extending direction of the narrow short side width of the imaging region A 1 (Y-axis direction), it is possible to scatter the scattered light Ls away from the optical axis l, imaging region of the imaging element 312 it is possible to reduce the amount of scattered light Ls reaching the a 1.
- the track direction a of the structure 203 if the extending direction of the long side of the imaging area A 1 and (X-axis direction) has a parallel relationship, as shown in FIG. 20B, (a) Structure It is preferable that the body 203 is a cone having an elliptical bottom surface having a major axis and a minor axis, and (b) the direction of the major axis of the bottom surface coincides with the track direction a. (A) The structure 203 is a cone having an elliptical bottom surface having a major axis and a minor axis, so that the track pitch Tp is smaller than when the bottom surface of the structure 203 is a circular bottom surface. Can be narrowed.
- the light beam L 0 from a light source such as a bright spot can be scattered further away from the optical axis l.
- a narrow light beam L 0 from a light source such as a bright point of the width of the imaging region A 1 short side of the extending direction (Y Can be scattered in the axial direction.
- the light beam L 0 from the light source such as a bright spot is emitted from the optical axis 1 toward the Y-axis direction, and the bottom surface of the structure 203 is circular. As compared with the case of the bottom surface, it can be scattered away. Therefore, it is possible to further reduce the amount of scattered light Ls reaching the imaging area A 1 of the imaging device 312.
- FIG. 21A is a perspective view illustrating an example of a configuration of a roll master.
- FIG. 21B is an enlarged plan view showing a part of the roll master shown in FIG. 21A.
- FIG. 21C is a cross-sectional view of the track T in FIG. 21B.
- the roll master 211 is a master for forming a plurality of structures 203 on the surface of the base described above.
- the roll master 211 has, for example, a columnar or cylindrical shape, and the columnar surface or cylindrical surface is a molding surface (rotation surface) for molding the plurality of structures 203 on the surface of the base.
- a plurality of structures 212 are two-dimensionally arranged on the molding surface.
- the structure 212 has, for example, a concave shape with respect to the molding surface.
- glass can be used, but it is not particularly limited to this material.
- the plurality of structures 212 arranged on the molding surface of the roll master 211 and the plurality of structures 203 arranged on the surface of the above-described transflective mirror 202 have an inverted concavo-convex relationship. That is, the shape, arrangement, arrangement pitch, and the like of the structure 212 of the roll master 211 are the same as those of the structure 203 of the semi-transmissive mirror 202.
- the energy ray curable resin composition applied to the surface of the semi-transmissive mirror (element main body) 202 is radiated from an energy ray source provided on the inner side of the molding surface while the molding surface of the roll master 211 is rotationally adhered to the surface.
- an optical element 201 with an antireflection function having a plurality of structures 203 provided on the surface is obtained.
- the roll master 211 is configured to transmit energy rays.
- the molding surface provided with a plurality of structures (for example, sub-wavelength structures) 212 has a section that scatters incident light and generates scattered light. It is preferable that the intensity distribution of the scattered light has anisotropy.
- the manufacturing method of the optical element 201 with an antireflection function according to the ninth embodiment of the present technology is the same as that of the first embodiment described above except that the plurality of structures 203 are formed on the surface of the transflective mirror 202. It is the same.
- FIG. 22A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to the tenth embodiment of the present technology.
- FIG. 22B is an enlarged plan view showing a part of the optical element with an antireflection function shown in FIG. 22A.
- 22C is a cross-sectional view taken along track T in FIG. 22B.
- the optical element 201 with antireflection function according to the tenth embodiment is the ninth in that the plurality of structures 203 form a tetragonal lattice pattern or a quasi-tetragonal lattice pattern between adjacent three rows of tracks T. It differs from that of the embodiment.
- the tetragonal lattice means a regular tetragonal lattice.
- a quasi-tetragonal lattice means a distorted regular tetragonal lattice unlike a regular tetragonal lattice.
- the quasi-tetragonal lattice means a tetragonal lattice in which a regular tetragonal lattice is stretched and distorted in a linear arrangement direction (track direction). .
- the quasi-tetragonal lattice means a tetragonal lattice in which a regular tetragonal lattice is distorted by the meandering arrangement of the structures 203.
- it refers to a tetragonal lattice in which a regular tetragonal lattice is stretched and distorted in a linear arrangement direction (track direction) and is distorted by a meandering arrangement of the structures 203.
- the arrangement pitch P1 of the structures 203 in the same track is preferably longer than the arrangement pitch P2 of the structures 203 between two adjacent tracks. Further, when the arrangement pitch of the structures 203 in the same track is P1, and the arrangement pitch of the structures 203 between two adjacent tracks is P2, P1 / P2 is 1.4 ⁇ P1 / P2 ⁇ 1.5. It is preferable to satisfy the relationship. By setting the numerical value in such a range, the filling rate of the structures 203 having an elliptical cone or an elliptical truncated cone shape can be improved, and thus the antireflection characteristics can be improved.
- the height or depth of the structure 203 in the 45-degree direction or about 45-degree direction with respect to the track is preferably smaller than the height or depth of the structure 203 in the track extending direction.
- the height H2 in the arrangement direction ( ⁇ direction) of the structures 203 that are inclined with respect to the track extending direction is smaller than the height H1 of the structures 203 in the track extending direction. That is, it is preferable that the heights H1 and H2 of the structure 203 satisfy the relationship of H1> H2.
- the ellipticity e of the bottom surface of the structure body is preferably 140% ⁇ e ⁇ 180%. This is because, within this range, the filling rate of the structures 203 can be improved and excellent antireflection characteristics can be obtained.
- the filling rate of the structures 203 on the substrate surface is within a range of 65% or more, preferably 73% or more, more preferably 86% or more, with 100% as the upper limit. By setting the filling rate within such a range, the antireflection characteristics can be improved.
- the filling rate (average filling rate) of the structures 203 is a value obtained as follows. First, the surface of the optical element 201 with an antireflection function is photographed with a top view using a scanning electron microscope (SEM). Next, a unit cell Uc is randomly selected from the photographed SEM photograph, and the arrangement pitch P1 and the track pitch Tp of the unit cell Uc are measured (see FIG. 22B). In addition, the area S of the bottom surface of any of the four structures 203 included in the unit cell Uc is measured by image processing. Next, using the measured arrangement pitch P1, track pitch Tp, and bottom surface area S, the filling rate is obtained from the following equation (4).
- the above-described filling rate calculation process is performed on 10 unit cells randomly selected from the taken SEM photographs. Then, the measured values are simply averaged (arithmetic average) to obtain the average filling rate, which is used as the filling rate of the structures 203 on the substrate surface.
- the ratio of the diameter 2r to the arrangement pitch P1 ((2r / P1) ⁇ 100) is 64% or more, preferably 69% or more, more preferably 73% or more. This is because the filling rate of the structures 203 can be improved and the antireflection characteristics can be improved by setting the amount within such a range.
- the arrangement pitch P1 is the arrangement pitch of the structures 203 in the track direction
- the diameter 2r is the diameter of the bottom surface of the structure in the track direction.
- the diameter 2r is a diameter
- the diameter 2r is a long diameter.
- FIG. 23A is a plan view illustrating an example of a configuration of an optical element with an antireflection function according to an eleventh embodiment of the present technology.
- FIG. 23B is an enlarged plan view showing a part of the optical element with an antireflection function shown in FIG. 23A.
- 23C is a cross-sectional view taken along track T in FIG. 23B.
- the optical element 201 with an antireflection function according to the eleventh embodiment is different from that of the ninth embodiment in that a large number of structures 203 that are concave portions are arranged on the surface of the substrate.
- the shape of the structure 203 is a concave shape obtained by inverting the convex shape of the structure 203 in the ninth embodiment.
- the opening of the concave structure 203 is the lower part, and the lowest part of the transflective mirror 202 in the depth direction (the deepest part of the recess). Part) is defined as the top. That is, the top portion and the lower portion are defined by the structure 203 that is an intangible space.
- the height H of the structure 203 in Expression (1) and the like is the depth H of the structure 203.
- the eleventh embodiment is the same as the ninth embodiment except for the above.
- the imaging device according to the twelfth embodiment of the present technology is the same as the ninth embodiment except for the arrangement form of the structures 203 formed on the surface of the optical element with an antireflection function. Therefore, below, the arrangement
- FIG. 24A is an enlarged plan view illustrating a part of the surface of the optical element with an antireflection function according to the twelfth embodiment of the present technology.
- the center positions ⁇ of the plurality of structures 203 vary in the inter-track direction (inter-row direction) b with respect to the virtual track Ti.
- a light source such as a bright spot
- the center position ⁇ of the structure 203 by changing the center position ⁇ of the structure 203, light from a light source such as a bright spot can be spread two-dimensionally and diffused. Therefore, generation of bright line noise with respect to the captured image can be suppressed.
- the variation of the center position ⁇ of the structure 203 is, for example, regular or irregular, and is preferably irregular from the viewpoint of reducing the occurrence of bright line noise on the captured image. Further, from the viewpoint of improving the filling rate of the structures 203, it is preferable to synchronize the direction of fluctuation between the virtual tracks Ti as in the section D shown in FIG. 24A.
- FIG. 24B is a schematic diagram for explaining the definition of the virtual track Ti.
- the virtual track Ti is a virtual track obtained from the average position of the center position ⁇ of the structure 203.
- the virtual track Ti can be obtained as follows. First, the surface of the optical element with an antireflection function is photographed with a top view using a scanning electron microscope (SEM). Next, one column of the structures 203 for obtaining the virtual track Ti is selected from the photographed SEM photograph. Next, ten structures 203 are randomly selected from the selected columns.
- SEM scanning electron microscope
- FIG. 25A is a schematic diagram for explaining the fluctuation range of the center position of the structure.
- the maximum value of the fluctuation width ⁇ Tp of the track pitch Tp is ⁇ Tp max
- the fluctuation width ⁇ A of the center position ⁇ of the structure 203 is preferably larger than ⁇ Tp max .
- the variation width ⁇ A of the center position ⁇ of the structure 203 is a variation width based on the virtual track Ti.
- the maximum fluctuation range ⁇ Tp max of the track pitch Tp can be obtained as follows. First, the surface of the optical element with an antireflection function is photographed with a top view using an SEM. Next, one set of columns of adjacent structures 203 is selected from the photographed SEM photograph. Next, a virtual track Ti is obtained for each column of the selected set of structures 203. Next, the track pitch Tp between the obtained virtual tracks Ti is obtained. The above-described processing for obtaining the track pitch Tp is performed at 10 points randomly selected from the photographed SEM photographs. Then, the average track pitch Tpm is obtained by simply averaging (arithmetic average) the track pitches Tp obtained at 10 locations.
- ) of the difference between the average track pitch Tpm obtained as described above and the track pitch Tp is obtained and set as a variation width ⁇ Tp of the track pitch Tp.
- the variation width ⁇ Tp of the large number of track pitches Tp as described above is obtained, and the maximum value is selected from these, and the maximum variation width ⁇ Tp max is set.
- FIG. 25B is a schematic diagram for explaining the variation ratio of the structure.
- the center position ⁇ of the structures 203 varies in the track-to-track direction b with such a frequency that generation of linear bright line noise can be suppressed. It is preferable.
- it is.
- FIG. 26A is a schematic diagram illustrating a first example of an arrangement form of structures.
- the center position ⁇ of the structure 203 is changed so as to meander.
- the center position ⁇ of the structure 203 is disposed on a wobbled (meandering) track (hereinafter referred to as a wobble track) Tw.
- Each wobble track Tw is preferably synchronized.
- a unit lattice shape such as a (quasi) tetragonal lattice shape or a (quasi) hexagonal lattice shape can be maintained and the filling rate can be kept high.
- Examples of the waveform of the wobble track Tw include a sine wave and a triangular wave, but are not limited thereto.
- the period T and the amplitude A of the wobble track Tw can be regular or irregular. From the viewpoint of reducing the generation of the linear bright line noise, as shown in FIG. It is preferable to make at least one irregular, and it is more preferable to make both irregular. Note that the variation of the amplitude A of the wobble track Tw is not limited to a cycle unit, and the amplitude A may vary within one cycle.
- FIG. 26C is a schematic diagram illustrating a second example of the arrangement form of the structures.
- the center position ⁇ of each structure 203 is independently changed in the inter-track direction b with the virtual track Ti as a reference.
- a block (structure group) B is configured by a predetermined number of structures 203 adjacent to each other in the track direction a.
- the position ⁇ may be varied.
- the variation of the center position ⁇ of the structure 203 can be regular or irregular, and is preferably irregular from the viewpoint of reducing the generation of the linear bright line noise.
- FIG. 26C shows an example in which two arrangement forms indicated by the sections S1 and S2 are mixed in one column. However, these arrangement forms do not necessarily need to be used in combination.
- the surface of the optical element with an antireflection function may be formed using this arrangement form.
- a ratio (Ib / Ia) of the total intensity Ib of scattered light Ls scattered by the surface of the optical element with antireflection function to the total intensity Ia of incident light incident on the surface of the optical element with antireflection function is preferable. Is less than 1/500, more preferably 1/5000 or less, and still more preferably 1/10 5 or less. By setting the ratio (Ib / Ia) to less than 1/500, it is possible to suppress the generation of linear bright line noise.
