JP6070056B2 - 物理量検出デバイス、物理量検出器、電子機器、及び移動体 - Google Patents
物理量検出デバイス、物理量検出器、電子機器、及び移動体 Download PDFInfo
- Publication number
- JP6070056B2 JP6070056B2 JP2012234484A JP2012234484A JP6070056B2 JP 6070056 B2 JP6070056 B2 JP 6070056B2 JP 2012234484 A JP2012234484 A JP 2012234484A JP 2012234484 A JP2012234484 A JP 2012234484A JP 6070056 B2 JP6070056 B2 JP 6070056B2
- Authority
- JP
- Japan
- Prior art keywords
- physical quantity
- quantity detection
- base
- detection device
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001514 detection method Methods 0.000 title claims description 147
- 239000000463 material Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 8
- 230000001133 acceleration Effects 0.000 description 16
- 239000010931 gold Substances 0.000 description 12
- 230000000644 propagated effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- -1 silver halide Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Landscapes
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012234484A JP6070056B2 (ja) | 2012-10-24 | 2012-10-24 | 物理量検出デバイス、物理量検出器、電子機器、及び移動体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012234484A JP6070056B2 (ja) | 2012-10-24 | 2012-10-24 | 物理量検出デバイス、物理量検出器、電子機器、及び移動体 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014085233A JP2014085233A (ja) | 2014-05-12 |
JP2014085233A5 JP2014085233A5 (enrdf_load_stackoverflow) | 2015-12-03 |
JP6070056B2 true JP6070056B2 (ja) | 2017-02-01 |
Family
ID=50788417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012234484A Expired - Fee Related JP6070056B2 (ja) | 2012-10-24 | 2012-10-24 | 物理量検出デバイス、物理量検出器、電子機器、及び移動体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6070056B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019145683A (ja) | 2018-02-21 | 2019-08-29 | セイコーエプソン株式会社 | 電子回路基板、加速度センサー、傾斜計、慣性航法装置、構造物監視装置及び移動体 |
JP7087479B2 (ja) | 2018-03-09 | 2022-06-21 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーデバイス、物理量センサーデバイスを用いた傾斜計、慣性計測装置、構造物監視装置、及び移動体 |
JP2019158476A (ja) | 2018-03-09 | 2019-09-19 | セイコーエプソン株式会社 | 物理量センサーデバイス、物理量センサーデバイスを用いた傾斜計、慣性計測装置、構造物監視装置、及び移動体 |
JP2019184453A (ja) | 2018-04-12 | 2019-10-24 | セイコーエプソン株式会社 | センサーユニットおよび構造物監視装置 |
JP2020067330A (ja) | 2018-10-23 | 2020-04-30 | セイコーエプソン株式会社 | 慣性センサーユニットの取り付け方法、および慣性センサーユニット |
JP7331468B2 (ja) * | 2019-05-31 | 2023-08-23 | セイコーエプソン株式会社 | 慣性センサーユニットの取り付け方法、および慣性センサーユニット |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009085808A (ja) * | 2007-10-01 | 2009-04-23 | Epson Toyocom Corp | 加速度センサ及び加速度測定装置 |
JP2010226420A (ja) * | 2009-03-24 | 2010-10-07 | Seiko Epson Corp | 圧電デバイス |
US8176617B2 (en) * | 2010-03-31 | 2012-05-15 | Honeywell International Inc. | Methods for making a sensitive resonating beam accelerometer |
-
2012
- 2012-10-24 JP JP2012234484A patent/JP6070056B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2014085233A (ja) | 2014-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6070056B2 (ja) | 物理量検出デバイス、物理量検出器、電子機器、及び移動体 | |
JP5807413B2 (ja) | 電子デバイス用パッケージ、電子デバイスおよび電子機器 | |
US10228385B2 (en) | Substrate for sensor, physical quantity detection sensor, acceleration sensor, electronic apparatus, and moving object | |
JP6435596B2 (ja) | 振動素子、振動デバイス、電子機器、および移動体 | |
US20190257652A1 (en) | Physical quantity detection device, inclinometer, inertial measurement unit, electronic apparatus, vehicle, and structure monitoring system | |
JP6318550B2 (ja) | 振動片、角速度センサー、電子機器および移動体 | |
JP2014240762A (ja) | 物理量検出センサー、加速度センサー、電子機器、および移動体 | |
US9048418B2 (en) | Sensor element, sensor device, and electronic apparatus | |
JP6255903B2 (ja) | 角速度センサー、電子機器および移動体 | |
JP6167474B2 (ja) | センサーデバイスおよび電子機器 | |
US9998093B2 (en) | Resonator device, electronic apparatus, and moving object | |
JP2015090275A (ja) | 振動素子の製造方法 | |
JP2015046666A (ja) | 振動素子、発振器、センサー、電子機器及び移動体 | |
JP6498379B2 (ja) | 振動素子、振動子、発振器、電子機器および移動体 | |
JP2016065860A (ja) | 振動デバイス、電子機器および移動体 | |
JP6264839B2 (ja) | 振動素子、振動子、発振器、電子機器および移動体 | |
JP2015118027A (ja) | 振動素子、電子デバイス、電子機器および移動体 | |
JP2014085232A (ja) | 物理量検出デバイス、物理量検出器、電子機器、及び移動体 | |
JP2015179933A (ja) | 振動素子、ジャイロセンサー素子、電子デバイス、電子機器および移動体 | |
JP2016017768A (ja) | センサー素子、センサーデバイス、電子機器および移動体 | |
JP2014107316A (ja) | 蓋体、パッケージ、電子デバイス、電子機器、移動体、および電子デバイスの製造方法 | |
JP6492536B2 (ja) | センサー素子、物理量センサー、電子機器および移動体 | |
JP6264842B2 (ja) | 振動素子、振動子、発振器、電子機器および移動体 | |
US20200298350A1 (en) | Electronic device manufacturing method, electronic device, electronic apparatus, and vehicle | |
JP2016061710A (ja) | 振動素子、ジャイロ素子、電子デバイス、電子機器、および移動体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20150108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151019 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151019 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20160610 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20160624 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160707 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160719 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160805 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161206 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161219 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6070056 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |