KR20150007305A - 테스트를 하기 위한 마이크로 전자 기판들의 대향하는 표면들에 결합가능한 트랜슬레이터들, 및 관련 시스템들과 방법들 - Google Patents

테스트를 하기 위한 마이크로 전자 기판들의 대향하는 표면들에 결합가능한 트랜슬레이터들, 및 관련 시스템들과 방법들 Download PDF

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Publication number
KR20150007305A
KR20150007305A KR1020147031469A KR20147031469A KR20150007305A KR 20150007305 A KR20150007305 A KR 20150007305A KR 1020147031469 A KR1020147031469 A KR 1020147031469A KR 20147031469 A KR20147031469 A KR 20147031469A KR 20150007305 A KR20150007305 A KR 20150007305A
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KR
South Korea
Prior art keywords
translator
microelectronic substrate
substrate
signal
accessing
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Ceased
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KR1020147031469A
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English (en)
Korean (ko)
Inventor
머건 티. 존슨
Original Assignee
어드밴스드 인쿼리 시스템즈, 인크.
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Application filed by 어드밴스드 인쿼리 시스템즈, 인크. filed Critical 어드밴스드 인쿼리 시스템즈, 인크.
Publication of KR20150007305A publication Critical patent/KR20150007305A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020147031469A 2012-04-09 2013-04-04 테스트를 하기 위한 마이크로 전자 기판들의 대향하는 표면들에 결합가능한 트랜슬레이터들, 및 관련 시스템들과 방법들 Ceased KR20150007305A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261621954P 2012-04-09 2012-04-09
US61/621,954 2012-04-09
US13/840,937 2013-03-15
US13/840,937 US8779789B2 (en) 2012-04-09 2013-03-15 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
PCT/US2013/035286 WO2013154909A1 (en) 2012-04-09 2013-04-04 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

Publications (1)

Publication Number Publication Date
KR20150007305A true KR20150007305A (ko) 2015-01-20

Family

ID=49291807

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147031469A Ceased KR20150007305A (ko) 2012-04-09 2013-04-04 테스트를 하기 위한 마이크로 전자 기판들의 대향하는 표면들에 결합가능한 트랜슬레이터들, 및 관련 시스템들과 방법들

Country Status (8)

Country Link
US (2) US8779789B2 (https=)
EP (1) EP2837023A4 (https=)
JP (1) JP6058119B2 (https=)
KR (1) KR20150007305A (https=)
CN (1) CN104350588B (https=)
SG (1) SG11201406383RA (https=)
TW (1) TWI551869B (https=)
WO (1) WO2013154909A1 (https=)

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US8779789B2 (en) * 2012-04-09 2014-07-15 Advanced Inquiry Systems, Inc. Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
FR3032038B1 (fr) 2015-01-27 2018-07-27 Soitec Procede, dispositif et systeme de mesure d'une caracteristique electrique d'un substrat
CN106154596A (zh) * 2015-04-08 2016-11-23 上海纪显电子科技有限公司 光电显示装置、检测装置及其方法
US9794009B1 (en) * 2016-06-30 2017-10-17 Litepoint Corporation Method for testing a radio frequency (RF) data packet signal transceiver for proper implicit beamforming operation
US11791326B2 (en) * 2021-05-10 2023-10-17 International Business Machines Corporation Memory and logic chip stack with a translator chip

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US5567654A (en) 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
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US6897666B2 (en) 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
US6853205B1 (en) 2003-07-17 2005-02-08 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
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Also Published As

Publication number Publication date
EP2837023A1 (en) 2015-02-18
WO2013154909A1 (en) 2013-10-17
US9222965B2 (en) 2015-12-29
TW201350880A (zh) 2013-12-16
SG11201406383RA (en) 2014-11-27
US8779789B2 (en) 2014-07-15
EP2837023A4 (en) 2016-01-13
CN104350588B (zh) 2017-04-05
US20150015299A1 (en) 2015-01-15
JP2015514226A (ja) 2015-05-18
JP6058119B2 (ja) 2017-01-11
CN104350588A (zh) 2015-02-11
US20130265071A1 (en) 2013-10-10
TWI551869B (zh) 2016-10-01

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