- FIG. 27A is an enlarged plan view illustrating a part of the surface of the optical element with an antireflection function according to the thirteenth embodiment of the present technology. As shown in FIG. 27A, the thirteenth embodiment differs from the twelfth embodiment in that the arrangement pitch P of the structures 203 in the same track varies with respect to the average arrangement pitch Pm. Yes.
- FIG. 27B is a schematic diagram for explaining the fluctuation range of the arrangement pitch P of the structures.
- the variation width ⁇ P of the arrangement pitch P is preferably larger than ⁇ Tp max .
- the variation width ⁇ P of the arrangement pitch P is a fluctuation width based on the average arrangement pitch Pm.
- the average arrangement pitch Pm can be obtained as follows. First, the surface of the optical element with an antireflection function is photographed with a top view using an SEM. Next, one track T is randomly selected from the photographed SEM photograph. Next, one set of two adjacent structures 203 is randomly selected from the plurality of structures 203 arranged on the selected track T, and the arrangement pitch P in the track direction a is obtained. The processing for obtaining the arrangement pitch P described above is performed at 10 locations randomly selected from the taken SEM photographs. Then, the arrangement pitch P obtained at 10 locations is simply averaged (arithmetic average) to obtain the average arrangement pitch Pm.
- FIG. 28 is a schematic diagram illustrating an example of a configuration of an imaging device according to a fourteenth embodiment of the present technology.
- the imaging apparatus 401 according to the fourteenth embodiment is a so-called digital video camera, and includes a first lens group L1, a second lens group L2, a third lens group L3, and a fourth lens group L4.
- the first lens group L1, the second lens group L2, the third lens group L3, the fourth lens group L4, the solid-state imaging device 402, the low-pass filter 403, the filter 404, the iris blade 406, and the electric light control device 407 constitutes an imaging optical system.
- the iris blade 406 and the electric dimmer 407 constitute an optical adjustment device.
- the first lens group L1 and the third lens group L3 are fixed lenses.
- the second lens group L2 is a zoom lens.
- the fourth lens group is a focusing lens.
- the solid-state image sensor 402 converts the incident light into an electrical signal and supplies it to a signal processing unit (not shown).
- the solid-state imaging element 402 is, for example, a CCD (Charge Coupled Device).
- the low-pass filter 403 is provided on the front surface of the solid-state image sensor 402, for example.
- the low-pass filter 403 is for suppressing a false signal (moire) generated when a striped pattern image or the like close to the pixel pitch is photographed, and is made of, for example, an artificial crystal.
- the filter 404 cuts the infrared region of light incident on the solid-state image sensor 402, suppresses the floating of the spectrum in the near infrared region (630 nm to 700 nm), and reduces the light intensity in the visible region (400 nm to 700 nm). It is for doing so.
- the filter 404 includes, for example, an infrared light cut filter (hereinafter referred to as an IR cut filter) 404a and an IR cut coat layer 404b formed by laminating an IR cut coat on the IR cut filter 404a.
- the IR cut coat layer 404b is formed, for example, on at least one of the subject-side surface of the IR cut filter 404a and the surface of the IR cut filter 404a on the solid-state imaging device 402 side.
- FIG. 28 shows an example in which an IR cut coat layer 404b is formed on the subject side surface of the IR cut filter 404a.
- the motor 405 moves the lens fourth group L4 based on a control signal supplied from a control unit (not shown).
- the iris blade 406 is for adjusting the amount of light incident on the solid-state image sensor 402 and is driven by a motor (not shown).
- the electric light control element 407 is for adjusting the amount of light incident on the solid-state image sensor 402.
- the electric light control element 407 is an electric light control element made of a liquid crystal containing at least a dye-based pigment, for example, an electric light control element made of a dichroic GH liquid crystal.
- a plurality of structures are formed on the surface of an element or an optical element group (hereinafter referred to as an optical unit).
- the structure, shape, arrangement, and the like of these structures can be the same as, for example, any of the first to thirteenth aspects described above.
- a plurality of structures are provided on the surface of the filter 404 or the third lens group L3 that are provided apart from the front side (subject side) of the solid-state imaging element 402.
- the structure, the shape, the arrangement form, and the like of these structures are the same as those in any of the first to thirteenth aspects described above.
- the configuration, shape, and arrangement of these structures are preferably the same as those in the fourth or thirteenth described above.
- the configuration, shape, and arrangement of the structures are the above-described fourth or It is preferable to be the same as the thirteenth one.
- FIG. 29 is a schematic diagram illustrating an example of a configuration of an imaging device according to a fifteenth embodiment of the present technology.
- the imaging apparatus 300 according to the fifteenth embodiment is different from the ninth embodiment in that it further includes a light amount adjustment apparatus 314.
- FIG. 29 an example in which the light amount adjusting device 314 is provided in the lens barrel 303 is shown, but the position where the light amount adjusting device 314 is provided is not limited to this example, and the housing that is the imaging device main body 301 may be provided with a light amount adjusting device 314.
- the light amount adjustment device 314 is a diaphragm device that adjusts the size of the diaphragm aperture around the optical axis of the imaging optical system 302.
- the light amount adjusting device 314 includes, for example, a pair of diaphragm blades and an ND filter that reduces the amount of transmitted light.
- a driving method of the light amount adjusting device 314 for example, a method of driving a pair of diaphragm blades and an ND filter by one actuator, and a method of driving a pair of diaphragm blades and an ND filter by two independent actuators are used. However, it is not particularly limited to these methods.
- ND filter a filter having a single transmittance or density or a filter whose transmittance or density changes in a gradation can be used. Further, the number of ND filters is not limited to one, and a plurality of ND filters may be stacked and used.
- FIG. 30A is a cross-sectional view illustrating an example of the configuration of an ND filter.
- an ND filter 501 is an ND filter with antireflection function (an optical element with antireflection function), and includes an ND filter main body (element main body) 502 having an incident surface and an output surface, and an ND filter main body. And a plurality of sub-wavelength structures 503 provided on the incident surface 502. From the viewpoint of improving the transmission characteristics of the ND filter main body 502, it is preferable to provide a plurality of sub-wavelength structures 503 on both the incident surface and the output surface.
- the ND filter 501 has a film shape, for example.
- the sub-wavelength structure 503 and the ND filter body 502 are formed separately or integrally.
- a base layer 504 may be further provided between the sub-wavelength structure 503 and the ND filter main body 502 as necessary.
- the base layer 504 is a layer integrally formed with the sub-wavelength structure 503 on the bottom surface side of the sub-wavelength structure 503, and is formed by curing the same energy ray curable resin composition as the sub-wavelength structure 503.
- the ND filter main body 502 and the sub-wavelength structure 503 included in the ND filter 501 will be sequentially described.
- ND filter body As the ND filter main body 502, a substrate such as a film containing a dye and / or a pigment can be used.
- the ND filter body 502 having such a configuration can be formed, for example, by kneading a dye and / or a pigment in a resin material.
- the dye is not particularly limited as long as it is a dye having absorption in the visible light region.
- Anthraquinone type or diimonium salt type may be mentioned.
- the pigment include at least one inorganic particle selected from carbon black, metal oxide, metal nitride, and metal nitride oxide. Specific examples of such inorganic particles include black pigments such as carbon particles, black titanium oxide, ivory black, peach black, lamp black, bitumen, and aniline black.
- the ND filter main body 502 may be configured to include a base 511 and an ND layer 512 containing a dye and / or a pigment provided on the surface of the base 511.
- the ND layer 512 can have not only a single layer structure but also a stacked structure in which a plurality of ND layers are stacked.
- the substrate 511 a transparent substrate can be used, but the substrate is not limited to this, and a substrate containing a dye and / or a pigment may be used.
- a laminated film in which a plurality of inorganic films 513 1 , 513 2 ,..., 513 n are laminated on the surface of the base 511 may be used as the ND layer 512.
- the laminated film for example, a metal film, a metal oxide, a dielectric film, or the like can be used.
- a configuration in which a layer 514 containing a dye and / or pigment is sandwiched between a plurality of films 515 and 516 may be adopted as the configuration of the ND filter main body 502.
- the sub-wavelength structure 503 is the same as the structure 203 in the ninth embodiment described above.
- the light amount adjusting device described in the fifteenth embodiment may be used as the light amount adjusting device of the imaging apparatus according to the fourteenth embodiment.
- a filter 315 may be provided on the light incident side surface of the lens barrel 303, that is, the subject side surface.
- the filter 315 is configured to be detachable from the lens barrel 303.
- Filter 315 includes a filter body having an entrance surface and an exit surface, and a plurality of sub-wavelength structures provided on the entrance surface of the filter body. From the viewpoint of improving the transmission characteristics of the filter body, it is preferable to provide a plurality of subwavelength structures on both the incident surface and the exit surface.
- the sub-wavelength structure is the same as the sub-wavelength structure 503 in the fifteenth embodiment.
- the filter 315 is not particularly limited as long as it is attached to the surface on the light incident side of the lens barrel 303.
- a polarization (PL) filter for example, a polarization (PL) filter, a sharp cut (SC) filter, and color enhancement are exemplified.
- an effect filter a neutral density (ND) filter, a color temperature conversion (LB) filter, a color correction (CC) filter, a white balance acquisition filter, and a lens protection filter.
- Example 1 Optical characteristics of ND filter
- a glass roll master having an outer diameter of 126 mm was prepared, and a resist layer was deposited on the surface of the glass roll master as follows. That is, the photoresist was diluted to 1/10 with a thinner, and this diluted resist was applied to a thickness of about 70 nm on the cylindrical surface of the glass roll master by dipping, thereby forming a resist layer.
- the glass roll master as a recording medium is conveyed to the roll master exposure apparatus shown in FIG. 7, and the resist layer is exposed to be continuous in one spiral, and between the adjacent three rows of tracks. A latent image having a lattice pattern was patterned on the resist layer.
- a hexagonal lattice-shaped exposure pattern was formed by irradiating an area where a hexagonal lattice-shaped exposure pattern was to be formed with laser light having a power of 0.50 mW for exposing the surface of the glass roll master.
- the thickness of the resist layer in the row direction of the track row was about 60 nm, and the thickness of the resist in the track extending direction was about 50 nm.
- the resist layer on the glass roll master was subjected to development treatment, and the exposed resist layer was dissolved and developed.
- an undeveloped glass roll master is placed on a turntable of a developing machine (not shown), and a developer is dropped on the surface of the glass roll master while rotating the entire turntable to develop the resist layer on the surface. did. Thereby, a resist glass master having a resist layer opened in a hexagonal lattice pattern was obtained.
- a plurality of UV light sources were arranged in the cavity of the moth-eye glass roll master obtained as described above.
- a plurality of structures were produced on both surfaces of a film-like ND filter by UV imprinting. Specifically, while rotating the moth-eye glass roll master, the transfer surface is brought into close contact with an ND filter coated with an ultraviolet curable resin, and ultraviolet light having a power of 100 mJ / cm 2 is applied to the transfer surface side of the moth-eye glass roll master. The film was peeled off while being cured by irradiating the UV curable resin. As a result, an ND filter in which a plurality of the following structures are arranged on both sides was obtained.
- Structure arrangement hexagonal lattice Structure shape: bell-shaped (almost rotating paraboloid) Average arrangement pitch P of structures: 250 nm Average height H of structure: 200 nm Structure aspect ratio (H / P): 0.8 As a result, an ND filter having an antireflection function was obtained.
- the transmission spectrum in the visible wavelength range (350 nm to 750 nm) of the ND filter was measured with a spectrophotometer (trade name: V-550, manufactured by JASCO Corporation). The result is shown in FIG. 31A.
- a measurement sample was prepared by attaching a black tape to one surface of the ND filter. Next, the reflection spectrum in the visible wavelength range (350 nm to 850 nm) of this measurement sample was measured with a spectrophotometer (trade name: V-550, manufactured by JASCO Corporation). The result is shown in FIG. 31B.
- FIG. 31A it can be seen that providing the structures on both surfaces of the ND film can improve the transmittance by about 1% over almost the entire visible wavelength range (350 nm to 700 nm).
- FIG. 31B it can be seen that by providing the structure on the surface of the ND film, the reflectance can be reduced by about 4% in almost the entire wavelength range around the visible region (350 nm to 850 nm).
- FIG. 32A is a diagram showing a simulation result of Test Example 1-1.
- FIG. 32B is a diagram illustrating a simulation result of Test Example 1-2.
- NA ⁇ 1.5
- strength of the scattered light which has each appeared in the center (optical axis part) of FIG. 32A and FIG. 32B has shown the intensity
- Test Example 1-1 the scattered light is moving away from the optical axis.
- NA ⁇ 0.8 compared to the optical element assumed in Test Example 1-2.
- the intensity of scattered light tends to decrease. Therefore, in the optical element of Test Example 1-1, it is possible to reduce image noise (bright line noise) in the captured image.
- Test Example 1-2 the scattered light exists in the vicinity of the optical axis, and the intensity of the scattered light tends to increase in the range of NA ⁇ 0.8. Therefore, in the optical element of Test Example 1-2, image noise (bright line noise) is generated in the captured image.
- 33A and 33B are diagrams showing simulation results of Test Example 2-1.
- 34A and 34B are diagrams illustrating simulation results of Test Example 2-2.
- FIG. 35A and FIG. 35B are diagrams illustrating simulation results of Test Example 2-3.
- 33A, FIG. 34A, and FIG. 35A, the portion where the scattered light intensity that appears at the center (optical axis portion) is high indicates the intensity of the incident light (zero-order light).
- Test Example 2-1 Since the haze value of Test Example 2-1 is close to the haze value obtained by actual measurement (the haze value for the moth eye), the model assumed in the simulations of Test Example 2-1 to Test Example 2-3 is reasonable. It can be judged that it is a thing.
- Test Examples 2-1 to 2-3 the ratio of the total light amount ILb of the band-like scattered light to the total light amount ILa of the incident light ((ILb / ILa) ⁇ 100 [%]) is shown below.
- Test Example 2-3 0.001% (ratio of total Ib of scattered light intensity to total Ia of incident light intensity (Ib / Ia): 1/10 5 )
- the ratio of the intensity of scattered light to the intensity of incident light is preferably less than 1/500, more preferably 1/5000 or less, and even more preferably 1/10 5 or less. Is within the range.
- the optical element according to the embodiment of the present technology can be applied not only to an imaging apparatus but also to a microscope, an exposure apparatus, and the like.
- the present technology is not limited to this example, and a plurality of sub-wavelength structures are formed on the surface (incident surface and output surface).
- the present technology can be applied to an optical system having an optical element formed on at least one) or an optical apparatus including the optical system.
- the present technology can be applied to a microscope or an exposure apparatus.
- the present technology is applied to a digital imaging device has been described as an example.
- the present technology can also be applied to an analog imaging device.
- this technique can also take the following structures.
- (1-1) An element body; A plurality of sub-wavelength structures provided on the surface of the element body, The sub-wavelength structure includes an energy beam curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition, The surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, An optical element in which the intensity distribution of the scattered light has anisotropy.
- a shape layer having an uneven surface provided on the surface of the element body is further provided,
- the uneven shape includes the plurality of sub-wavelength structures,
- the element body has a strip shape,
- the sub-wavelength structure is formed by causing an energy ray-curable resin composition applied to the surface of the element body to proceed with a curing reaction from the side opposite to the element body (1-1).
- (1-9) The optical element according to any one of (1-2) to (1-7), wherein the unit area is a transfer area formed by rotating the rotating surface of the rotating master disk once.
- the sub-wavelength structure forms a grating pattern, The sub-wavelength structures are arranged to form a plurality of rows of tracks on the surface;
- the lattice pattern is at least one of a hexagonal lattice pattern, a quasi-hexagonal lattice pattern, a tetragonal lattice pattern, and a quasi-tetragonal lattice pattern,
- the surface scatters part of the incident light
- the optical element according to (1-1) wherein the intensity of the scattered light is less than 1/500 with respect to the intensity of the incident light.
- the sub-wavelength structure pattern is formed by arranging a plurality of convex or concave sub-wavelength structures in a one-dimensional array or a two-dimensional array (1-2) to (1-9).
- Optical elements (1-12) The optical element according to any one of (1-1) to (1-11), wherein the plurality of sub-wavelength structures are regularly or irregularly arranged.
- the element body has at least one plane or curved surface; The optical element according to any one of (1-2) to (1-7), wherein the shape layer is formed on the plane or the curved surface.
- the sub-wavelength structures are arranged to form a plurality of rows of tracks on the surface;
- the sub-wavelength structure forms a grating pattern,
- the sub-wavelength structures are arranged to form a plurality of rows of tracks on the surface;
- the optical element according to any one of (1-1) to (1-14), wherein the lattice pattern is at least one of a hexagonal lattice pattern, a quasi-hexagonal lattice pattern, a tetragonal lattice pattern, and a quasi-tetragonal lattice pattern.
- the concavo-convex shape of the rotation surface is formed by arranging a plurality of convex or concave sub-wavelength structures in a one-dimensional array or a two-dimensional array.
- (1-21) The method of manufacturing an optical element according to any one of (1-16) to (1-20), wherein the energy ray source is arranged in a width direction of the rotating master.
- the element body has a strip shape, In the formation of the sub-wavelength structure, the concave / convex shape is transferred with the longitudinal direction of the element main body as a rotation progression direction.
- the element body has at least one plane or curved surface; The method for producing an optical element according to any one of (1-16) to (1-22), wherein the shape layer is formed on the plane or the curved surface.
- An optical element An imaging element having an imaging region for receiving light through the optical element, The optical element is An element body; A plurality of sub-wavelength structures provided on the surface of the element body, The sub-wavelength structure includes an energy beam curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition, The surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, An optical system in which the intensity distribution of the scattered light has anisotropy. (1-25) The optical system according to (1-24), wherein a total sum of components reaching the imaging region in the scattered light is smaller than a total sum of components reaching the outside of the imaging region.
- the intensity per unit solid angle of the intensity distribution of the scattered light is smaller in the range of numerical aperture NA ⁇ 0.8 than in the range of numerical aperture NA> 0.8 (1-24) to (1-27) Any one of the optical systems.
- the maximum value of the scattered light intensity distribution in the imaging region is any one of (1-24) to (1-28), which is smaller than the maximum value of the scattered light intensity distribution in a region outside the imaging region.
- the plurality of sub-wavelength structures are arranged in a plurality of rows on the surface of the optical element,
- (1-31) The optical system according to (1-30), wherein the shape of the row is linear or arcuate.
- the plurality of subwavelength structures form a grating pattern, The optical system according to any one of (1-24) to (1-31), wherein the lattice pattern is at least one of a hexagonal lattice pattern, a quasi-hexagonal lattice pattern, a tetragonal lattice pattern, and a quasi-tetragonal lattice pattern.
- the imaging region has a rectangular shape having two sets of opposing sides, The optical system according to (1-30), wherein a direction of the row and an extending direction of one of the two sets of sides are parallel to each other.
- the two sets of sides consist of a pair of opposing short sides and a pair of opposing long sides, The optical system according to (1-33), wherein the direction of the row and the extending direction of the long side are parallel.
- An optical system including an optical element and an imaging element having an imaging region that receives light through the optical element;
- the optical element is An element body;
- the sub-wavelength structure includes an energy beam curable resin composition,
- the element body is impermeable to energy rays for curing the energy ray curable resin composition,
- the surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light,
- An imaging device in which the intensity distribution of the scattered light has anisotropy.
- An optical system including an optical element and an imaging element having an imaging region that receives light through the optical element;
- the optical element is An element body;
- the sub-wavelength structure includes an energy beam curable resin composition,
- the element body is impermeable to energy rays for curing the energy ray curable resin composition,
- the surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light,
- An optical device in which the intensity distribution of the scattered light has anisotropy.
- a rotating surface for forming a plurality of sub-wavelength structures While rotating and closely contacting the rotating surface to the energy ray curable resin composition applied to the surface of the element body, the energy beam emitted from the energy ray source provided inside the rotating surface is applied to the rotating surface.
- an optical element having a subwavelength structure provided on the surface is obtained,
- the optical element surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, A master having an anisotropy in the intensity distribution of the scattered light.
- the rotating surface is configured to transmit energy rays
- the rotating surface provided with the plurality of sub-wavelength structures has a section for scattering incident light and generating scattered light, A master having an anisotropy in the intensity distribution of the scattered light.
- the present technology can take the following configurations.
- the rotating master is permeable to energy rays emitted from the energy ray source, While rotating and closely contacting the rotating surface of the rotating master disk with respect to the energy ray curable resin composition applied on the element body, the energy beam emitted from the energy beam source is irradiated through the rotating surface, and
- the transfer apparatus which forms the shape layer by which the uneven
- (2-2) It has a rotating surface with an uneven shape, It is transparent to the energy rays emitted from the energy ray source, A master that can be cured by irradiating the energy ray curable resin composition with energy rays emitted from the energy ray source via the rotating surface.
- the present technology can also be configured as follows. (3-1) an element body having a surface; A plurality of sub-wavelength structures provided on the surface of the element body, The sub-wavelength structure is formed by curing an energy ray curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition, The plurality of subwavelength structures form a plurality of rows on the surface; An optical element in which the center position of the sub-wavelength structure varies in the inter-column direction.
- the optical element is an optical element having an antireflection function.
- the element body is an optical element body that imparts an antireflection function by the sub-wavelength structure.
- the optical element body examples include, but are not limited to, a lens, a filter (for example, an ND filter), a transflective mirror, a light control element, a prism, and a polarizing element.
- a filter for example, an ND filter
- a transflective mirror for example, a transflective mirror
- a light control element for example, a prism
- a polarizing element for example, a polarizing element.
- 3-1 The optical element according to (3-1), wherein the fluctuation is an irregular fluctuation.
- the maximum value of the variation width ⁇ Tp of the inter-column pitch is ⁇ Tp max
- the center position of the sub-wavelength structure varies in a direction larger than ⁇ Tp max in the inter-column direction.
- (3-4) The optical element according to (3-1) or (3-2), wherein the row is meandering.
- an element body having a surface A plurality of sub-wavelength structures formed on the surface of the element body, The sub-wavelength structure is formed by curing an energy ray curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition, The plurality of subwavelength structures form a plurality of examples on the surface; An optical element in which the arrangement pitch P of the sub-wavelength structures in the same row varies with respect to the average arrangement pitch Pm. (3-9) The optical element according to (3-8), wherein the fluctuation is irregular fluctuation.
- (3-13) comprising one or more optical elements having a surface on which a plurality of subwavelength structures are formed,
- the optical element is An element body having a surface; A plurality of sub-wavelength structures formed on the surface of the element body, The sub-wavelength structure is formed by curing an energy ray curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition,
- the plurality of subwavelength structures form a plurality of examples on the surface;
- An optical system in which the center position of the sub-wavelength structure varies in the inter-column direction.
- (3-14) The optical system according to (3-13), wherein the fluctuation is an irregular fluctuation.
- the sub-wavelength structures adjacent in the column direction form a block, and the center position of the sub-wavelength structure varies in the inter-column direction with the block as a unit.
- (3-20) The optical system according to any one of (3-13) to (3-19), further including an imaging element that receives light through the optical element.
- (3-21) comprising one or more optical elements having a surface on which a plurality of subwavelength structures are formed,
- the optical element is An element body having a surface; A plurality of sub-wavelength structures formed on the surface of the element body, The sub-wavelength structure is formed by curing an energy ray curable resin composition, The element body is impermeable to energy rays for curing the energy ray curable resin composition,
- (3-22) The optical system according to (3-21), wherein the variation is an irregular variation.
- (3-29) having a surface on which a plurality of subwavelength structures are formed;
- the plurality of subwavelength structures form a plurality of examples on the surface;
- (3-30) The master according to (3-29), wherein the fluctuation is an irregular fluctuation.
- (3-31) When the maximum value of the variation width ⁇ Tp of the inter-column pitch is ⁇ Tp max , the center position of the sub-wavelength structure varies in a direction larger than ⁇ Tp max in the inter-column direction.
- (3-32) The master according to (3-29) or (3-30), wherein the row is meandering.
- (3-36) having a surface on which a plurality of subwavelength structures are formed; The plurality of subwavelength structures form a plurality of examples on the surface;
- the master in which the arrangement pitch P of the sub-wavelength structures in the same row varies with respect to the average arrangement pitch Pm.
- (3-37) The master according to (3-36), wherein the fluctuation is irregular fluctuation.
- the maximum value of the fluctuation width of the inter-column pitch is ⁇ Tp max
- the fluctuation width ⁇ P of the arrangement pitch P with respect to the average arrangement pitch Pm fluctuates with a magnitude larger than ⁇ Tp max .
- the master according to (3-36) or (3-37).
