JP6058119B2 - テスト用マイクロエレクトロニクス基板の両面に結合可能なトランスレータ、ならびに関連するシステムおよび方法 - Google Patents

テスト用マイクロエレクトロニクス基板の両面に結合可能なトランスレータ、ならびに関連するシステムおよび方法 Download PDF

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Publication number
JP6058119B2
JP6058119B2 JP2015505804A JP2015505804A JP6058119B2 JP 6058119 B2 JP6058119 B2 JP 6058119B2 JP 2015505804 A JP2015505804 A JP 2015505804A JP 2015505804 A JP2015505804 A JP 2015505804A JP 6058119 B2 JP6058119 B2 JP 6058119B2
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Prior art keywords
translator
substrate
microelectronic substrate
signal
microelectronic
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JP2015514226A5 (https=
JP2015514226A (ja
Inventor
ティー．ジョンソン モーガン
ティー．ジョンソン モーガン
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トランスラリティー インコーポレイテッド
トランスラリティー インコーポレイテッド
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2015505804A 2012-04-09 2013-04-04 テスト用マイクロエレクトロニクス基板の両面に結合可能なトランスレータ、ならびに関連するシステムおよび方法 Active JP6058119B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261621954P 2012-04-09 2012-04-09
US61/621,954 2012-04-09
US13/840,937 2013-03-15
US13/840,937 US8779789B2 (en) 2012-04-09 2013-03-15 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
PCT/US2013/035286 WO2013154909A1 (en) 2012-04-09 2013-04-04 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Publications (3)

Publication Number Publication Date
JP2015514226A JP2015514226A (ja) 2015-05-18
JP2015514226A5 JP2015514226A5 (https=) 2016-04-21
JP6058119B2 true JP6058119B2 (ja) 2017-01-11

Family

ID=49291807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015505804A Active JP6058119B2 (ja) 2012-04-09 2013-04-04 テスト用マイクロエレクトロニクス基板の両面に結合可能なトランスレータ、ならびに関連するシステムおよび方法

Country Status (8)

Country Link
US (2) US8779789B2 (https=)
EP (1) EP2837023A4 (https=)
JP (1) JP6058119B2 (https=)
KR (1) KR20150007305A (https=)
CN (1) CN104350588B (https=)
SG (1) SG11201406383RA (https=)
TW (1) TWI551869B (https=)
WO (1) WO2013154909A1 (https=)

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US8779789B2 (en) * 2012-04-09 2014-07-15 Advanced Inquiry Systems, Inc. Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
FR3032038B1 (fr) 2015-01-27 2018-07-27 Soitec Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat
CN106154596A (zh) * 2015-04-08 2016-11-23 上海纪显电子科技有限公司 光电显示装置、检测装置及其方法
US9794009B1 (en) * 2016-06-30 2017-10-17 Litepoint Corporation Method for testing a radio frequency (RF) data packet signal transceiver for proper implicit beamforming operation
US11791326B2 (en) * 2021-05-10 2023-10-17 International Business Machines Corporation Memory and logic chip stack with a translator chip

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Also Published As

Publication number Publication date
EP2837023A1 (en) 2015-02-18
WO2013154909A1 (en) 2013-10-17
KR20150007305A (ko) 2015-01-20
US9222965B2 (en) 2015-12-29
TW201350880A (zh) 2013-12-16
SG11201406383RA (en) 2014-11-27
US8779789B2 (en) 2014-07-15
EP2837023A4 (en) 2016-01-13
CN104350588B (zh) 2017-04-05
US20150015299A1 (en) 2015-01-15
JP2015514226A (ja) 2015-05-18
CN104350588A (zh) 2015-02-11
US20130265071A1 (en) 2013-10-10
TWI551869B (zh) 2016-10-01

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