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Abstract
Description
素子本体と、
素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
素子本体は、エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
散乱した光の強度分布が、異方性を有する光学素子である。
素子本体の表面にエネルギー線硬化性樹脂組成物を塗布し、
素子本体の表面に塗布されたエネルギー線硬化性樹脂組成物に対して回転原盤の回転面を回転密着させながら、回転原盤内に設けられたエネルギー線源から放射されたエネルギー線を回転面を介して照射し、エネルギー線硬化性樹脂組成物を硬化させることにより、素子本体の表面に複数のサブ波長構造体を形成する
ことを含み、
複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
散乱した光の強度分布が、異方性を有する光学素子の製造方法である。
光学素子と、
光学素子を介して光を受光する撮像領域を有する撮像素子と
を備え、
光学素子は、
素子本体と、
素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
素子本体は、エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
散乱した光の強度分布が、異方性を有する光学系である。
光学素子と、光学素子を介して光を受光する撮像領域を有する撮像素子とを含む光学系を備え、
光学素子は、
素子本体と、
素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
素子本体は、エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
散乱した光の強度分布が、異方性を有する撮像装置である。
光学素子と、光学素子を介して光を受光する撮像領域を有する撮像素子とを含む光学系を備え、
光学素子は、
素子本体と、
素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
素子本体は、エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
散乱した光の強度分布が、異方性を有する光学装置である。
複数のサブ波長構造体が設けられた回転面を有し、
回転面はエネルギー線を透過可能に構成され、
複数のサブ波長構造体が設けられた回転面は、入射光を散乱し、散乱光を発生させる区画を有し、
散乱した光の強度分布が、異方性を有する原盤である。
また、エネルギー線に対して不透過性とは、エネルギー線硬化性樹脂組成物を硬化させることが困難となる程度の不透過性を意味する。
図2A~図2Eはそれぞれ、本技術の第1の実施形態に係る積層体に備えられた基体の第1~第5の例を示す断面図である。
図3は、本技術の第1の実施形態に係る転写装置の構成の一例を示す概略図である。
図4は、ロール原盤の構成の一例を示す斜視図である。図4Bは、図4Aに示したロール原盤の一部を拡大して表す平面図である。
図5は、ロール原盤露光装置の構成の一例を示す概略図である。
図6A~図6Dは、本技術の第1の実施形態に係る積層体の製造方法の一例を説明するための工程図である。
図7A~図7Eは、本技術の第1の実施形態に係る積層体の製造方法の一例を説明するための工程図である。
図8は、本技術の第2の実施形態に係る転写装置の構成の一例を示す概略図である。
図9は、本技術の第3の実施形態に係る転写装置の構成の一例を示す概略図である。
図10Aは、本技術の第4の実施形態に係る積層体の構成の一例を示す平面図である。図10Bは、図10Aに示した積層体の一部を拡大して表す平面図である。
図11Aは、本技術の第5の実施形態に係る積層体の構成の一例を示す断面図である。図11Bは、図11Aに示した積層体の一部を拡大して表す平面図である。図11Cは、図11Bに示した積層体の断面図である。
図12は、本技術の第6の実施形態に係る積層体の構成の一例示す斜視図である。
図13A~図13Eはそれぞれ、本技術の第7の実施形態に係る積層体に備えられた基体の第1~第5の例を示す断面図である。
図14A、図14Bはそれぞれ、本技術の第8の実施形態に係る積層体に備えられた基体の第1、第2の例を示す断面図である。
図15A、図15Bは、輝線ノイズの発生の原因について説明するための概略図である。
図16は、本技術の第9の実施形態に係る撮像装置の構成の一例を示す概略図である。
図17Aは、本技術の第9の実施形態に係る反射防止機能付光学素子の構成の一例を示す平面図である。図17Bは、図17Aに示した反射防止機能付光学素子の一部を拡大して表す平面図である。図17Cは、図17BのトラックTにおける断面図である。
図18A~図18Dは、反射防止機能付光学素子の構造体の形状例を示す斜視図である。
図19Aは、図16に示した撮像光学系の一部を拡大して示す略線図である。図19Bは、図19Aに示した撮像光学系の開口数NAの定義を説明するための略線図である。
図20Aは、図19Aに示した撮像光学系を光線L0が入射する側から見た略線図である。図20Bは、図20Aに示した撮像光学系が有する反射防止機能付光学素子の一部を拡大して表す拡大図である。
図21Aは、ロール原盤の構成の一例を示す斜視図である。図21Bは、図21Aに示したロール原盤の一部を拡大して表す平面図である。図21Cは、図21BのトラックTにおける断面図である。
図22Aは、本技術の第10の実施形態に係る反射防止機能付光学素子の構成の一例を示す平面図である。図22Bは、図22Aに示した反射防止機能付光学素子の一部を拡大して表す平面図である。図22Cは、図22BのトラックTにおける断面図である。
図23Aは、本技術の第11の実施形態に係る反射防止機能付光学素子の構成の一例を示す平面図である。図23Bは、図23Aに示した反射防止機能付光学素子の一部を拡大して表す平面図である。図23Cは、図23BのトラックTにおける断面図である。
図24Aは、本技術の第12の実施形態に係る反射防止機能付光学素子表面の一部を拡大して表す平面図である。図24Bは、仮想トラックTiの定義を説明するための概略図である。
図25Aは、構造体の中心位置の変動幅を説明するための概略図である。図25Bは、構造体の変動割合を説明するための概略図である。
図26Aおよび図26Bは、構造体の配置形態の第1の例を示す模式図である。図26Cは、構造体の配置形態の第2の例を示す模式図である。
図27Aは、本技術の第13の実施形態に係る反射防止機能付光学素子表面の一部を拡大して表す平面図である。図27Bは、構造体の配置ピッチの変動幅を説明するための概略図である。
図28は、本技術の第14の実施形態に係る撮像装置の構成の一例を示す概略図である。
図29は、本技術の第15の実施形態に係る撮像装置の構成の一例を示す概略図である。
図30A~図30Dは、NDフィルタの構成例を示す断面図である。
図31Aは、実施例1、比較例1のNDフィルタの透過スペクトルを示す図である。図31Bは、実施例1、比較例1のNDフィルタの反射スペクトルを示す図である。
図32Aは、試験例1−1のシミュレーション結果を示す図である。図32Bは、試験例1−2のシミュレーション結果を示す図である。
図33Aは、試験例2−1のシミュレーション結果を示す図である。図33Bは、試験例2−1のシミュレーション結果である強度分布を示すグラフである。
図34Aは、試験例2−2のシミュレーション結果を示す図である。図34Bは、試験例2−2のシミュレーション結果である強度分布を示すグラフである。
図35Aは、試験例2−3のシミュレーション結果を示す図である。図35Bは、試験例2−3のシミュレーション結果である強度分布を示すグラフである。
1.第1の実施形態(基体の一主面に複数の構造体が2次元配列された積層体の例)
2.第2の実施形態(積層体をステージにより搬送する転写装置の例)
3.第3の実施形態(円環状のベルト原盤を備えた転写装置の例)
4.第4の実施形態(基体の一主面に複数の構造体が蛇行配列された積層体の例)
5.第5の実施形態(基体の一主面に複数の構造体がランダム配列させた積層体の例)
6.第6の実施形態(基体の一主面に複数の構造体が1次元配列させた積層体の例)
7.第7の実施形態(基体の両主面に複数の構造体が2次元配列させた例)
8.第8の実施形態(不透過性を有する複数の構造体が2次元配列された積層体の例)
9.第9の実施形態(撮像領域に到達する散乱光を低減させた光学系およびそれを備える撮像装置の例)
10.第10の実施形態(構造体を四方格子状または準四方格子状に配列した例)
11.第11の実施形態(構造体を凹状とした例)
12.第12の実施形態(構造体を列間方向に変動させた例)
13.第13の実施形態(構造体を列方向に変動させた例)
14.第14の実施形態(構造体をデジタルビデオカメラの光学系に適用した例)
15.第15の実施形態(撮像領域に到達する散乱光を低減させた光学系およびそれを備える撮像装置の例)
[積層体の構成]
図1Aは、本技術の第1の実施形態に係る積層体の構成の一例を示す平面図である。図1Bは、図1Aに示した積層体の一部を拡大して表す斜視図である。図1Cは、図1Aに示した積層体の一部を拡大して表す平面図である。図1Dは、図1Cに示した積層体のトラック延在方向の断面図である。積層体は、第1の主面および第2の主面を有する基体1と、これらの主面の一方に形成された、凹凸形状を有する形状層2とを備える。以下では、形状層2が形成される第1の面を表面と適宜称し、それとは反対側の第2の面を裏面と適宜称する。
基体1の材料は特に限定はされものではなく用途によって適宜選択可能であり、例えば、プラスチック材料、ガラス材料、金属材料、金属化合物材料(例えば、セラミックス、磁性体、半導体など)を用いることができる。プラスチック材料としては、例えば、トリアセチルセルロース、ポリビニールアルコール、環状オレフィンポリマー、環状オレフィンコポリマー、ポリカーボネート、ポリエチレン、ポリプロプレン、ポリ塩化ビニル、ポリスチレン、ポリエチレンテレフタレート、ポリエチレンナフタレート、メタクリル樹脂、ナイロン、ポリアセタール、フッ素樹脂、フェノール樹脂、ポリウレタン、エポキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、メラミン樹脂、ポリエーテルエーテルケトン、ポリサルフォン、ポリエーテルサルフォン、ポリフェニレンサルファイド、ポリアリレート、ポリエーテルイミド、ポリアミドイミド、メチルメタクリレート(共)重合体などが挙げられる。ガラス材料としては、例えば、ソーダライムガラス、鉛ガラス、硬質ガラス、石英ガラス、液晶化ガラスなどが挙げられる。金属材料および金属化合物材料としては、例えば、シリコン、酸化ケイ素、サファイヤ、フッ化カルシウム、フッ化マグネシウム、フッ化バリウム、フッ化リチウム、セレン化亜鉛、臭化カリウムなどが挙げられる。
図2Aに示すように、基体1は、単層の構造を有し、基体全体がエネルギー線に対して不透過性を有する不透過層である。
図2Bに示すように、基体1は、2層構造を有し、エネルギー線に対して不透過性を有する不透過層11aと、エネルギー線に対して透過性を有する透過層11bとを備える。不透過層11aが裏面側に配置され、透過層11bが表面側に配置される。
図2Cに示すように、基体1は、2層構造を有し、エネルギー線に対して不透過性を有する不透過層11aと、エネルギー線に対して透過性を有する透過層11bとを備える。不透過層11aが表面側に配置され、透過層11bが裏面側に配置される。
図2Dに示すように、基体1は、3層構造を有し、エネルギー線に対して透過性を有する透過層11bと、この透過層11bの両主面に形成された、エネルギー線に対して不透過性を有する不透過層11a、11aとを備える。一方の不透過層11aが裏面側に配置され、他方の不透過層11aが表面側に配置される。
図2Eに示すように、基体1は、3層構造を有し、エネルギー線に対して不透過性を有する不透過層11aと、この不透過層11aの両主面に形成された、エネルギー線に対して透過性を有する透過層11b、11bとを備える。一方の透過層11bが裏面側に配置され、他方の透過層11bが表面側に配置される。
形状層2は、所定の凹凸パターンを有する転写領域TEが連続して形成された表面を有する。形状層2は、例えば、複数の構造体21が2次元配列されてなる層であり、必要に応じて複数の構造体21と基体1との間に基底層22を備えるようにしてもよい。基底層22は、構造体21の底面側に構造体21と一体成形された層であり、構造体21と同様のエネルギー線硬化性樹脂組成物を硬化してなる。基底層22の厚さは、特に限定されるものではなく、必要に応じて適宜選択することができる。複数の構造体21が、例えば、基体1の表面において複数列のトラックTをなすように配列されている。複数例のトラックをなすように配列された複数の構造体21が、例えば、規則的な所定の配置パターンをなすようにしてもよい。配置パターンとしては、例えば、格子パターンを用いることができる。格子パターンは、例えば、六方格子パターン、準六方格子パターン、四方格子パターンおよび準四方格子パターンの少なくとも1種である。構造体21の高さが基体1の表面において規則的または不規則的に変化するようにしてもよい。
単官能モノマーとしては、例えば、カルボン酸類(アクリル酸)、ヒドロキシ類(2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、4−ヒドロキシブチルアクリレート)、アルキル、脂環類(イソブチルアクリレート、t−ブチルアクリレート、イソオクチルアクリレート、ラウリルアクリレート、ステアリルアクリレート、イソボニルアクリレート、シクロヘキシルアクリレート)、その他機能性モノマー(2−メトキシエチルアクリレート、メトキシエチレンクリコールアクリレート、2−エトキシエチルアクリレート、テトラヒドロフルフリルアクリレート、ベンジルアクリレート、エチルカルビトールアクリレート、フェノキシエチルアクリレート、N,N−ジメチルアミノエチルアクリレート、N,N−ジメチルアミノプロピルアクリルアミド、N,N−ジメチルアクリルアミド、アクリロイルモルホリン、N−イソプロピルアクリルアミド、N,N−ジエチルアクリルアミド、N−ビニルピロリドン、2−(パーフルオロオクチル)エチル アクリレート、3−パーフルオロヘキシル−2−ヒドロキシプロピルアクリレート、3−パーフルオロオクチル−2−ヒドロキシプロピル アクリレート、2−(パーフルオロデシル)エチル アクリレート、2−(パーフルオロー3−メチルブチル)エチル アクリレート)、2,4,6−トリブロモフェノールアクリレート、2,4,6−トリブロモフェノールメタクリレート、2−(2,4,6−トリブロモフェノキシ)エチルアクリレート)、2−エチルヘキシルアクリレートなどを挙げることができる。
図3は、本技術の第1の実施形態に係る転写装置の構成の一例を示す概略図である。この転写装置は、ロール原盤101と、基体供給ロール111と、巻き取りロール112と、ガイドロール113、114と、ニップロール115、剥離ロール116と、塗布装置117と、エネルギー線源110とを備える。
図4Aは、ロール原盤の構成の一例を示す斜視図である。図4Bは、図4Aに示したロール原盤の一部を拡大して表す平面図である。ロール原盤101は、例えば、円筒状の形状を有する原盤であり、その表面に形成された転写面Spと、それとは反対の内側に形成された内周面である裏面Siとを有する。ロール原盤101の内部には、例えば、裏面Siにより形成される円柱状の空洞部が形成されており、この空洞部に1個または複数個のエネルギー線源110が備えられる。転写面Spには、例えば、凹状または凸状の複数の構造体102が形成され、これらの構造体102の形状を基体1上に塗布されたエネルギー線硬化性樹脂組成物に対して転写することにより、積層体の形状層2が形成される。すなわち、転写面Spには、積層体の形状層2の有する凹凸形状を反転したパターンが形成されている。
図5は、ロール原盤を作製するためのロール原盤露光装置の構成の一例を示す概略図である。このロール原盤露光装置は、光学ディスク記録装置をベースとして構成されている。
図6A~図7Eは、本技術の第1の実施形態に係る積層体の製造方法の一例を説明するための工程図である。
まず、図6Aに示すように、円筒状のロール原盤101を準備する。次に、図6Bに示すように、ロール原盤101の表面にレジスト層103を形成する。レジスト層103の材料としては、例えば、有機系レジスト、および無機系レジストのいずれを用いてもよい。有機系レジストとしては、例えば、ノボラック系レジスト、化学増幅型レジストなどを用いることができる。また、無機系レジストとしては、例えば、1種または2種以上の遷移金属からなる金属化合物を用いることができる。
次に、図6Cに示すように、ロール原盤101の表面に形成されたレジスト層103に、レーザー光(露光ビーム)104を照射する。具体的には、図5に示したロール原盤露光装置のターンテーブル46上に載置し、ロール原盤101を回転させると共に、レーザー光(露光ビーム)104をレジスト層103に照射する。このとき、レーザー光104をロール原盤101の高さ方向(円柱状または円筒状のロール原盤101の中心軸に平行な方向)に移動させながら、レーザー光104を間欠的に照射することで、レジスト層103を全面にわたって露光する。これにより、レーザー光104の軌跡に応じた潜像105が、可視光波長と同程度のピッチでレジスト層103の全面にわたって形成される。
次に、ロール原盤101を回転させながら、レジスト層103上に現像液を滴下して、図6Dに示すように、レジスト層103を現像処理する。図示するように、レジスト層103をポジ型のレジストにより形成した場合には、レーザー光104で露光した露光部は、非露光部と比較して現像液に対する溶解速度が増すので、潜像(露光部)105に応じたパターンがレジスト層103に形成される。
次に、ロール原盤101の上に形成されたレジスト層103のパターン(レジストパターン)をマスクとして、ロール原盤101の表面をエッチング処理する。これにより、図7Aに示すように、トラックの延在方向に長軸方向をもつ楕円錐形状または楕円錐台形状の凹部、すなわち構造体102を得ることができる。エッチングとしては、例えばドライエッチングやウエットエッチングを用いることができる。
次に、図7Bに示すように、ロール原盤101内の収容空間(空洞部)に、1または複数のエネルギー線源110を配置する。エネルギー線源110は、ロール原盤101の幅方向Dwまたは回転軸1の軸方向と平行に配置することが好ましい。
次に、必要に応じて、エネルギー線硬化性樹脂組成物118が塗布される基体1の表面に対して、コロナ処理、プラズマ処理、火炎処理、UV処理、オゾン処理、ブラスト処理などの表面処理を施す。次に、図7Cに示すように、長尺の基体1またはロール原盤101上にエネルギー線硬化性樹脂組成物118を塗布または印刷する。塗布方法は特に限定されるものではないが、例えば、基体上または原盤上へのポッティング、スピンコート法、グラビアコート法、ダイコート法、バーコート法などを用いることができる。印刷方法としては、例えば、凸版印刷法、オフセット印刷法、グラビア印刷法、凹版印刷法、ゴム版印刷法、スクリーン印刷法などを用いることができる。次に、必要に応じて、溶剤除去やプリベークなどの加熱処理を行う。
まず、基体供給ロール111から長尺の基体1を送出し、送出された基体1は、塗布装置117の下を通過する。次に、塗布装置117の下を通過する基体1上に、塗布装置117によりエネルギー線硬化性樹脂組成物118を塗布する。次に、エネルギー線硬化性樹脂組成物118が塗布された基体1をガイドロール113を経てロール原盤101に向けて搬送する。
図8は、本技術の第2の実施形態に係る転写装置の構成の一例を示す概略図である。この転写装置は、ロール原盤101と、塗布装置117と、搬送ステージ121とを備える。第2の実施形態において、第1の実施形態と同一の箇所には同一の符号を付して説明を省略する。搬送ステージ121は、この搬送ステージ121上に載置された基体1を矢印aの方向に向けて搬送可能に構成されている。
まず、塗布装置117の下を通過する基体1上に、塗布装置117によりエネルギー線硬化性樹脂組成物118を塗布する。次に、エネルギー線硬化性樹脂組成物118が塗布された基体1をロール原盤101に向けて搬送する。次に、エネルギー線硬化性樹脂組成物118をロール原盤101の転写面Spに密着させながら搬送するとともに、ロール原盤101内に設けられた1または複数のエネルギー線源110から放射されたエネルギー線を、ロール原盤101の転写面Spを介してエネルギー線硬化性樹脂組成物118に対して照射する。これにより、エネルギー線硬化性樹脂組成物118が硬化し、形状層2が形成さる。次に、搬送ステージを矢印aの方向に搬送することにより、ロール原盤101の転写面Spから形状層2を剥離する。これにより、長尺の積層体が得られる。次に、必要に応じて、得られた積層体を所定の大きさまたは形状に裁断する。以上により、目的とする積層体が得られる。
図9は、本技術の第3の実施形態に係る転写装置の構成の一例を示す概略図である。この転写装置は、ロール131、132、134、135と、ベルト原盤であるエンボスベルト133と、平坦ベルト136と、1個または複数個のエネルギー線源110と、塗布装置117とを備える。第3の実施形態において、第1の実施形態と同一の箇所には同一の符号を付して説明を省略する。
まず、塗布装置117の下を通過する基体1上に、塗布装置117によりエネルギー線硬化性樹脂組成物118を塗布する。次に、回転するエンボスベルト133と平坦ベルト136との間の間隙に、ロール131、134の側からエネルギー線硬化性樹脂組成物118が塗布された基体1を搬入する。これにより、エンボスベルト133の転写面とエネルギー線硬化性樹脂組成物118とが密着する。次に、この密着状態を維持しながら、エネルギー線源110から放射されたエネルギー線を、エンボスベルト133を介してエネルギー線硬化性樹脂組成物118に対して照射する。これにより、エネルギー線硬化性樹脂組成物118が硬化され、基体1上に形状層2が形成される。次に、エンボスベルト133を形状層2から剥離する。これにより、目的とする積層体が得られる。
図10Aは、本技術の第4の実施形態に係る積層体の構成の一例を示す平面図である。図10Bは、図10Aに示した積層体の一部を拡大して表す平面図である。第4の実施形態に係る積層体は、構造体21を蛇行するトラック(以下ウォブルトラックと称する。)上に配列している点において、第1の実施形態に係る積層体とは異なっている。基体1上における各トラックのウォブルは、同期していることが好ましい。すなわち、ウォブルは、シンクロナイズドウォブルであることが好ましい。このようにウォブルを同期させることで、六方格子または準六方格子などの単位格子形状を保持し、充填率を高く保つことができる。ウォブルトラックの波形としては、例えば、サイン波、三角波などを挙げることができるが、これに限定されるものではない。ウォブルトラックの波形は、周期的な波形に限定されるものではなく、非周期的な波形としてもよい。
この第4の実施形態において、上記以外のことは、第1の実施形態と同様である。
図11Aは、本技術の第5の実施形態に係る積層体の構成の一例を示す断面図である。図11Bは、図11Aに示した積層体の一部を拡大して表す平面図である。図11Cは、図11Bに示した積層体の断面図である。第4の実施形態に係る積層体は、複数の構造体21がランダム(不規則)に2次元配列されている点において、第1の実施形態とは異なっている。また、構造体21の大きさおよび/または高さもランダムに変化させるようにしてもよい。
この第5の実施形態において、上記以外のことは、第1の実施形態と同様である。
図12は、本技術の第6の実施形態に係る積層体の構成の一例示す斜視図である。図12に示すように、第6の実施形態に係る積層体は、基体表面にて一方向に延在された柱状の構造体21を有し、この構造体21が基体1上に1次元配列されている点において、第1の実施形態のものとは異なっている。
この第6の実施形態において、上記以外のことは、第1の実施形態と同様である。
図13A~図13Eはそれぞれ、本技術の第7の実施形態に係る積層体に備えられた基体の第1~第5の例を示す断面図である。第7の実施形態に係る積層体は、基体1の両主面に複数の構造体21が2次元配列されている点において、第1の実施形態に係る積層体とは異なっている。具体的には、第1~第5の例の積層体はそれぞれ、基体1の両主面に複数の構造体21が2次元配列されている点以外のことは、上述の第1の実施形態に係る積層体の第1~第5の例と同様である(図2参照)。
この第7の実施形態において、上記以外のことは、第1の実施形態と同様である。
図14Aは、本技術の第8の実施形態に係る積層体に備えられた基体の第1の例を示す断面図である。図14Bは、本技術の第8の実施形態に係る積層体に備えられた基体の第2の例を示す断面図である。第8の実施形態に係る積層体は、構造体21がエネルギー線に対して不透過性を有している点において、第1の実施形態または第7の実施形態に係る積層体とは異なっている。このような不透過性を有する構造体21は、例えば、エネルギー線を吸収する顔料などの材料をエネルギー線硬化性樹脂組成物に添加することにより形成することが可能である。
この第8の実施形態において、上記以外のことは、第1の実施形態と同様である。
(第9の実施形態の概要)
第9の実施形態は、以下の検討の結果により案出されたものである。
本技術者らは、図15Aに示すように、サブ波長構造体が入射面に形成された半透過型ミラー(光学素子)601と、撮像素子602とを備える撮像光学系について、線状の輝線ノイズの発生を抑制すべく鋭意検討を行った。その結果、輝点などの光源からの光Lが半透過型ミラー601の入射面に入射すると、散乱光Lsが発生し、発生した散乱光Lsが撮像素子602の撮像領域(受光領域)に到達すると、撮像素子602により撮影した画像には白色的な散乱光Lsが輝線ノイズとして現れることを見出すに行った。
図16は、本技術の第9の実施形態に係る撮像装置の構成の一例を示す概略図である。図16に示すように、第9の実施形態に係る撮像装置300は、いわゆるデジタルカメラ(デジタルスチルカメラ)であって、筐体301と、レンズ境筒303と、筐体301およびレンズ境筒303内に設けられた撮像光学系302とを備える。撮像光学系302は、レンズ311と、反射防止機能付光学素子201と、撮像素子312と、オートフォーカスセンサ313とを備える。筐体301とレンズ境筒303とが着脱自在に構成されていてもよい。
以下、第9の実施形態に係る反射防止機能付光学素子201の構成について具体的に説明する。
図17Aは、本技術の第9の実施形態に係る反射防止機能付光学素子の構成の一例を示す平面図である。図17Bは、図17Aに示した反射防止機能付光学素子の一部を拡大して表す平面図である。図17Cは、図17BのトラックTにおける断面図である。
以下、反射防止機能付光学素子201に備えられる半透過型ミラー202、および構造体203について順次説明する。
半透過型ミラー202は、例えば、構造体203を構成するエネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線(例えば紫外線など)に対して不透過性を有している。半透過型ミラー202は、入射する光の一部を透過し、残りを反射するミラーである。半透過型ミラー202の形状としては、例えば、シート状、プレート状を挙げることができるが、特にこれらの形状に限定されるものではない。ここで、シートにはフィルムが含まれるものと定義する。
構造体203は、いわゆるサブ波長構造体であり、例えば、半透過型ミラー202の入射面に対して凸状を有し、半透過型ミラー202の入射面に対して2次元配列されている。構造体203は、反射の低減を目的とする光の波長帯域以下の短い配置ピッチで周期的に2次元配列されていることが好ましい。
アスペクト比=H/Pm・・・(1)
但し、H:構造体の高さ、Pm:平均配置ピッチ(平均周期)
ここで、平均配置ピッチPmは以下の式(2)により定義される。
平均配置ピッチPm=(P1+P2+P2)/3 ・・・(2)
但し、P1:トラックの延在方向の配置ピッチ(トラック延在方向周期)、P2:トラックの延在方向に対して±θ方向(但し、θ=60°−δ、ここで、δは、好ましくは0°<δ≦11°、より好ましくは3°≦δ≦6°)の配置ピッチ(θ方向周期)
まず、反射防止機能付光学素子201の表面を走査型電子顕微鏡(SEM:Scanning Electron Microscope)を用いてTop Viewで撮影する。次に、撮影したSEM写真から無作為に単位格子Ucを選び出し、その単位格子Ucの配置ピッチP1、およびトラックピッチTpを測定する(図17B参照)。また、その単位格子Ucの中央に位置する構造体203の底面の面積Sを画像処理により測定する。次に、測定した配置ピッチP1、トラックピッチTp、および底面の面積Sを用いて、以下の式(3)より充填率を求める。
充填率=(S(hex.)/S(unit))×100 ・・・(3)
単位格子面積:S(unit)=P1×2Tp
単位格子内に存在する構造体の底面の面積:S(hex.)=2S
図19Aは、図16に示した撮像光学系の一部を拡大して示す略線図である。図20Aは、図19Aに示した撮像光学系を光線L0が入射する側から見た略線図である。図20Bは、図20Aに示した撮像光学系が有する反射防止機能付光学素子の一部を拡大して表す拡大図である。図19A中、光線L0は被写体からの主光線を表し、光線Lminは反射防止機能付光学素子201に対する入射角が最も小さい光線を表し、光線Lmaxは、反射防止機能付光学素子201に対する入射角が最も大きい光線を表している。また、矩形状の撮像領域A1の長辺に平行な方向をX軸方向、短辺に平行な方向をY軸方向と定義する。また、撮像素子312の撮像面に垂直な方向にZ軸方向と定義する。
図21Aは、ロール原盤の構成の一例を示す斜視図である。図21Bは、図21Aに示したロール原盤の一部を拡大して表す平面図である。図21Cは、図21BのトラックTにおける断面図である。ロール原盤211は、上述した基体表面に複数の構造体203を成形するための原盤である。ロール原盤211は、例えば、円柱状または円筒状の形状を有し、その円柱面または円筒面が基体表面に複数の構造体203を成形するための成形面(回転面)とされる。この成形面には複数の構造体212が2次元配列されている。構造体212は、例えば、成形面に対して凹状を有している。ロール原盤211の材料としては、例えばガラスを用いることができるが、この材料に特に限定されるものではない。
図21Aに示したロール原盤を作製するためのロール原盤露光装置の構成は、上述の第1の実施形態と同様である。
本技術の第9の実施形態に係る反射防止機能付光学素子201の製造方法は、半透過型ミラー202の表面に複数の構造体203を形成する以外のことは上述の第1の実施形態と同様である。
[反射防止機能付光学素子の構成]
図22Aは、本技術の第10の実施形態に係る反射防止機能付光学素子の構成の一例を示す平面図である。図22Bは、図22Aに示した反射防止機能付光学素子の一部を拡大して表す平面図である。図22Cは、図22BのトラックTにおける断面図である。
まず、反射防止機能付光学素子201の表面を走査型電子顕微鏡(SEM:Scanning Electron Microscope)を用いてTop Viewで撮影する。次に、撮影したSEM写真から無作為に単位格子Ucを選び出し、その単位格子Ucの配置ピッチP1、およびトラックピッチTpを測定する(図22B参照)。また、その単位格子Ucに含まれる4つの構造体203のいずれかの底面の面積Sを画像処理により測定する。次に、測定した配置ピッチP1、トラックピッチTp、および底面の面積Sを用いて、以下の式(4)より充填率を求める。
充填率=(S(tetra)/S(unit))×100 ・・・(4)
単位格子面積:S(unit)=2×((P1×Tp)×(1/2))=P1×Tp
単位格子内に存在する構造体の底面の面積:S(tetra)=S
この第10の実施形態において、上記以外のことは、第9の実施形態と同様である。
図23Aは、本技術の第11の実施形態に係る反射防止機能付光学素子の構成の一例を示す平面図である。図23Bは、図23Aに示した反射防止機能付光学素子の一部を拡大して表す平面図である。図23Cは、図23BのトラックTにおける断面図である。
この第11の実施形態において、上記以外のことは、第9の実施形態と同様である。
(第12の実施形態の概要)
第12の実施形態は、以下の検討の結果により案出されたものである。
第9の実施形態において説明したように、本技術者らは、鋭意検討の結果、撮像画像に対する輝線ノイズの発生は、サブ波長構造体の配置ピッチTpの変動に起因するものであることを見出すに至った。そこで、本技術者らは、上述の第9の実施形態とは異なる技術により、線状の輝線ノイズの発生を抑制することを検討した。その結果、サブ波長構造体の列に対して垂直な方向に、サブ波長構造体の配置位置を変動させて、輝点などの光源からの光を2次元的に広げて拡散することにより、輝線ノイズの発生を抑制できることを見出すに至った。
本技術の第12の実施形態に係る撮像装置は、反射防止機能付光学素子表面に形成された構造体203の配置形態以外の点では第9の実施形態と同様である。したがって、以下では、構造体203の配置形態について説明する。
図24Aは、本技術の第12の実施形態に係る反射防止機能付光学素子表面の一部を拡大して表す平面図である。図24Aに示すように、複数の構造体203の中心位置αは、仮想トラックTiを基準としてトラック間方向(列間方向)bに向けて変動している。このように構造体203の中心位置αを変動させることで、輝点などの光源からの光を2次元的に広げて拡散することができる。したがって、撮像画に対する輝線ノイズの発生を抑制することができる。構造体203の中心位置αの変動は、例えば、規則的または不規則的であり、撮像画に対する輝線ノイズの発生を低減する観点からすると、不規則的であることが好ましい。また、構造体203の充填率を向上させる観点からすると、図24Aに示した区画Dのように、各仮想トラックTi間において変動の方向を同期させることが好ましい。
図24Bは、仮想トラックTiの定義を説明するための概略図である。仮想トラックTiは、構造体203の中心位置αの平均位置から求められる仮想的なトラックであり、具体的には以下のようにして求めることができる。
まず、反射防止機能付光学素子の表面を走査型電子顕微鏡(SEM:Scanning Electron Microscope)を用いてTop Viewで撮影する。次に、撮影したSEM写真から、仮想トラックTiを求める構造体203の列を1つ選び出す。次に、選び出した列から10個の構造体203を無作為に選び出す。次に、構造体203の変動方向bに対して垂直な直線Lを設定し、この直線Lを基準として、選び出した各構造体203の中心位置(C1、C2、・・・、C10)を求める。次に、求めた10個の構造体203の中心位置を単純に平均(算術平均)して、構造体203の平均中心位置Cm(=(C1+C2+・・・・+C10)/10)を求める。次に、求めた平均中心位置Cmを通り、かつ、直線Lと平行な直線を求め、この直線を仮想トラックTiとする。なお、原盤作成工程における露光時の問題から、仮想トラックTiのトラックピッチTpは、図24Aに示すように、トラック間で変動している。
図25Aは、構造体の中心位置の変動幅を説明するための概略図である。トラックピッチTpの変動幅ΔTpの最大値をΔTpmaxとした場合、構造体203の中心位置αの変動幅ΔAは、ΔTpmaxよりも大きいことが好ましい。これにより、線状の輝線ノイズの発生を低減することができる。ここで、構造体203の中心位置αの変動幅ΔAは、仮想トラックTiを基準とした変動幅である。
トラックピッチTpの最大変動幅ΔTpmaxは、以下のようにして求めることができる。
まず、反射防止機能付光学素子の表面をSEMを用いてTop Viewで撮影する。次に、撮影したSEM写真から隣接する構造体203の列を1組選び出す。次に、選び出した一組の構造体203の列それぞれについて仮想トラックTiを求める。次に、求めた仮想トラックTi間のトラックピッチTpを求める。上述したトラックピッチTpを求める処理を、撮影したSEM写真から無作為に選び出された10箇所で行う。そして、10箇所で求めたトラックピッチTpを単純に平均(算術平均)して平均トラックピッチTpmを求める。
図25Bは、構造体の変動割合を説明するための概略図である。トラック方向aにおける構造体203の配置ピッチを配置ピッチPとした場合、構造体203の中心位置αは、線状の輝線ノイズの発生を抑制できるような頻度でトラック間方向bに変動していることが好ましい。具体的には、構造体203の中心位置αは、トラック方向aに対して所定距離(所定周期)nP(n:自然数、例えばn=5)以下の距離でトラック間方向bに変動していることが好ましい。より具体的には、構造体203の中心位置αは、トラック方向aに対して所定個数n個(n:自然数、例えばn=5)に1個以上の割合でトラック間方向bに変動していることが好ましい。
図26Aは、構造体の配置形態の第1の例を示す模式図である。図26Aに示すように、第1の例では、構造体203の中心位置αを蛇行するように変動させている。具体的には、構造体203の中心位置αを、ウォブル(蛇行)したトラック(以下ウォブルトラックという。)Tw上に配置している。
反射防止機能付光学素子の表面に入射する入射光の強度Iaの合計に対する、反射防止機能付光学素子の表面により散乱される散乱光Lsの強度Ibの合計の割合(Ib/Ia)が、好ましくは1/500未満、より好ましくは1/5000以下、さらに好ましくは1/105以下の範囲内である。割合(Ib/Ia)を1/500未満とすることで、線状の輝線ノイズの発生を抑制することができる。
(構造体の配置形態)
図27Aは、本技術の第13の実施形態に係る反射防止機能付光学素子表面の一部を拡大して表す平面図である。図27Aに示すように、第13の実施形態は、同一トラック内における構造体203の配置ピッチPが、平均配置ピッチPmに対して変動している点において、第12の実施形態とは異なっている。
図27Bは、構造体の配置ピッチPの変動幅を説明するための概略図である。トラックピッチTpの変動幅ΔTpの最大値をΔTpmaxとした場合、配置ピッチPの変動幅ΔPは、ΔTpmaxよりも大きいことが好ましい。これにより、線状の輝線ノイズの発生を低減することができる。ここで、配置ピッチPの変動幅ΔPは、平均配置ピッチPmを基準とした変動幅である。
平均配置ピッチPmは、以下のようにして求めることができる。
まず、反射防止機能付光学素子の表面をSEMを用いてTop Viewで撮影する。次に、撮影したSEM写真からトラックTを無作為に1つ選び出す。次に、選び出したトラックT上に配置された複数の構造体203から隣接する2つの構造体203を無作為に1組選び出し、トラック方向aの配置ピッチPを求める。上述した配置ピッチPを求める処理を、撮影したSEM写真から無作為に選び出された10箇所で行う。そして、10箇所で求めた配置ピッチPを単純に平均(算術平均)して平均配置ピッチPmを求める。
上述の第9の実施形態では、撮像装置としてデジタルカメラ(デジタルスチルカメラ)に本技術を適用する場合を例として説明したが、本技術の適用例はこれに限定されるものではない。本技術の第14の実施形態では、デジタルビデオカメラに本技術を適用した例について説明する。
図29は、本技術の第15の実施形態に係る撮像装置の構成の一例を示す概略図である。
図29に示すように、第15の実施形態に係る撮像装置300は、光量調整装置314をさらに備えている点において、第9の実施形態とは異なっている。図29では、光量調整装置314がレンズ境筒303に設けられる例が示されているが、光量調整装置314が設けられる位置はこの例に限定されるものではなく、撮像装置本体である筐体301に光量調整装置314が設けられるようにしてもよい。
図30Aは、NDフィルタの構成の一例を示す断面図である。図30Aに示すように、NDフィルタ501は、反射防止機能付NDフィルタ(反射防止機能付光学素子)であって、入射面および出射面を有するNDフィルタ本体(素子本体)502と、NDフィルタ本体502の入射面に設けられた複数のサブ波長構造体503とを備える。NDフィルタ本体502の透過特性を向上する観点からすると、入射面および出射面の両方に複数のサブ波長構造体503を設けることが好ましい。NDフィルタ501は、例えばフィルム状を有している。サブ波長構造体503とNDフィルタ本体502とは、別成形または一体成形されている。サブ波長構造体503とNDフィルタ本体502とが別成形されている場合には、必要に応じてサブ波長構造体503とNDフィルタ本体502との間に基底層504をさらに備えるようにしてもよい。基底層504は、サブ波長構造体503の底面側にサブ波長構造体503と一体成形される層であり、サブ波長構造体503と同様のエネルギー線硬化性樹脂組成物などを硬化してなる。
以下、NDフィルタ501に備えられるNDフィルタ本体502、およびサブ波長構造体503について順次説明する。
NDフィルタ本体502としては、色素および/または顔料を含有するフィルムなどの基体を用いることができる。このような構成を有するNDフィルタ本体502は、例えば、樹脂材料に色素および/または顔料を練り込むことにより形成することができる。色素は、可視光領域に吸収をもつ染料であれば特に制限はないが、例示するならば、フタロシアニン系、チオール金属錯体系、アゾ系、ポリメチン系、ジフェニルメタン系、トリフェニルメタン系、キノン系、アントラキノン系又はジイモニウム塩系などが挙げられる。顔料としては、カーボンブラック、金属酸化物、金属窒化物、および金属窒酸化物から選ばれる少なくとも1種の無機粒子が挙げられる。このような無機粒子としては、具体的には例えば、カーボン粒子、ブラック酸化チタン、アイボリーブラック、ピーチブラック、ランプブラック、ビチューム、アニリン黒など黒色顔料が挙げられる。
サブ波長構造体503は、上述の第9の実施形態における構造体203と同様である。
図29に示すように、レンズ境筒303の光入射側の面、すなわち被写体側の面にフィルタ315を備えるようにしてもよい。フィルタ315は、レンズ境筒303に対して着脱自在の構成を有している。フィルタ315は、入射面および出射面を有するフィルタ本体と、フィルタ本体の入射面に設けられた複数のサブ波長構造体とを備える。フィルタ本体の透過特性を向上する観点からすると、入射面および出射面の両方に複数のサブ波長構造体を設けることが好ましい。サブ波長構造体は、上述の第15の実施形態におけるサブ波長構造体503と同様である。フィルタ315はレンズ境筒303の光入射側の面に装着されるものであれば特に限定されるものではないが、例示するならば、偏光(PL)フィルタ、シャープカット(SC)フィルタ、色彩強調および効果用フィルタ、減光(ND)フィルタ、色温度変換(LB)フィルタ、色補正(CC)フィルタ、ホワイトバランス取得用フィルタ、レンズ保護用フィルタなどが挙げられる。
1.NDフィルタの光学特性
2.トラックピッチと散乱光との関係
3.トラックピッチの変動量と散乱光との関係
(実施例1)
まず、外径126mmのガラスロール原盤を準備し、このガラスロール原盤の表面に以下のようにしてレジスト層を着膜した。すなわち、シンナーでフォトレジストを1/10に希釈し、この希釈レジストをディッピング法によりガラスロール原盤の円柱面上に厚さ70nm程度に塗布することにより、レジスト層を着膜した。次に、記録媒体としてのガラスロール原盤を、図7に示したロール原盤露光装置に搬送し、レジスト層を露光することにより、1つの螺旋状に連なるとともに、隣接する3列のトラック間において六方格子パターンをなす潜像がレジスト層にパターニングされた。
構造体の配列:六方格子
構造体の形状:釣鐘型(ほぼ回転放物面状)
構造体の平均配置ピッチP:250nm
構造体の平均高さH:200nm
構造体のアスペクト比(H/P):0.8
以上により、反射防止機能を有するNDフィルタが得られた。
NDフィルタの両面に複数の構造体を形成せずに、NDフィルタ自体をサンプルとした。
上述のようにして得られた実施例1および比較例1のNDフィルタについて、透過特性および反射特性を以下のようにして評価した。
NDフィルタの可視周辺の波長域(350nm~750nm)での透過スペクトルを、分光光度計(日本分光株式会社製、商品名:V−550)により測定した。その結果を図31Aに示す。
NDフィルタの一方の面に黒色テープを貼り合わせることにより、測定試料を作製した。次に、この測定試料の可視周辺の波長域(350nm~850nm)での反射スペクトルを、分光光度計(日本分光株式会社製、商品名:V−550)により測定した。その結果を図31Bに示す。
図31Bから、構造体をNDフィルムの表面に設けることで、可視周辺の波長域(350nm~850nm)のほぼ全体で、反射率を約4%低減できることがわかる。
RCWA(Rigorous Coupled Wave Analysis)シミュレーションにより、トラックピッチと散乱光との関係について検討を行った。
表面に複数のサブ波長構造体が形成された光学素子を想定し、この光学素子に対して点光源からの光が照射された場合における散乱光の強度分布をシミュレーションにより求めた。
以下に、シミュレーションの条件を示す。
サブ波長構造体の配列:四方格子
トラック方向の配置ピッチP1:250nm
トラックピッチTp:200nm
サブ波長構造体の底面形状:楕円形状
サブ波長構造体の高さ:200nm
構造体形状:放物面形状(釣鐘型)
偏光:無偏光
屈折率:1.5
トラックピッチTpを250nmとしたこと以外は、試験例1−1の場合と同様にして、散乱光の強度分布をシミュレーションにより求めた。
試験例1−1では、散乱光が光軸から遠ざかっており、試験例1−1で想定した光学素子では、試験例1−2で想定した光学素子と比較して、NA<0.8の範囲内において散乱光の強度が小さくなる傾向がある。したがって、試験例1−1の光学素子では、撮像画に画像ノイズ(輝線ノイズ)を低減することができる。
RCWA(Rigorous Coupled Wave Analysis)シミュレーションにより、トラックピッチの変動量およびサブ波長構造体の配列形態と散乱光との関係について検討を行った。
表面に複数のサブ波長構造体が形成された光学素子を想定し、この光学素子に対して点光源からの光が照射された場合における散乱光の強度分布をシミュレーションにより求めた。
以下に、シミュレーションの条件を示す。
サブ波長構造体の配列:四方格子
トラック方向の配置ピッチP1:250nm
トラックピッチTpの中心値:250nm
トラックピッチTpの変動量の最大値:32nm
サブ波長構造体の底面形状:楕円形状
サブ波長構造体の高さ:200nm
構造体形状:放物面形状(釣鐘型)
偏光:無偏光
屈折率:1.5
トラックピッチTpの変動量の最大値を△Tp=8nmとしたこと以外は、試験例2−1の場合と同様にして、散乱光の強度分布をシミュレーションにより求めた。
トラックピッチTpの変動量の最大値を△Tp=8nmとするとともに、トラックをウォブルさせたこと以外は、試験例2−1の場合と同様にして、散乱光の強度分布をシミュレーションにより求めた。
試験例2−1:0.2%(入射光の強度の合計Iaに対する散乱光の強度の合計Ibの割合(Ib/Ia):1/500)
試験例2−2:0.02%(入射光の強度の合計Iaに対する散乱光の強度の合計Ibの割合(Ib/Ia):1/5000)
試験例2−3:0.001%(入射光の強度の合計Iaに対する散乱光の強度の合計Ibの割合(Ib/Ia):1/105)
試験例2−1のシミュレーション結果から、トラックピッチTpの変動量ΔTpの最大値が大きいと、輝線ノイズが発生することがわかった。
なお、本技術は以下のような構成も取ることができる。
(1−1)
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学素子。
(1−2)
上記素子本体の表面に設けられた、凹凸形状の表面を有する形状層をさらに備え、
上記凹凸形状は、上記複数のサブ波長構造体を含み、
上記形状層の表面には、所定のサブ波長構造体パターンを有する単位領域が上記凹凸形状の不整合を生じることなく連続して設けられている(1−1)に記載の光学素子。
(1−3)
上記素子本体は、帯状の形状を有し、
上記素子本体の長手方向に向かって、上記単位領域が連続して設けられている(1−2)に記載の光学素子。
(1−4)
上記凹凸形状の不整合が、上記所定のサブ波長構造体パターンの周期性の乱れである(1−2)~(1−3)のいずれかに記載の光学素子。
(1−5)
上記凹凸形状の不整合が、隣接する単位領域間の重なり、隙間、または、未転写部である(1−2)~(1−3)のいずれかに記載の光学素子。
(1−6)
上記単位領域間は、上記エネルギー線硬化性樹脂組成物の硬化度に不整合を生じることなく繋がっている(1−2)~(1−3)のいずれかに記載の光学素子。
(1−7)
上記エネルギー線硬化性樹脂組成物の硬化度の不整合が、重合度の差である(1−6)に記載の光学素子。
(1−8)
上記サブ波長構造体は、上記素子本体の表面に塗布されたエネルギー線硬化性樹脂組成物を、上記素子本体とは反対の側から硬化反応を進行させることにより形成されている(1−1)~(1−7)のいずれかに記載の光学素子。
(1−9)
上記単位領域は、回転原盤の回転面を1回転することにより形成される転写領域である(1−2)~(1−7)のいずれかに記載の光学素子。
(1−10)
上記サブ波長構造体が格子パターンを形成し、
上記サブ波長構造体が上記表面において複数列のトラックをなすように配置され、
上記格子パターンが、六方格子パターン、準六方格子パターン、四方格子パターンおよび準四方格子パターンの少なくとも1種であり、
上記表面は、入射光の一部を散乱し、
上記散乱した光の強度が、上記入射光の強度に対して1/500未満である(1−1)に記載の光学素子。
(1−11)
上記サブ波長構造体パターンは、凸状または凹状の複数のサブ波長構造体を1次元配列または2次元配列することにより形成されている(1−2)~(1−9)のいずれかに記載の光学素子。
(1−12)
上記複数のサブ波長構造体は、規則的または不規則的に配置されている(1−1)~(1−11)のいずれかに記載の光学素子。
(1−13)
上記素子本体が、少なくとも1つの平面または曲面を有し、
上記平面または曲面に上記形状層が形成されている(1−2)~(1−7)のいずれかに記載の光学素子。
(1−14)
上記サブ波長構造体が上記表面において複数列のトラックをなすように配置され、
上記トラックのピッチTpが、上記トラック間で変動している(1−1)~(1−13)のいずれかに記載の光学素子。
(1−15)
上記サブ波長構造体が格子パターンを形成し、
上記サブ波長構造体が上記表面において複数列のトラックをなすように配置され、
上記格子パターンが、六方格子パターン、準六方格子パターン、四方格子パターンおよび準四方格子パターンの少なくとも1種である(1−1)~(1−14)のいずれかに記載の光学素子。
(1−16)
素子本体の表面にエネルギー線硬化性樹脂組成物を塗布し、
上記素子本体の表面に塗布されたエネルギー線硬化性樹脂組成物に対して回転原盤の回転面を回転密着させながら、上記回転原盤内に設けられたエネルギー線源から放射されたエネルギー線を上記回転面を介して照射し、上記エネルギー線硬化性樹脂組成物を硬化させることにより、上記素子本体の表面に複数のサブ波長構造体を形成する
ことを含み、
上記複数のサブ波長構造体が形成された表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学素子の製造方法。
(1−17)
上記素子本体は、上記エネルギー線に対して不透過性を有する(1−16)記載の光学素子の製造方法。
(1−18)
上記回転面の凹凸形状は、凸状または凹状の複数のサブ波長構造体を1次元配列または2次元配列することにより形成される(1−16)または(1−17)に記載の光学素子の製造方法。
(1−19)
上記複数のサブ波長構造体は、規則的または不規則的に配置されている(1−18)記載の光学素子の製造方法。
(1−20)
上記回転原盤は、ロール原盤またはベルト原盤である(1−16)~(1−19)のいずれかに記載の光学素子の製造方法。
(1−21)
上記エネルギー線源は、上記回転原盤の幅方向に配置されている(1−16)~(1−20)のいずれかに記載の光学素子の製造方法。
(1−22)
上記素子本体は、帯状の形状を有し、
上記サブ波長構造体形成の際には、上記素子本体の長手方向を回転進行方向として上記凹凸形状が転写される(1−16)~(1−21)のいずれかに記載の光学素子の製造方法。
(1−23)
上記素子本体が、少なくとも1つの平面または曲面を有し、
上記平面または曲面に上記形状層が形成される(1−16)~(1−22)のいずれかに記載の光学素子の製造方法。
(1−24)
光学素子と、
上記光学素子を介して光を受光する撮像領域を有する撮像素子と
を備え、
上記光学素子は、
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学系。
(1−25)
上記散乱光のうち上記撮像領域に到達する成分の総和が、上記撮像領域外に到達する成分の総和より小さい(1−24)に記載の光学系。
(1−26)
上記散乱光の強度分布が、異方性を有する(1−24)または(1−25)に記載の光学系。
(1−27)
上記散乱光の強度分布が、開口数NAによって異なる(1−24)~(1−26)のいずれかに記載の光学系。
(1−28)
上記散乱光の強度分布の単位立体角当たりの強度が、開口数NA>0.8の範囲よりも開口数NA≦0.8の範囲にて小さい(1−24)~(1−27)のいずれかに記載の光学系。
(1−29)
上記撮像領域における上記散乱光の強度分布の最大値が、上記撮像領域の外側の領域における上記散乱光の強度分布の最大値より小さい(1−24)~(1−28)のいずれかに記載の光学系。
(1−30)
上記複数のサブ波長構造体が、上記光学素子の表面において複数の列をなすように配列され、
上記区画では、上記列のピッチPが基準ピッチPに比して変化している(1−24)~(1−29)のいずれかに記載の光学系。
(1−31)
上記列の形状が、直線状または円弧状である(1−30)に記載の光学系。
(1−32)
上記複数のサブ波長構造体が、格子パターンを形成し、
上記格子パターンが、六方格子パターン、準六方格子パターン、四方格子パターンおよび準四方格子パターンの少なくとも1種である(1−24)~(1−31)のいずれかに記載の光学系。
(1−33)
上記撮像領域が、対向する2組の辺を有する矩形状を有し、
上記列の方向と、上記2組の辺のうちの一方の組の辺の延在方向とが平行である(1−30)に記載の光学系。
(1−34)
上記2組の辺が、対向する1組の短辺と、対向する1組の長辺とからなり、
上記列の方向と、上記長辺の延在方向とが平行である(1−33)に記載の光学系。
(1−35)
光学素子と、上記光学素子を介して光を受光する撮像領域を有する撮像素子とを含む光学系を備え、
上記光学素子は、
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する撮像装置。
(1−36)
光学素子と、上記光学素子を介して光を受光する撮像領域を有する撮像素子とを含む光学系を備え、
上記光学素子は、
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学装置。
(1−37)
複数のサブ波長構造体を形成するための回転面を有し、
素子本体の表面に塗布されたエネルギー線硬化性樹脂組成物に対して上記回転面を回転密着させながら、上記回転面の内側に設けられたエネルギー線源から放射されたエネルギー線を上記回転面を介して照射し、上記エネルギー線硬化性樹脂組成物を硬化させることにより、サブ波長構造体が表面に設けられた光学素子が得られ、
上記複数のサブ波長構造体が設けられた光学素子表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する原盤。
(1−38)
複数のサブ波長構造体が設けられた回転面を有し、
上記回転面はエネルギー線を透過可能に構成され、
上記複数のサブ波長構造体が設けられた回転面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する原盤。
(2−1)凹凸形状を有する回転面と、
上記回転面の内側に設けられたエネルギー線源と
を有する回転原盤を備え、
上記回転原盤は、上記エネルギー線源から放射されたエネルギー線に対して透過性を有し、
素子本体上に塗布されたエネルギー線硬化性樹脂組成物に対して上記回転原盤の回転面を回転密着させながら、上記エネルギー線源から放射されたエネルギー線を上記回転面を介して照射し、上記エネルギー線硬化性樹脂組成物を硬化させることにより、上記回転面の凹凸形状が転写された形状層を上記素子本体上に形成する転写装置。
(2−2)
凹凸形状を有する回転面を備え、
エネルギー線源から放射されたエネルギー線に対して透過性を有し、
上記エネルギー線源から放射されたエネルギー線を、上記回転面を介してエネルギー線硬化性樹脂組成物に対して照射し硬化可能とし得る原盤。
(3−1)表面を有する素子本体と、
前記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を硬化してなり、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
前記複数のサブ波長構造体は、前記表面において複数の列を形成し、
前記サブ波長構造体の中心位置が、列間方向に向けて変動している光学素子。
ここで、光学素子は、反射防止機能を有する光学素子である。素子本体は、サブ波長構造体により反射防止機能を付与する光学素子本体である。光学素子本体としては、例えば、レンズ、フィルタ(例えばNDフィルタ)、半透過型ミラー、調光素子、プリズム、偏光素子などが挙げられるが、これに限定されるものではない。
(3−2)前記変動が不規則的な変動である前記(3−1)記載の光学素子。
(3−3)列間ピッチの変動幅ΔTpの最大値をΔTpmaxとした場合、前記サブ波長構造体の中心位置が、列間方向に向けてΔTpmaxよりも大きな大きさで変動している前記(3−1)または(3−2)に記載の光学素子。
(3−4)前記列が蛇行している前記(3−1)または(3−2)に記載の光学素子。
(3−5)前記列の蛇行の周期および振幅の少なくとも一方が、不規則である前記(3−4)に記載の光学素子。
(3−6)前記サブ波長構造体の個々の中心位置が独立に、列間方向に向けて変動している前記(3−1)または(3−2)に記載の光学素子。
(3−7)前記列方向に隣接する前記サブ波長構造体がブロックを形成し、該ブロックを単位として前記サブ波長構造体の中心位置が列間方向に向けて変動している前記(3−1)または(3−2)に記載の光学素子。
前記素子本体の表面に形成された複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を硬化してなり、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
前記複数のサブ波長構造体は、前記表面において複数の例を形成し、
同一列内における前記サブ波長構造体の配置ピッチPが、平均配置ピッチPmに対して変動している光学素子。
(3−9)前記変動が、不規則的な変動である前記(3−8)記載の光学素子。
(3−10)前記列間ピッチの変動幅の最大値をΔTpmaxとした場合、前記平均配置ピッチPmに対する前記配置ピッチPの変動幅ΔPが、ΔTpmaxよりも大きな大きさで変動している前記(3−8)または(3−9)に記載の光学素子。
(3−11)前記サブ波長構造体の個々の配置ピッチPが独立に、列方向に向けて変動している前記(3−8)または(3−9)に記載の光学素子。
(3−12)前記列方向に隣接する前記サブ波長構造体がブロックを形成し、該ブロックを単位として前記サブ波長構造体の配置ピッチPが列方向に向けて変動している前記(3−8)または(3−9)に記載の光学素子。
前記光学素子は、
表面を有する素子本体と、
前記素子本体の表面に形成された複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を硬化してなり、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
前記複数のサブ波長構造体は、前記表面において複数の例を形成し、
前記サブ波長構造体の中心位置が、列間方向に向けて変動している光学系。
(3−14)前記変動が不規則的な変動である(3−13)記載の光学系。
(3−15)前記列間ピッチの変動幅ΔTpの最大値をΔTpmaxとした場合、前記サブ波長構造体の中心位置が、列間方向に向けてΔTpmaxよりも大きな大きさで変動している前記(3−13)または(3−14)に記載の光学系。
(3−16)前記列が蛇行している前記(3−13)または(3−14)に記載の光学系。
(3−17)前記列の蛇行の周期および振幅の少なくとも一方が、不規則である前記(3−16)に記載の光学系。
(3−18)前記サブ波長構造体の個々の中心位置が独立に、列間方向に向けて変動している前記(3−13)または(3−14)に記載の光学系。
(3−19)前記列方向に隣接する前記サブ波長構造体がブロックを形成し、該ブロックを単位として前記サブ波長構造体の中心位置が列間方向に向けて変動している前記(3−13)または(3−14)に記載の光学系。
(3−20)前記光学素子を介して光を受光する撮像素子をさらに備える前記(3−13)~(3−19)のいずれか1項に記載の光学系。
前記光学素子は、
表面を有する素子本体と、
前記素子本体の表面に形成された複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を硬化してなり、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
同一列内における前記サブ波長構造体の配置ピッチPが、平均配置ピッチPmに対して変動している光学系。
(3−22)前記変動が、不規則的な変動である前記(3−21)記載の光学系。
(3−23)前記列間ピッチの変動幅の最大値をΔTpmaxとした場合、前記平均配置ピッチPmに対する前記配置ピッチPの変動幅ΔPが、ΔTpmaxよりも大きな大きさで変動している前記(3−21)または(3−22)に記載の光学系。
(3−24)前記サブ波長構造体の個々の配置ピッチPが独立に、列方向に向けて変動している前記(3−21)または(3−22)に記載の光学系。
(3−25)前記列方向に隣接する前記サブ波長構造体がブロックを形成し、該ブロックを単位として前記サブ波長構造体の配置ピッチPが列方向に向けて変動している前記(3−21)または(3−22)に記載の光学系。
(3−26)前記光学素子を介して光を受光する撮像素子をさらに備える前記(3−21)~(3−25)のいずれか1項に記載の光学系。
(3−28)前記(3−13)~(3−26)のいずれか1項に記載された光学系を備える光学機器。
前記複数のサブ波長構造体は、前記表面において複数の例を形成し、
前記サブ波長構造体の中心位置が、列間方向に向けて変動している原盤。
(3−30)前記変動が不規則的な変動である(3−29)記載の原盤。
(3−31)前記列間ピッチの変動幅ΔTpの最大値をΔTpmaxとした場合、前記サブ波長構造体の中心位置が、列間方向に向けてΔTpmaxよりも大きな大きさで変動している前記(3−29)または(3−30)に記載の原盤。
(3−32)前記列が蛇行している前記(3−29)または(3−30)に記載の原盤。
(3−33)前記列の蛇行の周期および振幅の少なくとも一方が、不規則である前記(3−32)に記載の原盤。
(3−34)前記サブ波長構造体の個々の中心位置が独立に、列間方向に向けて変動している前記(3−29)または(3−30)に記載の原盤。
(3−35)前記列方向に隣接する前記サブ波長構造体がブロックを形成し、該ブロックを単位として前記サブ波長構造体の中心位置が列間方向に向けて変動している前記(3−29)または(3−30)に記載の原盤。
前記複数のサブ波長構造体は、前記表面において複数の例を形成し、
同一列内における前記サブ波長構造体の配置ピッチPが、平均配置ピッチPmに対して変動している原盤。
(3−37)前記変動が、不規則的な変動である前記(3−36)記載の原盤。
(3−38)前記列間ピッチの変動幅の最大値をΔTpmaxとした場合、前記平均配置ピッチPmに対する前記配置ピッチPの変動幅ΔPが、ΔTpmaxよりも大きな大きさで変動している前記(3−36)または(3−37)に記載の原盤。
(3−39)前記サブ波長構造体の個々の配置ピッチPが独立に、列方向に向けて変動している前記(3−36)または(3−37)に記載の原盤。
(3−40)前記列方向に隣接する前記サブ波長構造体がブロックを形成し、該ブロックを単位として前記サブ波長構造体の配置ピッチPが列方向に向けて変動している前記(3−36)または(3−37)に記載の原盤。
2 構造体
11a 不透過層
11b 透過層
21 構造体
22 基底層
101 ロール原盤
102 構造体
110 エネルギー線源
118 エネルギー線硬化性樹脂組成物
133 エンボスベルト
136 平坦ベルト
201 反射防止機能付光学素子
202 半透過型ミラー
203、212 構造体
204 基底層
211 ロール原盤
213 レジスト層
214 レーザー光
216 潜像
300 撮像装置
301 筐体
302 撮像光学系
311 レンズ
312 撮像素子
Sp 成形面
Si 裏面
A1 撮像領域
Claims (21)
- 素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学素子。 - 上記素子本体の表面に設けられた、凹凸形状の表面を有する形状層をさらに備え、
上記凹凸形状は、上記複数のサブ波長構造体を含み、
上記形状層の表面には、所定のサブ波長構造体パターンを有する単位領域が上記凹凸形状の不整合を生じることなく連続して設けられている請求項1に記載の光学素子。 - 上記素子本体は、帯状の形状を有し、
上記素子本体の長手方向に向かって、上記単位領域が連続して設けられている請求項2に記載の光学素子。 - 上記凹凸形状の不整合が、上記所定のサブ波長構造体パターンの周期性の乱れである請求項2に記載の光学素子。
- 上記凹凸形状の不整合が、隣接する単位領域間の重なり、隙間、または、未転写部である請求項2に記載の光学素子。
- 上記単位領域間は、上記エネルギー線硬化性樹脂組成物の硬化度に不整合を生じることなく繋がっており、
上記エネルギー線硬化性樹脂組成物の硬化度の不整合が、重合度の差である請求項2に記載の光学素子。 - 上記サブ波長構造体は、上記素子本体の表面に塗布されたエネルギー線硬化性樹脂組成物を、上記素子本体とは反対の側から硬化反応を進行させることにより形成されている請求項1に記載の光学素子。
- 上記サブ波長構造体が上記表面において複数列のトラックをなすように配置され、
上記トラックのピッチTpが、上記トラック間で変動している請求項1に記載の光学素子。 - 上記サブ波長構造体が格子パターンを形成し、
上記サブ波長構造体が上記表面において複数列のトラックをなすように配置され、
上記格子パターンが、六方格子パターン、準六方格子パターン、四方格子パターンおよび準四方格子パターンの少なくとも1種であり、
上記表面は、入射光の一部を散乱し、
上記散乱した光の強度が、上記入射光の強度に対して1/500未満である請求項1に記載の光学素子。 - 素子本体の表面にエネルギー線硬化性樹脂組成物を塗布し、
上記素子本体の表面に塗布されたエネルギー線硬化性樹脂組成物に対して回転原盤の回転面を回転密着させながら、上記回転原盤内に設けられたエネルギー線源から放射されたエネルギー線を上記回転面を介して照射し、上記エネルギー線硬化性樹脂組成物を硬化させることにより、上記素子本体の表面に複数のサブ波長構造体を形成する
ことを含み、
上記複数のサブ波長構造体が形成された表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学素子の製造方法。 - 光学素子と、
上記光学素子を介して光を受光する撮像領域を有する撮像素子と
を備え、
上記光学素子は、
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学系。 - 上記散乱光のうち上記撮像領域に到達する成分の総和が、上記撮像領域外に到達する成分の総和より小さい請求項11に記載の光学系。
- 上記散乱光の強度分布が、開口数NAによって異なる請求項11に記載の光学系。
- 上記散乱光の強度分布の単位立体角当たりの強度が、開口数NA>0.8の範囲よりも開口数NA≦0.8の範囲にて小さい請求項13に記載の光学系。
- 上記撮像領域における上記散乱光の強度分布の最大値が、上記撮像領域の外側の領域における上記散乱光の強度分布の最大値より小さい請求項11に記載の光学系。
- 上記複数のサブ波長構造体が、上記光学素子の表面において複数の列をなすように配列され、
上記区画では、上記列のピッチPが基準ピッチPに比して変化している請求項11に記載の光学系。 - 上記撮像領域が、対向する2組の辺を有する矩形状を有し、
上記列の方向と、上記2組の辺のうちの一方の組の辺の延在方向とが平行である請求項16に記載の光学系。 - 上記2組の辺が、対向する1組の短辺と、対向する1組の長辺とからなり、
上記列の方向と、上記長辺の延在方向とが平行である請求項17に記載の光学系。 - 光学素子と、上記光学素子を介して光を受光する撮像領域を有する撮像素子とを含む光学系を備え、
上記光学素子は、
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する撮像装置。 - 光学素子と、上記光学素子を介して光を受光する撮像領域を有する撮像素子とを含む光学系を備え、
上記光学素子は、
素子本体と、
上記素子本体の表面に設けられた複数のサブ波長構造体と
を備え、
上記サブ波長構造体は、エネルギー線硬化性樹脂組成物を含み、
上記素子本体は、上記エネルギー線硬化性樹脂組成物を硬化させるためのエネルギー線に対して不透過性を有し、
上記複数のサブ波長構造体が設けられた表面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する光学装置。 - 複数のサブ波長構造体が設けられた回転面を有し、
上記回転面はエネルギー線を透過可能に構成され、
上記複数のサブ波長構造体が設けられた回転面は、入射光を散乱し、散乱光を発生させる区画を有し、
上記散乱した光の強度分布が、異方性を有する原盤。
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CN201380015491.0A CN104185800A (zh) | 2012-03-28 | 2013-03-08 | 光学元件及其制造方法、光学系统、成像装置、光学仪器和母盘 |
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CN104816099A (zh) * | 2015-05-21 | 2015-08-05 | 深圳英诺激光科技有限公司 | 一种亚波长增透结构的制备装置及其方法 |
CN107102509B (zh) * | 2016-02-19 | 2020-05-26 | 台湾扬昕股份有限公司 | 投影屏幕 |
CN105866876B (zh) * | 2016-06-14 | 2018-03-16 | 京东方科技集团股份有限公司 | 一种偏光层的制备方法、显示基板组件、显示面板 |
JP2018125377A (ja) * | 2017-01-31 | 2018-08-09 | 東芝メモリ株式会社 | インプリント装置および半導体装置の製造方法 |
CN110383114B (zh) * | 2017-02-24 | 2020-12-29 | 富士胶片株式会社 | 透镜、变焦镜头及成像镜头 |
US12085692B2 (en) | 2019-04-26 | 2024-09-10 | Huawei Technologies Co., Ltd. | Antireflection film, optical element, camera module, and terminal |
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US20120070623A1 (en) * | 2010-09-17 | 2012-03-22 | Sony Corporation | Manufacturing method of laminated body, stamper, transfer device, laminated body, molding element, and optical element |
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